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Computing chip (T/X/C series) development计算芯片（T/X/C系列）研发
101 · 2024-01-02 → 2026-08-06
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Development and iteration of the T-series, X-series, and C-series computing chips for smart video, AIoT, and robotics applications.面向智能视频、AIoT和机器人应用的T系列、X系列和C系列计算芯片的研发与迭代。
2024-01-02Ingenic confirmed that the T50 chip is still under development.北京君正确认T50芯片尚在研发中。
2024-01-11Ingenic Semiconductor confirmed it already has a 1T computing power chip (1T NPU) in its product lineup.北京君正确认已有1T算力芯片（1T NPU）在售。
2024-01-15Ingenic stated that Hefei Ingenic's AI technology focuses on edge AI for smart camera products.北京君正表示合肥君正的AI技术主要围绕智能摄像头端级产品的AI需求。
2024-01-23Ingenic disclosed it has developed a RISC-V large core comparable to ARM A53, while its Victory1 CPU does not reach A53 performance.北京君正披露已研发对标ARM A53的RISC-V大核，而Victory1小核未达到A53性能。
2024-01-31Ingenic stated its 21nm process chip is under research and development.北京君正表示21nm工艺芯片正在研发中。
2024-02-21Ingenic Semiconductor stated that its AI technology mainly focuses on AI needs of smart camera edge products.北京君正表示，公司AI技术主要围绕智能摄像头端级产品的AI需求。
2024-02-23Ingenic Semiconductor stated its edge AI products can meet various customer needs in the security industry.北京君正表示其端侧AI产品可满足安防行业不同客户的多种需求。
2024-02-29Ingenic Semiconductor stated that its RISC-V CPU cores (comparable to ARM A53/A55 series) are under R&D and optimization.北京君正表示其对标ARM A53/A55系列的RISC-V CPU核正在研发和优化中。
2024-03-08Xinruishi launched the R2 pet companion robot based on Ingenic's high-performance AI vision chip (1.2 TOPS), featuring pet recognition, tracking, and interactive functions.芯睿视基于北京君正高性能AI视觉芯片（1.2 TOPS）推出R2宠物陪伴机器人，具备宠物识别、跟踪及互动功能。
2024-03-11Ingenic confirmed its AI technology is mainly applied in the IPC (IP camera) product market.北京君正确认其AI技术主要应用于IPC（网络摄像机）产品市场。
2024-03-26Ingenic confirmed its AI computing engine and AI algorithms have been deployed on its chips, and it is actively expanding market presence.北京君正确认其AI算力引擎和AI算法已应用于芯片上，并积极进行市场布局。
2024-03-29Ingenic confirmed that its chips have inference capability at the terminal level.北京君正确认其芯片在终端算力上具有推理能力。
2024-04-07Shenzhen Xinruishi Technology launched the RS-W33 three-lens camera based on Ingenic's T23 chip, featuring ultra-low power consumption (240mW typical), AI ISP, and 24/7 recording.深圳芯睿视科技基于北京君正T23芯片推出RS-W33三目摄像机，具备超低功耗（典型240mW）、AI ISP和全天候录像功能。
2024-04-12Ingenic's AOV (Always on Video) ultra-low-power continuous imaging technology was applied on the T41 flagship chip; Hangzhou Mairui Technology launched a 24-hour recording product based on T41.北京君正AOV超低功耗持续成像技术在T41旗舰芯片上应用；杭州觅睿科技基于T41推出24小时录像产品。
2024-04-17Ingenic confirmed that the C200 chip is in iterative tape-out.北京君正确认C200芯片正在迭代投片。
2024-04-26Ingenic stated that its AI computing engine and AI algorithms have been applied to its chips.北京君正表示，公司的AI算力引擎和AI算法已应用于芯片上。
2024-06-24Ingenic Semiconductor reported that its self-developed AI computing engine (NPU) is integrated into its chip products, with increasing processing capability and enriched AI algorithms, offering chips with varying intelligence levels for different market needs.北京君正表示自研AI算力引擎（NPU）内置于芯片产品中，处理能力增强，AI算法丰富，针对不同市场推出不同智能化程度的芯片。
2024-07-18Ingenic Semiconductor expects its home-use laser sweeping robot to enter mass production in the second half of the year.北京君正预计家用激光扫地机下半年进入规模量产阶段。
2024-08-31Registered 3 new software copyrights: Junzheng DPU-based display sync interaction software V1.0, Junzheng LVGL home panel interaction software V1.0, Junzheng X2670 system-level test software V1.0.新注册3项软件著作权：《君正基于DPU的显示同步交互软件V1.0》、《君正LVGL家居面板交互软件V1.0》、《君正X2670系统级测试软件V1.0》。
2024-09-12Ingenic Semiconductor announced that its 21nm process product samples are expected to be launched in the second half of 2024, and 20nm products are under development.北京君正宣布其21nm工艺产品预计2024年下半年推出样品，20nm产品正在研发中。
2024-09-12Ingenic Semiconductor plans to launch a new computing chip for the mid-range consumer smart hardware market in 2024 to enhance product competitiveness.北京君正计划2024年推出一颗新的计算芯片，面向中端消费类智能硬件市场，提升产品线竞争力。
2024-10-25Ingenic stated that multi-spectral fusion and multi-camera stitching technologies are under development.北京君正表示，多光谱融合和多目拼接相关技术正在研发中。
2024-10-29Ingenic disclosed that it will launch the T42 product next year, and the C200 product will gradually be in place; 21nm memory products are expected to generate small revenue next year and mass revenue the year after or later.北京君正披露，明年将推出T42产品，C200逐步到位；21nm存储产品预计明年产生少量收入，后年或更晚产生大规模收入。
2024-11-11Disclosed that A2 chip is still under development; tape-out schedule is undetermined.披露A2芯片仍在研发中，流片时间待定。
2024-11-20Disclosed launch of heterogeneous multi-core processors X2600 and T41, applied in robot vacuum cleaners and pet robot dogs.披露推出异构多核处理器X2600、T41等，应用于扫地机器人、斗宠机器人等领域。
2024-12-17Ingenic Semiconductor's heterogeneous multi-core processors X2600 and T41 have been applied in robot vacuum cleaners and fighting robot toys.北京君正的异构多核处理器X2600、T41已应用在扫地机器人、斗宠机器人等领域。
2024-12-30Ingenic Semiconductor confirmed its T-series products are chips targeting the camera market.北京君正确认其T系列产品为面向摄像头市场的芯片产品。
2025-01-06Ingenic's T-series chips are used in Jianan Technology's AI glasses, leveraging low power and high cost-performance.北京君正T系列芯片用于加南科技AI眼镜，具备低功耗、高性价比优势。
2025-01-06Ingenic stated its T32 chip is not currently used in desktop robots.北京君正表示其T32芯片目前未应用于桌面机器人。
2025-01-10Ingenic stated some customers are developing products similar to its Master-Flip F1 AI camera earphone.北京君正表示有部分客户在进行类似Master-Flip F1 AI摄像耳机的产品研发。
2025-01-21Ingenic confirmed its T40 AIoT chip has achieved large-volume sales.北京君正确认其T40 AIoT芯片已大批量销售。
2025-01-24Ingenic stated its products are used in扫地机器人 (sweeping robots) and斗宠机器人 (pet-fighting robots).北京君正表示其产品已应用于扫地机器人和斗宠机器人等领域。
2025-02-11Ingenic Semiconductor stated that its computing chips are mainly SoC chips, currently including T-series and X-series.北京君正表示，其计算芯片主要是SoC芯片，目前主要有T系列和X系列。
2025-02-17Ingenic Semiconductor stated that its self-developed ISP technology has been applied in some chip products.北京君正表示，其自主研发的ISP技术已应用于部分芯片产品中。
2025-02-17Ingenic Semiconductor stated that T32 began providing samples at the end of last year, with many customers developing products and some already starting volume purchases.北京君正表示，T32于去年末开始提供样品，已有较多客户进行产品研发并已有客户开始批量采购。
2025-02-25Ingenic Semiconductor stated that its X-series SoC chips are used in AIoT smart hardware including QR code devices, biometrics, education electronics, printers, smart locks, and robot vacuums.北京君正表示，其X系列SoC芯片用于AIoT智能硬件，包括二维码设备、生物识别、教育电子、打印机、智能门锁、扫地机等。
2025-02-28Ingenic Semiconductor stated that T42 is still under development.北京君正表示，T42尚在开发中。
2025-03-04Ingenic Semiconductor stated that its SoC chips integrate self-developed CPU, VPU, NPU, ISP modules, with the latest process at 12nm, and over 80% of computing chips target the security surveillance market.北京君正表示其SoC芯片集成了自研的CPU、VPU、NPU、ISP等模块，最新工艺为12nm，计算芯片80%以上面向安防监控市场。
2025-03-13Ingenic Semiconductor stated that its neural network processor (NPU) can be used for audio processing.北京君正表示其神经网络处理器（NPU）可以用于音频处理。
2025-03-13Ingenic Semiconductor stated that its smart video chips can be used in smart glasses products, and customers have already launched AI glasses.北京君正表示其智能视频芯片可用于智能眼镜产品，目前已有客户推出AI眼镜。
2025-03-19Ingenic Semiconductor stated that its self-developed new-generation AISP supports dual-light fusion.北京君正表示公司自研的新一代AISP支持双光融合。
2025-03-19Ingenic Semiconductor stated that its T-series products are mainly used in the security surveillance market, and T42 has not entered the automotive certification stage.北京君正表示T系列产品主要用在安防监控市场，T42尚未进入车规认证阶段。
2025-03-24Ingenic Semiconductor stated that its computing chip T32 can be used in smart cameras, smart glasses, hunting cameras, smart locks, etc., with multiple customers in design-in and some already in volume procurement.北京君正表示其计算芯片T32可应用于智能摄像头、智能眼镜、打猎相机、智能门锁等产品，目前有多家客户进行设计导入，部分客户已实现批量采购。
2025-04-23Ingenic Semiconductor stated that T42 is an upgrade of T41 and is still under development; final process will be determined later.北京君正表示，T42是T41的升级产品，目前尚处于研发中，最终工艺将根据实际情况确定。
2025-04-28Ingenic Semiconductor stated that its X2600 product has multiple customers in design-in phase, and some customers have started volume purchases.北京君正表示，其X2600产品已有多家客户在导入设计，部分客户已开始批量采购。
2025-04-28Ingenic Semiconductor confirmed it has gesture recognition technology.北京君正确认公司有手势识别技术。
2025-04-28Ingenic Semiconductor stated that CW200 is still in the R&D stage.北京君正表示，CW200目前还在研发阶段。
2025-05-12Ingenic stated that Victory2 is a RISC-V CPU core, not an SoC chip, and has not yet been applied in any of the company's chip products.北京君正表示，Victory2是基于RISC-V的CPU内核，并非SoC芯片，目前尚未应用于公司芯片产品中。
2025-05-12Ingenic stated that Victory3 is a RISC-V CPU core, not an SoC chip, and is still under development.北京君正表示，Victory3是基于RISC-V的CPU内核，并非SoC芯片，目前尚在研发中。
2025-05-12Ingenic disclosed that its computing chips are currently used in products such as sweepers and pet-fighting robots, and it will continue to monitor market dynamics for industrial robot and automotive applications.北京君正披露，其计算芯片目前应用于扫地机、斗宠机器人等产品，将持续关注工业机器人和汽车领域的市场动态。
2025-06-11Ingenic Semiconductor's heterogeneous multi-core processor X2600 (XBurst2 MIPS + Victory0 RISC-V) has been applied in sweeping robots and pet-fighting robots.北京君正异构多核处理器X2600（XBurst2 MIPS + Victory0 RISC-V）已应用于扫地机器人、斗宠机器人等领域。
2025-07-02Ingenic stated that its 3D DRAM product is still in the R&D stage; its T31, T32, T41 chips can be used in smart glasses, and the C200 chip for the pan-video field is still being designed and optimized.北京君正表示，其3D DRAM产品仍在研发阶段；T31、T32、T41芯片可用于智能眼镜，面向泛视频领域的C200芯片仍在设计优化中。
2025-07-11Ingenic stated that its X2000 and X2600 series have entered mass production with cumulative shipments in the millions; customers include Creality 3D, Flashforge, and Anker Innovations. The higher-end X3000 series is expected to launch next year.北京君正表示，其X2000、X2600系列已大规模量产，累计出货百万级别，客户包括创想三维、闪铸科技、安克创新；更高端的X3000系列预计明年推向市场。
2025-07-11Ingenic stated that its T41 chip has a computing power of 1.2T@int8 / 4.8T@int4, and its CW200 chip does not reach 10 TOPS.北京君正表示，其T41芯片算力为1.2T@int8/4.8T@int4，CW200芯片算力达不到10TOPS。
2025-07-21Ingenic stated that its M200S processor can be used in smart glasses and other wearable products.北京君正表示，其M200S处理器可应用于智能眼镜等产品。
2025-07-21Ingenic stated that its AI SoC supports multiple multimodal large models including Qwen (Tongyi Qianwen).北京君正表示，其AI SoC支持包括通义千问在内的多种多模态大模型。
2025-07-21Ingenic stated that its T-series chips do not yet meet the requirements for professional sports cameras like GoPro and Insta360.北京君正表示，其T系列芯片部分指标还达不到GoPro、影石360等运动类专业芯片的要求。
2025-07-21Ingenic stated that its video chips currently do not cover the market direction of humanoid robots like Unitree and Zhiyuan.北京君正表示，目前视频芯片尚不覆盖宇树机器人、智元机器人等市场方向。
2025-07-21Ingenic stated that its Victory3 (V3) CPU core's application scenario depends on the overall chip definition, not pre-targeted for cross-platform use.北京君正表示，其Victory3（V3）CPU核的应用场景取决于芯片整体定义，并非预先瞄准跨端多平台。
2025-07-21Ingenic stated that its chips are used in products such as the BL4 AI smart feeder (based on T31 chip) and the R2 pet companion robot, and can be applied to various smart hardware products in the pet economy.北京君正表示，其芯片已用于BL4 AI智能喂食器（基于T31芯片）和R2宠物陪伴机器人等产品，可应用于宠物经济中的多类智能硬件。
2025-08-04Ingenic Semiconductor confirmed that its X2500 and X2600 chips have entered volume sales.北京君正确认X2500和X2600芯片已批量销售。
2025-08-04Ingenic Semiconductor stated that its C100, CW200 use 22nm process; C200 is still at sample stage.北京君正表示C100、CW200采用22nm工艺；C200仍在样品阶段。
2025-08-21Ingenic Semiconductor stated that T33 is a new technology upgrade and cost optimization, superior to T31.北京君正表示T33是全新的技术升级与成本优化，整体优于T31。
2025-08-21Ingenic Semiconductor confirmed that T50 is still in early planning stage.北京君正确认T50尚处于前期规划阶段。
2025-08-21Ingenic Semiconductor said it will continue with ASIC architecture while considering generality.北京君正表示将继续走ASIC架构，同时考虑一定的通用性。
2025-08-21Ingenic Semiconductor disclosed that X2600 and T41 have been adopted in robot vacuum and pet-fighting robot applications.北京君正披露X2600和T41已应用于扫地机器人、斗宠机器人等领域。
2025-08-21Ingenic Semiconductor stated that its chips have been adopted by customers in smart home and smart glasses fields.北京君正表示其芯片在智能家居、智能眼镜等领域已被客户采用。
2025-09-01Ingenic Semiconductor confirmed that its C200 product is currently in the sample stage.北京君正确认C200目前处于样品阶段。
2025-09-01Ingenic Semiconductor stated that its T41 product is not discontinued; only a few specific models were discontinued to optimize the supply chain.北京君正表示T41没有停产，仅个别细分型号停产以优化供应链。
2025-09-01Ingenic Semiconductor stated that its A2 product is currently in the R&D stage.北京君正表示A2目前处于研发状态中。
2025-10-23V-series has a roadmap to extend to 64-bit architecture.V系列有向64位架构扩展的规划。
2025-10-29Computing chip products can be used in smart glasses (AI glasses) applications.计算芯片的部分产品可以应用在智能眼镜领域。
2025-11-06Ingenic states it has no standalone AI computing chip; its NPU technology is applied in its computing chip products.北京君正表示公司没有单独的算力芯片，NPU技术应用在计算芯片产品中。
2025-11-06Ingenic confirms that its self-developed CPU core V2 (Victory 2) has been applied in some dual-core products.北京君正确认自研CPU核V2（Victory 2）已应用于部分双核产品中。
2025-11-20Ingenic confirms that its self-developed CPU core V3 is under development.北京君正确认自研CPU核V3正在研发中。
2025-11-20Ingenic states that its S10 chip is currently at the DVT (Design Verification Test) stage.北京君正表示S10芯片目前处于DVT（设计验证测试）阶段。
2025-11-20Ingenic says its smart vision chips target smart security and general vision fields and do not require 3D technology.北京君正表示智能视觉芯片主要面向智能安防、泛视觉等领域，无需3D技术。
2025-12-01Ingenic Semiconductor stated on the interactive platform that its chips are used in the 3D printer field and sales are good.北京君正在互动平台表示，公司芯片用于3D打印机领域，销售较好。
2025-12-03Ingenic stated that the C200 is a tentative model name under the C series and may be renamed later based on series planning.北京君正表示C200是C系列下的暂定型号，后续可能根据该系列规划重新命名。
2025-12-16Ingenic stated that the V3 CPU is still under development.北京君正表示V3 CPU尚在研发中。
2025-12-16Ingenic clarified that it has no products for the aerospace field; its T series is mainly for consumer smart security.北京君正澄清无面向航空航天领域的产品，T系列主要应用于消费类智能安防领域。
2025-12-23Ingenic stated it has no LPDDR5 products; T-series chips are mainly used in smart security and pan-vision fields.北京君正表示目前没有LPDDR5产品；T系列芯片主要应用于智能安防及泛视觉领域。
2025-12-30Ingenic stated that cumulative shipments of the T series have exceeded 100 million units.北京君正表示T系列累积出货量已超亿颗。
2026-01-06Ingenic's S10 product (G32S10M) is still in the sample stage and has not received large-scale orders.北京君正的S10产品（G32S10M）尚处于样品阶段，未收到大规模订单。
2026-01-16Ingenic's T43 chip is in early-stage R&D.北京君正的T43芯片正在前期研发中。
2026-01-19Ingenic's T-series products are used by most customers in the AI glasses field; its new C-series products are in sample verification and optimization, with some customers having launched smart glasses and more in R&D.北京君正T系列产品被AI眼镜领域大部分客户采用；C系列新产品处于样品验证和优化阶段，部分客户已发布智能眼镜产品，更多客户尚在研发中。
2026-01-26Ingenic stated that all future computing chip products will gradually transition to RISC-V CPU.北京君正表示后续新的计算芯片产品均会逐步转向RISC-V CPU。
2026-01-30Ingenic's T40 and T41 computing chips have entered mass production and sales; T42 is under development.北京君正T40、T41计算芯片已量产销售，T42正在研发中。
2026-03-13Smart vision product line new products are progressing smoothly; some are in sample testing, some have entered mass production and sales.智能视觉产品线新产品总体进展顺利，部分处于样品测试阶段，部分已量产销售。
2026-03-24T42 and 3D DRAM are expected to be taped out in the second half of the year.T42和3D DRAM预计将于下半年投片。
2026-04-24Ingenic stated that its engineering sample G32S10M and development boards are available for evaluation; downstream interest spans image recognition, voice interaction, and motor control across multiple industries.北京君正表示工程样片G32S10M及配套开发板已供意向客户评估，下游意向涉及图像识别、语音交互、电机控制等多个行业。
2026-05-11Ingenic stated that its computing chips incorporate self-developed CPU cores and NPU modules, which have been widely adopted.北京君正表示其计算芯片包含自研CPU核和NPU模块，已得到大量应用。
2026-05-14Ingenic confirmed that products based on the XBurst2 core have been mass-produced and sold, and future products will gradually transition to RISC-V architecture.北京君正确认基于XBurst2内核的产品已量产销售，后续产品将陆续转入RISC-V架构。
2026-05-22Ingenic disclosed that 3D DRAM and T42 are under development, and all three product lines plan to launch new products this year.北京君正披露3D DRAM和T42在研发中，三大产品线今年均有计划推出新产品。
2026-06-22Ingenic Semiconductor disclosed in an institutional survey that its computing chip business grew nearly 50% in Q1 2026; due to KGD shortage, it uses allocation method; Q2 is expected to continue growing.北京君正在机构调研中披露一季度计算芯片业务增长近50%，因KGD缺货采用分货方式，预计二季度继续增长。
2026-06-22Ingenic Semiconductor disclosed that its self-developed RISC-V CPU core has been used in some chip products, with cumulative shipments exceeding 100 million units.北京君正披露自研RISC-V CPU核已应用于部分芯片产品，累计出货量超过1亿颗。
2026-07-02Ingenic's AI MCU is still in sampling stage with positive customer feedback; mass-production tape-out planned for July.北京君正AI MCU仍在样品阶段，客户反馈良好，计划7月进行量产版本投片。
2026-07-08Ingenic stated smart vision SoC is mainly used in consumer markets; products are used in robot vacuums and industrial applications; storage chips used in most automotive brands.北京君正表示智能视觉SoC主要应用于消费类市场；产品用于扫地机、工业领域；存储芯片在大部分汽车品牌中均有采用。
2026-07-28Ingenic expects AI MCU to contribute small revenue this year; G32F60/G32F70 and AI MCU (G32S10M) are on the same platform tape-out.北京君正预计今年AI MCU会有少量营收贡献；G32F60、G32F70与AI MCU（G32S10M）同平台流片。
2026-07-31Ingenic launched T3 series (T32Pro and T33) with bottom-layer architecture reconstruction for physical AI, addressing low-latency perception-inference-execution loops in edge scenarios.北京君正推出T3系列新品（T32Pro与T33），通过底层架构重构面向物理AI，解决边缘场景低延迟感知-推理-执行闭环需求。
2026-08-06New AI MCU supports multiple power modes and multi-power-domain management, positioned as general-purpose platform for IoT with MCU-level power/cost and SoC-level performance.新AI MCU支持更多工作模式和多电源域管理，定位通用平台级，面向物联网，提供MCU级功耗成本与SoC级性能体验。
Analog & interconnect chip (GreenPHY, LED driver, MCU) expansion模拟与互联芯片（GreenPHY、LED驱动、MCU）扩展
22 · 2024-01-02 → 2026-06-04
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Development and promotion of analog and interconnect products including GreenPHY, LED drivers, LIN/CAN, and new AI MCUs for automotive and industrial markets.模拟和互联产品（包括GreenPHY、LED驱动器、LIN/CAN以及新型AI MCU）在汽车和工业市场的开发与推广。
2024-01-02Ingenic stated its interconnect chip is in the promotion stage, with a long investment period for automotive-grade products.北京君正表示互联芯片处于推广阶段，车规产品投入期较长。
2024-01-31Ingenic disclosed that analog product revenue from automotive market is expected to exceed 50% in 2023; overall 2023 analog revenue declined but limited, with recovery expected in 2024.北京君正披露模拟产品车规市场收入预计2023年超过50%；2023年模拟收入下降但幅度有限，预计2024年恢复增长。
2024-06-24Ingenic Semiconductor stated in an investor survey that its analog and interconnect product lines include LED drivers, DC/DC, GreenPHY, G.vn, LIN, CAN chips, primarily targeting automotive. The company has no plans for large-scale analog expansion but will consider M&A if opportunities arise.北京君正在投资者调研中表示，模拟与互联产品线包括LED驱动、DC/DC、GreenPHY、G.vn、LIN、CAN等芯片，主要面向汽车；暂无大模拟计划，但会考虑合适并购机会。
2024-08-05Confirmed that Israel subsidiary (Ingenic Israel) operates normally, focusing on interconnect product R&D and promotion; refuted rumors of prolonged abnormal operations.确认以色列子公司（君正以色列）经营正常，主要从事互联类产品的研发和推广，否认长期无法正常经营的传闻。
2024-09-27Ingenic Semiconductor confirmed that its Israeli subsidiary, which focuses on interconnect product R&D and promotion, is operating normally.北京君正确认其以色列子公司（主要从事互联类产品研发和推广）经营一切正常。
2024-10-10Ingenic stated that its Israeli subsidiary's interconnect products are primarily used in the automotive market.北京君正表示，公司以色列子公司的互联产品主要用于车规市场。
2024-10-16Ingenic stated it has no current application related to Tesla's G.vn technology.北京君正表示，目前没有与特斯拉G.vn技术相关的应用。
2024-10-16Ingenic stated that its G.vn technology is still in the promotion and solution development stage.北京君正表示，公司G.vn目前仍在推广和方案研发中。
2024-11-08Disclosed that main competitors in analog chips are overseas giants such as TI, Infineon, and Melexis.披露模拟芯片主要竞争对手是海外大厂，如TI、英飞凌、迈来芯等。
2024-11-13Disclosed that analog chips are mainly LED drivers, with automotive market accounting for >50% of analog sales.披露模拟芯片主要是LED驱动芯片，汽车市场销售占比超过50%。
2024-12-24Ingenic Semiconductor reported that some customers have made small-batch purchases of its interconnect chips for domestic automakers and charging pile clients.北京君正表示部分客户已对其互联芯片进行小批量采购，用于国内车厂和充电桩客户。
2025-02-21Ingenic Semiconductor stated that Luomingxin (a subsidiary) mainly designs and develops LED driver chips, providing automotive-grade LED driver chips for the domestic market.北京君正表示，络明芯主要从事LED驱动芯片的设计研发，面向国内汽车市场提供车规LED驱动芯片产品。
2025-06-06Ingenic Semiconductor reported that its analog chip gross margin was nearly 50% in Q1 2025, relatively stable.北京君正表示，模拟芯片毛利率2025年一季度将近50%，相对比较稳定。
2025-08-21Ingenic Semiconductor confirmed that Lumissil analog products include products for home appliances.北京君正确认Lumissil模拟产品有面向家用电器领域的产品。
2025-10-23GreenPHY product (IS32CG5317) is being adopted by multiple customers for vehicle-grade applications; mass production sales require time.GreenPHY产品（IS32CG5317）目前有多家用户在做导入，车规应用产品从导入到量产销售需要一定时间。
2025-10-29Developing a multi-in-one vehicle chip integrating MCU, LED driver, touch driver, Lin/CAN bus; has started promotion and small-batch application.正在研发整合MCU、LED驱动、触控驱动、Lin/CAN总线的车用多合一芯片，已开始推广和小批量应用。
2025-10-29MCU products support dual BLDC motor control and include CAN and Ethernet interfaces.MCU产品可同时支持两组BLDC电机控制，并包含CAN和以太网接口。
2025-11-06Ingenic confirms that its new AI MCU G32S10M can be extended to high-precision servo system control and CNC machine tools.北京君正确认新品AI MCU G32S10M可向高精度伺服系统控制、数控机床等方向扩展。
2025-12-23Ingenic stated it has no Ethernet products; its LIN and CAN products are combo chips mainly for the LED driver market.北京君正表示没有以太网产品；LIN、CAN产品为面向LED驱动市场的combo芯片。
2026-03-13IS32CG5317 chip has entered mass production.IS32CG5317芯片已量产。
2026-04-14Ingenic announced that its analog chip product line has launched an SoC integrating MCU, LED driver, touch controller, LIN, and CAN bus.北京君正宣布模拟芯片产品线已推出整合MCU、LED驱动、触控、LIN和CAN总线的SoC产品。
2026-06-04Ingenic Semiconductor stated that its analog chips are not significantly affected by the memory cycle, and prices are adjusted based on market conditions.北京君正表示模拟芯片未受存储周期明显影响，价格根据市场情况调整。
ISSI storage chip (DRAM/SRAM/NOR Flash) businessISSI存储芯片（DRAM/SRAM/NOR Flash）业务
111 · 2024-01-11 → 2026-08-12
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The automotive and industrial storage chip business of subsidiary ISSI, covering DRAM, SRAM, and NOR Flash products, market share, and process node transitions.子公司ISSI的汽车和工业存储芯片业务，涵盖DRAM、SRAM和NOR Flash产品、市场份额及工艺节点转换。
2024-01-11Ingenic stated that its subsidiary Beijing SiCheng (ISSI) serves Tier 1/2/3 automotive suppliers, not OEMs directly.北京君正表示子公司北京矽成（ISSI）客户为车厂一二三级供应商，非整车厂商。
2024-01-16Ingenic clarified its automotive-grade chips are currently mainly memory and analog interconnect products, not computing chips.北京君正说明车规芯片目前主要是存储类和模拟互联类芯片，非算力芯片。
2024-01-31Ingenic reported that its UFS 3.1 product is still in mass production preparation stage.北京君正表示UFS 3.1产品仍在量产准备中。
2024-01-31Ingenic noted that DDR4 and LPDDR4 sales are trending upward gradually; Nor Flash automotive market share is about 40%+.北京君正指出DDR4、LPDDR4销售趋势逐渐提升；Nor Flash中汽车市场占比约40%多。
2024-02-21Ingenic Semiconductor denied having any layout for SRAM replacing HBM3E in AI, responding to investor query.北京君正否认有SRAM替代HBM3E用于人工智能的相关布局。
2024-02-21Ingenic Semiconductor stated its storage chips mainly serve automotive, industrial, and medical markets, with automotive-grade SRAM and DRAM ranking among the top globally.北京君正表示其存储芯片主要应用于汽车、工业和医疗市场，车规级SRAM和DRAM在全球名列前茅。
2024-02-23Ingenic Semiconductor stated its SRAM products are mainly used in automotive and industrial markets, not consumer.北京君正表示其SRAM产品主要应用于车规和工业市场，而非消费市场。
2024-03-11Ingenic stated it will gradually iterate its DRAM process technology.北京君正表示将逐步对DRAM工艺进行迭代。
2024-03-18Ingenic stated it currently has no plans to raise DRAM prices despite competitor Winbond's 20% DDR3 price hike, as its DRAM targets automotive and industrial markets.北京君正表示，尽管竞争对手华邦电DDR3涨价两成，但公司DRAM面向汽车和工业市场，目前暂未考虑涨价。
2024-03-20Ingenic stated its automotive-grade storage chips are used in ADAS (Advanced Driver Assistance Systems).北京君正表示其车规存储芯片在ADAS（高级驾驶辅助系统）中有应用。
2024-03-26Ingenic stated its storage products are mainly used in automotive, industrial, and medical markets, and are sold globally.北京君正表示其存储产品主要应用于汽车、工业和医疗市场，并销往全球各地。
2024-03-26Ingenic stated that the 2024 DRAM price rally has no impact on its business as it focuses on automotive, industrial, and medical markets.北京君正表示2024年DRAM涨价对其业务没有影响，因其专注于汽车、工业和医疗市场。
2024-04-15Ingenic indicated that its storage chip prices are not expected to rise significantly; future growth will mainly come from volume increases as industry demand recovers.北京君正表示存储芯片价格预计不会大幅上涨，未来增长主要来自行业需求回暖带来的量增。
2024-05-07Ingenic Semiconductor disclosed that inventory levels remain high, mainly for industrial market products, and expects inventory to decline this year; consumer memory chip price cuts are small, while computing chip prices fluctuate more.北京君正披露存货水平偏高，主要是行业市场产品，预计今年存货规模下降；消费类存储芯片价格下调幅度不大，计算芯片价格变动较大。
2024-05-29Ingenic Semiconductor stated that its memory products mainly target automotive, industrial, and medical markets, with current prices relatively stable.北京君正表示，存储产品主要面向汽车、工业和医疗等市场，目前价格相对稳定。
2024-05-31Ingenic Semiconductor disclosed that analog and interconnect gross margin remained above 50% in Q1; Green PHY products are still in promotion stage with limited revenue contribution; memory gross margin stable at ~36%; DDR4 has achieved mass production and sales; 21nm process products are under development.北京君正披露模拟与互联毛利率一季度仍超50%；Green PHY产品仍在推广阶段，收入贡献有限；存储芯片毛利率稳定在36%左右；DDR4已实现量产销售；21nm产品在研中。
2024-06-24Ingenic Semiconductor disclosed that its DRAM product line is comprehensive, with R&D focus on Flash and DRAM; the key challenge is process node breakthrough, and the company plans to introduce higher-process-node products in the future.北京君正披露DRAM产品线齐全，研发重点在Flash和DRAM，工艺节点突破是难点，未来将推出更高工艺节点产品。
2024-09-12Ingenic Semiconductor stated that its storage chip gross margin was 35.35% in the first half of 2024, remaining relatively stable.北京君正表示其存储芯片2024年上半年毛利率为35.35%，保持相对稳定。
2024-09-24Ingenic Semiconductor disclosed that automotive-grade products account for over 40% of its storage chip revenue.北京君正披露其存储芯片收入中，车规级产品占比超过40%。
2024-10-10Ingenic stated that DDR3 accounts for the largest share of its DRAM product sales.北京君正表示，目前公司DRAM产品销售占比最大的是DDR3。
2024-11-08Company disclosed that 21nm DRAM process is expected to launch by end of 2024, and 20nm process around mid-2025.公司披露21nm DRAM工艺预计2024年底推出，20nm工艺预计2025年中前后推出。
2024-11-08Disclosed that LPDDR5 usage is gradually increasing in automotive market, but DDR5 is not widely used; LPDDR4 remains the largest category.披露LPDDR5在汽车市场用量逐渐增加，但DDR5用量不多，LPDDR4仍是最大品类。
2024-11-13Disclosed that the company has no LPDDR5 product currently.披露公司目前没有LPDDR5产品。
2024-11-13Disclosed that ~80% of revenue comes from overseas; DDR3 accounts for ~50% of DRAM revenue; DDR4 and LPDDR4 shares are still small.披露约80%收入来自境外；DDR3占DRAM收入约50%；DDR4和LPDDR4占比还不大。
2024-11-28Disclosed storage market breakdown: automotive ~40%+, industrial & medical ~30%, communication & consumer ~20%.披露存储市场收入占比：汽车约40%以上，工业和医疗约30%，通信和消费约20%。
2024-11-28Disclosed plan to develop LPDDR5.披露计划研发LPDDR5。
2024-12-05Ingenic Semiconductor stated it currently has no plans to develop LPDDR5 memory.北京君正表示目前暂无研发LPDDR5的计划。
2025-01-10Ingenic confirmed its DDR4 and LPDDR4 are already in mass production and sales; LPDDR5 R&D has not yet started.北京君正确认DDR4和LPDDR4已量产销售，尚未开展LPDDR5研发。
2025-01-13Ingenic revealed its Nor FLASH automotive-grade products account for nearly 50%, manufactured at Wuhan Xinxin (XMC).北京君正透露Nor FLASH车规产品占比近50%，在武汉新芯代工。
2025-01-13Ingenic stated DDR3 products have the highest sales volume among its memory products.北京君正表示DDR3类产品销量最高。
2025-01-13Ingenic disclosed it is developing 21nm and 20nm processes; 21nm/20nm products expected to launch this year, first improving DDR3 performance, then DDR4 and LPDDR4.北京君正披露正在研发21nm和20nm工艺，预计今年推出，先用于提升DDR3性能，后续用于DDR4和LPDDR4。
2025-02-11Ingenic Semiconductor stated that its storage products mainly target automotive, industrial, and medical fields, and has not yet started LPDDR5 development but has plans.北京君正表示，其存储产品主要面向汽车、工业和医疗领域，暂未开始LPDDR5研发但后续有规划。
2025-02-21Ingenic Semiconductor stated that its storage chips are used in smart cockpits, assisted driving, and ADAS.北京君正表示，其存储芯片在智能座舱、辅助驾驶、ADAS等领域均有应用。
2025-02-26Ingenic Semiconductor disclosed in investor relations that DRAM 21nm and 20nm processes are under development, with samples expected to be provided to customers this year.北京君正在投资者关系活动中披露，DRAM的21nm和20nm工艺正在研发中，预计今年将向客户提供样品。
2025-02-26Ingenic Semiconductor disclosed that its DRAM foundry mainly relies on Powerchip (力晶), and it is monitoring the AI DRAM market which it sees as promising.北京君正披露，其DRAM代工主要依赖力晶，并关注AI DRAM市场，认为该领域前景良好。
2025-03-05Ingenic Semiconductor denied cooperation rumors with Winbond Electronics on CUBE technology, stating it is actively laying out the 3D DRAM market but the claimed collaboration is untrue.北京君正否认与华邦电子在CUBE技术上的合作传闻，表示公司正在积极布局3D DRAM市场，但所称合作不属实。
2025-03-07Ingenic Semiconductor stated it is actively advancing DRAM product iteration, with new products using 20nm process expected to release samples this year, and will launch DRAM products with more advanced processes for the automotive market.北京君正表示公司积极推进DRAM产品更新迭代，采用20nm工艺的新产品今年将推出样品，后续将推出更新工艺的DRAM产品以满足汽车市场需求。
2025-03-19Ingenic Semiconductor stated it has eMMC5.1 and UFS3.1 products but no UFS4.1, and has no plans for SSD products.北京君正表示公司有eMMC5.1及UFS3.1产品，没有UFS4.1，目前没有规划SSD产品。
2025-03-27Ingenic Semiconductor stated that its storage chips are used in most domestic automotive manufacturers, including Xiaomi cars.北京君正表示其存储芯片在国内大部分车厂均有应用，包括小米汽车。
2025-04-03Ingenic Semiconductor said DDR3 currently accounts for a large proportion, and DDR4 sales share is expected to gradually increase; it will adopt more advanced process nodes for larger-capacity chip R&D.北京君正表示，目前DDR3占比较大，预计未来DDR4的销量占比会逐渐提升；将采用更先进的制程进行更大容量的芯片产品研发。
2025-04-23Ingenic Semiconductor disclosed that its storage products are mainly produced at Powerchip (力积电) and Wuhan Xinxin (武汉新芯) fabs.北京君正披露，其存储产品主要在力积电和武汉新芯等晶圆厂生产。
2025-05-04Ingenic Semiconductor's full-year 2024 revenue was 4.213 billion yuan, down 7.03% YoY; net profit attributable to parent fell 31.84% YoY; memory chip revenue was 2.589 billion yuan, down 11.06% YoY, with gross margin down 1.93 ppts.北京君正2024年全年营收42.13亿元，同比下降7.03%；归母净利润同比下降31.84%；存储芯片营收25.89亿元，同比下降11.06%，毛利率下降1.93个百分点。
2025-06-26Ingenic Semiconductor stated it is planning next-generation products but has not yet started R&D on DDR5 memory.北京君正表示正在规划新一代产品，尚未开始研发DDR5。
2025-06-26Ingenic Semiconductor stated it currently offers 25nm 4Gb and 8Gb DDR4, and products with updated process nodes will be launched starting this year.北京君正表示目前有25nm 4G和8G DDR4，更新工艺的产品会从今年开始陆续推出。
2025-06-26Ingenic Semiconductor noted that following Samsung and Micron's DDR4 production halt, it has received inquiries from new industrial control customers, but product verification cycles are long.北京君正表示，三星美光停产DDR4后，陆续有新的工控客户沟通验证需求，但行业市场验证周期较长。
2025-07-11Ingenic stated that it has not raised prices for existing customers on its storage products, and has no price increase plan for DRAM products in the next quarter.北京君正表示，目前存储产品对现有客户基本没有涨价，下季度DRAM产品暂无提价计划。
2025-07-21Ingenic stated that its LPDDR4 and DDR4 products have already entered mass production and are being sold.北京君正表示，其LPDDR4和DDR4产品早已量产销售。
2025-08-12Ingenic Semiconductor said it has no plan to develop DDR6, and will develop LPDDR5 when appropriate; no price hike for existing DRAM customers.北京君正表示暂无布局DDR6计划，将适时开发LPDDR5；现有DRAM客户暂无调价。
2025-09-01Ingenic Semiconductor disclosed that it is developing 3D DRAM and expects to launch a product this year, acknowledging a later start than GigaDevice.北京君正披露正在研发3D DRAM，预计今年推出产品，并承认研发起步晚于兆易创新。
2025-10-23Adjusted prices for some storage chip customers based on market conditions, supply chain, and competitor pricing.根据市场综合情况（包括产业链情况及友商价格信息），对部分存储芯片客户价格进行了一定的调整。
2025-10-29New-process DDR4 products have begun customer sampling; revenue contribution expected from 2026. LPDDR5 products are under planning.新制程DDR4产品已开始给客户送样，预计2026年起贡献收入；LPDDR5产品正在规划中。
2025-10-29Storage products are compatible with Qualcomm's main control chips.存储产品有配合高通的主控芯片。
2025-11-14Ingenic states that ISSI eMMC 32GB/128GB has entered mass production; market supply is tight and customers need to place orders on time.北京君正表示ISSI eMMC 32GB/128GB已量产，目前市场较紧缺，客户需按时下单。
2025-11-14Ingenic says its new process (16nm) DDR4 products have been sampled to customers; expects DDR4 revenue share to grow in 2026.北京君正表示新工艺制程（16nm）的DDR4产品已送样，预计2026年DDR4收入占比将持续增长。
2025-11-14Ingenic states that LPDDR5 products are still in the planning stage.北京君正表示LPDDR5产品目前还在规划中。
2025-11-14Ingenic says its NAND/eMMC products mainly serve automotive and industrial markets; ISSI prioritizes supply to automotive/industrial, may consider consumer if capacity allows.北京君正表示NAND/eMMC产品主要面向汽车和工业市场；ISSI以保供汽车工业为主，若有多余产能可考虑消费类。
2025-11-20Ingenic says NAND products currently account for a small share; the company is actively planning more products and has already adjusted NAND prices according to market conditions.北京君正表示NAND目前占比不大，公司正积极规划更多产品，并根据市场情况已对NAND产品进行了价格调整。
2025-11-20Ingenic states that storage price increases will drive growth in its storage product sales revenue, which is a positive impact.北京君正表示存储涨价会推动公司存储产品销售收入的增长，对公司是积极的影响。
2025-11-20Ingenic reports inventory of 2.920 billion yuan as of September 30, 2025, due to continuous DRAM product stocking since late 2024.北京君正报告截至2025年9月30日存货为29.20亿元，系自2024年末起对部分DRAM产品持续备货所致。
2025-11-25Ingenic states that under the upward memory cycle, continued DRAM price increases benefit product promotion and sales; the company will adjust prices based on market conditions.北京君正表示存储周期向上趋势下，DRAM持续涨价有利于产品推广和销售，公司将根据市场情况进行价格调整。
2025-12-01Ingenic stated that it has differentiated competition with Micron in the memory field.北京君正表示在存储器领域与美光存在差异化竞争。
2025-12-08Ingenic stated that product prices are being adjusted gradually.北京君正表示产品在陆续调整价格。
2025-12-16Ingenic stated that its Nor Flash products are used in the server field.北京君正表示其Nor Flash产品用于服务器领域。
2025-12-16Ingenic stated that prices of some storage chip products have been raised according to market conditions.北京君正表示公司存储芯片部分产品价格根据市场情况有所上调。
2025-12-23Ingenic stated that its new process (16nm DDR4) products have been mass-produced and are expected to have large-volume sales next year; they can be used in smart cockpits and smart driving.北京君正表示新制程（16nm DDR4）产品已陆续量产，预计明年将有大批量销售，可应用于智能座舱、智能驾驶等场景。
2025-12-23Ingenic stated that for L3 autonomous driving and above, ISSI's some products meet ISO26262 ASIL-B functional safety requirements.北京君正表示L3以上自动驾驶对功能安全有要求，ISSI部分产品满足ISO26262 ASIL-B。
2025-12-23Ingenic stated that some storage and computing chip products have had price adjustments, with some products executing new prices in Q4; adjustments vary by region and customer.北京君正表示部分存储芯片和计算芯片进行了价格调整，部分产品在四季度已执行新价格，不同区域和客户调价情况有所不同。
2025-12-30Ingenic stated that its SRAM products rank second globally and first in mainland China according to Frost & Sullivan industry data; SRAM is not used for L3 autonomous driving.北京君正表示根据沙利文行业数据，公司SRAM产品全球排名第二，中国大陆排名第一；SRAM未用于L3自动驾驶。
2025-12-30Ingenic stated that its Nor Flash products include process nodes of 50nm and 65nm, with capacities from 256Kb to 2Gb, mainly used in automotive, industrial, and medical markets.北京君正表示其Nor Flash产品工艺包括50nm和65nm，容量从256Kb至2Gb，主要应用于汽车、工业医疗等市场。
2026-01-06Ingenic raised prices on some storage chips in Q4 2025, with adjustments varying by region and customer.北京君正部分存储芯片产品在2025年第四季度已执行新价格，不同区域和客户调价情况有所不同。
2026-01-15Ingenic expects DDR4/LPDDR4 product revenue share to increase significantly from 2026, as it shifts production from DDR3 to higher-margin DDR4.北京君正预计从2026年起DDR4/LPDDR4产品占比将显著提高，将产能从DDR3转向毛利更高的DDR4。
2026-01-15Ingenic confirmed its 8/16GB NAND uses 2D Raw NAND, while 32GB and above uses 3D Raw NAND; the company does not focus on the consumer segment.北京君正确认8/16GB NAND采用2D Raw NAND，32GB及以上采用3D Raw NAND，公司不聚焦消费类领域。
2026-01-26Micron's exit from the DDR4 market will have a positive impact on Ingenic's expansion in the industrial market.美光退出DDR4市场对北京君正在行业市场的拓展会产生积极影响。
2026-01-26Ingenic's eMMC capacity is tight; it cooperates with Huali Microelectronics mainly on SRAM.北京君正eMMC产能紧张；与华力微的合作主要涉及SRAM。
2026-01-26Ingenic's NOR Flash products are used in AI servers and optical modules.北京君正的NOR Flash产品在AI服务器、光模块等领域有应用。
2026-01-27Ingenic's storage products have been gradually adjusting prices since Q3 2025; new process products have entered mass production.北京君正存储产品从2025年第三季度开始陆续调价，新制程产品已陆续量产。
2026-01-30Ingenic's automotive-grade products account for about 40% of its storage revenue.北京君正车规类产品在存储收入中占比约40%多。
2026-03-03512Mb HyperRAM has entered mass production ramp-up; 1Gb version is not planned.512Mb HyperRAM已进入量产爬坡阶段；1Gb版本暂未规划。
2026-03-13LPDDR4 and DDR4 new-process products have entered mass production and sales; sales share expected to rise significantly this year.LPDDR4和DDR4新制程产品已量产销售，预计今年销售占比将有明显提升。
2026-03-133D DRAM is currently under development.3D DRAM目前正在研发中。
2026-03-17DRAM, Flash, and some computing chip prices have been adjusted; DRAM new-process products have started sales; company expects good revenue growth this year.DRAM芯片、Flash芯片和部分计算芯片价格有调整；DRAM新制程产品已开始销售；预计今年业绩会有较好增长。
2026-03-24LPDDR5 is currently under development.LPDDR5尚在研发中。
2026-03-24SLC NAND flash solutions are currently offered.目前公司提供SLC NAND flash解决方案。
2026-04-01Ingenic disclosed that as of end-2025 inventories reached nearly 3 billion yuan, mostly DRAM; it uses quarterly allocation to manage tight supply; DRAM prices rose sharply in China (some products >100%) while overseas rises are slower; Flash price increases are smaller than DRAM.北京君正披露2025年底存货近30亿元，主要为存储产品；采用季度分货机制应对供应紧张；DRAM国内价格涨幅较大（部分产品超一倍），海外涨幅较小且较慢；Flash涨价幅度小于DRAM。
2026-04-08Ingenic stated that DDR4 and LPDDR4 are in short supply and their revenue share is expected to rise in 2026; DRAM demand is very strong and prices are expected to continue rising; gross and net margins are expected to improve quarter by quarter.北京君正表示DDR4和LPDDR4供不应求，预计2026年营收占比提升；DRAM市场需求旺盛，价格预计继续上涨；毛利率和净利率预计逐季提升。
2026-04-08Ingenic disclosed that it is developing 3D DRAM, which in the future may integrate memory and computing chips; LPDDR5 is also under development.北京君正披露正在研发3D DRAM，未来有望将存储芯片和计算芯片结合；同时也在研发LPDDR5。
2026-04-14Ingenic stated that it will increase investment in NAND Flash, which currently accounts for a small share of its memory revenue.北京君正表示将加大NAND Flash领域的投入，目前该产品在存储芯片收入中占比尚小。
2026-04-14Ingenic disclosed that automotive-grade memory chips are the largest contributor to its memory revenue; 3D DRAM has not yet been taped out and is not expected to generate revenue this year.北京君正披露车规存储芯片为存储芯片收入占比最大的部分；3D DRAM尚未投片，预计今年尚无收入贡献。
2026-04-14Ingenic stated that its DRAM process has advanced to 20nm, 18nm, and 16nm at three new foundries; global DRAM capacity remains very tight in 2026.北京君正表示其DRAM工艺已提升至20nm、18nm和16nm，在三家新代工厂生产；2026年全球DRAM产能非常紧张。
2026-05-14Ingenic stated it has NOR Flash solutions for AI glasses, but no eMCP solution currently.北京君正表示针对AI眼镜有NOR Flash解决方案，目前没有eMCP方案。
2026-05-22Ingenic stated that its LPDDR4 products are in strong demand, with sales share of total DRAM products continuously growing; the company will consider customer demand for production arrangements.北京君正表示LPDDR4产品需求旺盛，占DRAM产品销售比重持续增长，将综合考虑客户需求安排生产。
2026-05-25Ingenic stated its storage products are mainly used in automotive, industrial/medical, communications, AI servers, and optical modules; 3D DRAM will target edge-side AI applications.北京君正表示存储产品主要应用于汽车、工业医疗、通信、AI服务器、光模块等领域；3D DRAM将面向端侧AI领域。
2026-05-26Ingenic confirmed its automotive-grade storage products have passed AECQ100 certification.北京君正确认其车规级存储产品均通过AECQ100认证。
2026-06-04Ingenic Semiconductor disclosed that its DRAM has four foundry partners including Powerchip (力积电), with three new foundries under confidentiality agreements; 3D DRAM production is delayed due to capacity constraints.北京君正披露DRAM有四家代工伙伴，包括力积电，新增三家代工厂有保密约定；3D DRAM因产能影响投产延后。
2026-06-04Ingenic Semiconductor stated that its storage products are sold into the optical module and LiDAR markets.北京君正表示其存储产品在光模块领域和激光雷达领域均有销售。
2026-06-04Ingenic Semiconductor denied claims that it offers lower prices to overseas large customers compared to domestic customers, stating the information is untrue.北京君正否认给予海外大客户价格低于国内客户的说法，称信息不属实。
2026-06-04Ingenic Semiconductor disclosed its 2025 global market rankings: #2 in SRAM, #2 in IP-Cam SoC, #5 in automotive niche DRAM, #1 in automotive SRAM, #4 in automotive NOR Flash, #7 in niche DRAM, #7 in NOR Flash.北京君正披露2025年全球市场排名：SRAM第二、IP-Cam SoC第二、车规利基型DRAM第五、车规SRAM第一、车规NOR Flash第四、利基型DRAM第七、NOR Flash第七。
2026-06-04Ingenic Semiconductor said new process products can be used in smart cockpit and intelligent driving scenarios.北京君正表示新制程的部分产品可应用于智能座舱、智能驾驶等多种场景。
2026-06-11Ingenic Semiconductor confirmed that its storage products are already supplying multiple server companies.北京君正确认其存储产品已向多家服务器企业供货。
2026-06-11Ingenic Semiconductor disclosed that LPDDR5 is under planning.北京君正披露LPDDR5正在规划中。
2026-06-11Ingenic Semiconductor stated that 3D DRAM is under development.北京君正表示3D DRAM正在研发中。
2026-06-23Ingenic Semiconductor disclosed that DDR4 and LPDDR4 combined revenue exceeded DDR3 in Q1 2026; expects DDR4+LPDDR4 to become the largest DRAM revenue contributor in 2026.北京君正披露一季度DDR4和LPDDR4合计收入已超过DDR3，预计2026年将成为DRAM中占比最大的部分。
2026-06-23Ingenic Semiconductor stated that the current memory cycle is expected to last until 2027, with higher景气度 than the 2021 cycle; DRAM is under allocation due to strong demand.北京君正表示本轮存储周期预计持续至2027年，景气度高于2021年周期；DRAM因需求旺盛采用分货方式。
2026-07-02Ingenic stated DRAM prices rose significantly; domestic customers started price adjustments in Q1, overseas customers followed in Q2; Q3 prices to rise further, Q4 supply remains tight with possible further hikes; SRAM and NOR Flash prices also increased moderately.北京君正表示DRAM涨价较多，一季度国内客户调价，二季度海外客户跟进；三季度价格继续上调，四季度供应紧张可能继续调价；SRAM和NOR Flash价格也温和上涨。
2026-07-20Ingenic stated memory chip shortage is expected to persist for a long time; overall operating results expected to grow quarter by quarter this year.北京君正表示预计存储芯片紧缺情形会延续较长时间，今年总体经营业绩预计逐季增长。
2026-07-20Ingenic confirmed overseas customers started price increases in Q2; DRAM prices to continue rising in Q3, with Q3 gross margin expected to improve further.北京君正确认二季度海外客户开始涨价，三季度DRAM持续涨价，预计三季度毛利率继续提升。
2026-07-27Ingenic stated 3D DRAM tape-out will be delayed to early next year due to capacity constraints; R&D is basically complete, targeting edge and edge-AI applications.北京君正表示因产能紧张，3D DRAM投片预计延迟到明年初；研发基本完成，主要面向端侧及边缘AI应用。
2026-07-30Ingenic stated NOR Flash demand remains strong, driven by AI servers and optical modules; Q1 NOR Flash revenue grew well, mainly from volume growth.北京君正表示受AI服务器、光模块需求拉动，NOR Flash需求持续向好；一季度NOR Flash收入增长良好，主要来自销量贡献。
2026-08-03Company confirmed multiple foundry partners, actively seeking additional capacity; DRAM suppliers include Powerchip and three undisclosed fabs.公司确认有多家代工合作伙伴，积极寻求其他代工资源；DRAM供应商包括力积电及三家未公开代工厂。
2026-08-03SLC NAND foundry located in Taiwan, capacity tight; company allocating shipments based on inventory and customer demand, cannot fully meet all orders.SLC NAND代工厂在台湾地区，产能紧张；公司根据库存和客户需求分货，无法满足所有客户全部需求。
2026-08-12Company has no HBM R&D plan; currently developing 3D DRAM for edge AI applications.公司没有HBM芯片研发计划；目前在研主要面向端侧AI应用的3D DRAM产品。
Shareholder & insider share changes股东及内部人股份变动
34 · 2024-01-24 → 2026-07-29
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Share reductions, pledges, and sales by controlling shareholders, directors, and major shareholders.控股股东、董事及主要股东的减持、质押和出售。
2024-01-24Controlling shareholder and director Li Jie terminated his share reduction plan without any shares being sold.控股股东、董事李杰终止减持计划，未减持任何股份。
2024-04-03Director and VP Zhang Jin completed a reduction of 346,000 shares (0.0718% of total share capital); the controlling shareholder Li Jie terminated his reduction plan early.董事兼副总经理张紧完成减持34.6万股（占总股本0.0718%）；控股股东李杰提前终止减持计划。
2024-08-09Shareholder Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership plans to reduce holdings by up to 870,000 shares (0.1807% of total) via centralized竞价 from Sep 2 to Dec 1, 2024, citing capital planning.持股5%以上股东上海武岳峰集成电路股权投资合伙企业计划于2024年9月2日至12月1日以集中竞价方式减持不超过87万股（占总股本0.1807%），原因为资金规划。
2024-10-08Shareholder Beijing Yitang Shengxin Semiconductor Industry Investment Center (LP) plans to reduce its stake by up to 800,000 shares (0.1661% of total capital) via centralized竞价 from Oct 30 to Nov 10, 2024, citing operational capital needs.股东北京屹唐盛芯半导体产业投资中心（有限合伙）计划于2024年10月30日至11月10日通过集中竞价方式减持不超过80万股（占总股本0.1661%），原因为运营资金需求。
2024-10-15Shareholder Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership (LP) completed a reduction of 870,000 shares (0.1807% of total capital), reducing its holding to 42.7522 million shares (8.88% of total capital).股东上海武岳峰集成电路股权投资合伙企业（有限合伙）完成减持87万股（占总股本0.1807%），持股降至4275.22万股（占总股本8.88%）。
2024-11-05Shareholder Yitangshengxin completed a share reduction plan, cumulatively reducing holdings by 800,000 shares.股东屹唐盛芯减持计划实施完毕，累计减持80万股。
2025-01-19Director Zhang Jin plans to sell up to 600,000 shares (0.1246% of total) via centralized竞价 within 3 months from Feb 19, 2025, for personal funding needs.董事张紧计划自2025年2月19日起三个月内以集中竞价方式减持不超过60万股（占总股本0.1246%），原因为个人资金需求。
2025-02-25Ingenic Semiconductor announced that shareholders including Beijing Sihaijunxin, controlling shareholder Li Jie, director Xian Yonghui, supervisor Zhang Yanxiang, and senior executive Zhang Min plan to reduce holdings via centralized竞价 from March 19 to June 18, 2025, totaling 2.53 million shares (~0.53% of total shares).北京君正公告，股东四海君芯、控股股东李杰、董事冼永辉、监事张燕祥、高管张敏计划于2025年3月19日至6月18日通过集中竞价减持，合计253万股（约占总股本0.53%）。
2025-03-05Shareholder Shaoxing Weihao reduced its stake by 100 shares via centralized bidding, dropping its holding below 5% to 4.99998%, no longer a major shareholder.股东绍兴韦豪通过集中竞价减持100股，持股比例降至4.99998%，不再是持股5%以上股东。
2025-03-05Shareholder Beijing Yitang Shengxin Semiconductor Industry Investment Center cumulatively reduced its stake by 7.5844 million shares from 2022-06-29 to 2025-03-04, a reduction of 1.5749%.股东北京屹唐盛芯半导体产业投资中心自2022年6月29日至2025年3月4日累计减持758.4421万股，减持比例达1.5749%。
2025-03-06Director and senior executive Zhang Jin reduced his stake by 600,000 shares on March 5, accounting for 0.1246% of total share capital.董事、高管张紧于3月5日减持公司股份60万股，占公司总股本0.1246%。
2025-03-06Shareholder Beijing Sihai Junxin plans to reduce 800,000 shares (0.1661% of total) via centralized bidding from 2025-03-19 to 2025-06-18; controlling shareholder and director Li Jie plans to reduce 700,000 shares in the same period.股东北京四海君芯计划在2025年3月19日至6月18日期间减持80万股（占总股本0.1661%）；控股股东、实控人之一、董事李杰计划同期减持70万股。
2025-05-19Shareholder Zhang Jin reduced his stake by 600,000 shares (0.1246% of total share capital) through centralized竞价 trading.股东张紧通过集中竞价方式减持60万股，占公司总股本的0.1246%。
2025-07-14Ingenic's controlling shareholder Li Jie pledged 5.0844 million shares (1.05% of total share capital) and released 3.77 million shares from pledge; pledgee is Guotai Haitong Securities, for personal funding needs.北京君正控股股东李杰质押508.44万股（占总股本1.05%），解除质押377万股；质权人为国泰海通证券，用于个人资金需求。
2025-07-16Ingenic's controlling shareholder Li Jie pledged an additional 635,600 shares (0.13% of total share capital); cumulative pledged shares reached 5.72 million shares (1.19% of total share capital).北京君正控股股东李杰补充质押63.56万股（占总股本0.13%）；累计质押股份达572万股（占总股本1.19%）。
2025-07-17Shareholder Beijing Yitang Shengxin Semiconductor Industry Investment Center (Limited Partnership) reduced its stake by 4.8254 million shares (1% of total share capital) via centralized竞价 from June 30 to July 16, 2025.股东北京屹唐盛芯半导体产业投资中心（有限合伙）于2025年6月30日至7月16日通过集中竞价减持482.54万股（占总股本1%）。
2025-07-21Ingenic announced that shareholder Beijing Sihai Junxin Co., controlling shareholder Li Jie, director Xian Yonghui, director Zhang Yanxiang, and senior executive Zhang Min plan to reduce holdings via centralized竞价 within three months: Sihai Junxin 800,000 shares (0.1658%), Li Jie 800,000 shares (0.1658%), Xian Yonghui 600,000 shares (0.1243%), Zhang Yanxiang 180,000 shares (0.0373%), Zhang Min 250,000 shares (0.0518%).北京君正公告，股东北京四海君芯有限公司、控股股东李杰、董事冼永辉、董事张燕祥、高级管理人员张敏计划三个月内集中竞价减持：四海君芯80万股（0.1658%）、李杰80万股（0.1658%）、冼永辉60万股（0.1243%）、张燕祥18万股（0.0373%）、张敏25万股（0.0518%）。
2025-09-30Director Zhang Yanxiang reduced 10,000 shares (0.0021% of total share capital) on Sep 30, 2025.董事张燕祥于2025年9月30日减持公司股份1.0万股，占公司总股本0.0021%。
2025-10-21Shareholder Beijing Yitang Shengxin Semiconductor Industry Investment Center (Limited Partnership) reduced 4.825 million shares (1.000007%) via centralized竞价 (competitive bidding) from Sep 16 to Oct 20, 2025.股东北京屹唐盛芯半导体产业投资中心（有限合伙）于2025年9月16日至10月20日通过集中竞价方式减持公司股份482.5441万股，减持比例为1.000007%。
2025-10-28Shareholder Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership (Limited Partnership) reduced 4.7475 million shares (0.9839%) from Mar 4 to Oct 27, 2025.股东上海武岳峰集成电路股权投资合伙企业（有限合伙）于2025年3月4日至10月27日间合计减持474.75万股，占公司总股本的0.9839%。
2026-03-11Shareholder Beijing Yitangshengxin Semiconductor Industry Investment Center (Limited Partnership) reduced holdings by 4,825,396 shares (1% of total) via centralized竞价 from 2025-10-22 to 2026-03-10.股东北京屹唐盛芯半导体产业投资中心（有限合伙）于2025年10月22日至2026年3月10日通过集中竞价减持482.5396万股（占总股本1%）。
2026-03-19Shareholder Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership (Limited Partnership) reduced holdings by 4,825,393 shares (1% of total) via centralized竞价 from 2025-10-29 to 2026-03-18.股东上海武岳峰集成电路股权投资合伙企业（有限合伙）于2025年10月29日至2026年3月18日通过集中竞价减持482.5393万股（占总股本1%）。
2026-04-07Shareholders Sihai Junxin plans to sell up to 4 million shares (0.83% of total), Li Jie up to 2 million shares (0.41%), Zhang Min up to 300,000 shares (0.06%), Liu Fei up to 300,000 shares (0.06%), Zhang Yanxiang up to 180,000 shares (0.04%) via block trades or centralized竞价 from Apr 29 to Jul 28, 2026, citing personal funding needs.股东四海君芯计划减持不超过400万股（占总股本0.83%），李杰不超过200万股（0.41%），张敏不超过30万股（0.06%），刘飞不超过30万股（0.06%），张燕祥不超过18万股（0.04%），减持期间为2026年4月29日至7月28日，原因为个人资金需求。
2026-05-13Non-independent director Li Jie sold 200,000 shares via block trade on May 12, 2026, cashing out approx. RMB 27.898 million.非独立董事李杰于2026年5月12日通过大宗交易减持20万股，套现约2789.8万元。
2026-05-14Controlling shareholder and its concert parties (Beijing Sihai Junxin, Li Jie, Liu Fei) reduced holdings by 3.1582 million shares (0.6545% of total) via centralized竞价 and block trades from May 6-13, 2026.控股股东及其一致行动人（四海君芯、李杰、刘飞）于2026年5月6日至13日通过集中竞价及大宗交易合计减持315.82万股（占总股本0.6545%）。
2026-05-20Shareholder Shanghai Wuyuefeng Integrated Circuit Equity Investment Partnership reduced 4.8254 million shares (1.0001% of total) from March 19 to May 19, 2026, cashing out approx. RMB 601 million.股东上海武岳峰集成电路股权投资合伙企业于2026年3月19日至5月19日减持482.54万股（占总股本1.0001%），套现约6.01亿元。
2026-05-21Shareholder Beijing Yitang Shengxin Semiconductor Industry Investment Center reduced 24.127 million shares (4.999983% of total) from June 30, 2025 to May 20, 2026, dropping below the 5% threshold.股东北京屹唐盛芯半导体产业投资中心于2025年6月30日至2026年5月20日减持2412.7万股（占总股本4.999983%），持股降至5%以下。
2026-05-26Employee representative director Zhang Yanxiang sold 30,000 shares via竞价 trade on May 26, 2026, cashing out approx. RMB 4.4814 million.职工代表董事张燕祥于2026年5月26日通过竞价交易减持3万股，套现约448.14万元。
2026-05-27Non-independent director Li Jie sold another 300,000 shares via block trade on May 27, 2026, cashing out approx. RMB 45.603 million.非独立董事李杰于2026年5月27日再次通过大宗交易减持30万股，套现约4560.3万元。
2026-05-27Vice general manager and board secretary Zhang Min sold 50,000 shares via竞价 trade on May 27, 2026, cashing out approx. RMB 8.378 million.副总经理及董事会秘书张敏于2026年5月27日通过竞价交易减持5万股，套现约837.8万元。
2026-06-23Ingenic Semiconductor non-independent director Li Jie (李杰) sold 200,000 shares via block trade on June 23, 2026, cashing out approximately 38.61 million yuan; cumulative disposals total 11.625 million shares for about 1.125 billion yuan.北京君正非独立董事李杰于2026年6月23日通过竞价交易减持20万股，套现约3861万元；累计减持1162.38万股，套现约11.25亿元。
2026-06-26Ingenic Semiconductor employee representative director Zhang Yanxiang (张燕祥) completed a share sale of 180,000 shares (0.0372% of total) between May 11 and June 25, 2026, at an average price of 166.01 yuan.北京君正职工代表董事张燕祥于2026年5月11日至6月25日完成减持18万股（占总股本0.0372%），减持均价166.01元。
2026-07-06Shareholders Sihai Junxin, Li Jie, and Liu Fei completed reduction plans: Sihai Junxin sold 4 million shares (0.83%), Li Jie sold 2 million shares (0.41%), Liu Fei sold ~300,000 shares (0.06%); no control change.股东四海君芯、李杰、刘飞完成减持计划：四海君芯减持400万股（0.83%），李杰减持200万股（0.41%），刘飞减持约30万股（0.06%）；不导致控制权变更。
2026-07-29Vice GM and board secretary Zhang Min completed share reduction: sold 236,000 shares at avg RMB 233/share (total ~RMB 54.99 million) from May 27 to Jun 30, reducing stake to 0.23%.副总经理兼董秘张敏完成减持：5月27日至6月30日以均价233元/股减持23.6万股（约5498.8万元），持股降至0.23%。
Financial results & guidance财务业绩与指引
24 · 2024-01-26 → 2026-08-10
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Quarterly and annual financial results, revenue and profit trends, gross margin updates, and forward-looking guidance.季度和年度财务业绩、收入和利润趋势、毛利率更新以及前瞻性指引。
2024-01-26Ingenic released 2023 annual performance forecast: net profit attributable to shareholders is approximately 465-557 million yuan, down 29.47%-41.13% YoY. Computing chip revenue grew YoY due to smart video, while storage and analog interconnect chip revenue declined due to weak auto/industrial demand.北京君正发布2023年度业绩预告：归母净利润约4.65亿-5.57亿元，同比下降29.47%-41.13%。计算芯片因智能视频市场增长而同比增长，存储和模拟互联芯片因汽车/工业需求下降而下滑。
2024-04-12FY2023 results: revenue RMB 4.531 billion (-16.28% YoY), net profit RMB 537 million (-31.93% YoY); proposed cash dividend of RMB 2.00 per 10 shares.2023年年报：营业收入45.31亿元（同比-16.28%），净利润5.37亿元（同比-31.93%）；拟每10股派发现金红利2.00元。
2024-04-24Q1 2024 results: revenue RMB 1.007 billion (-5.80% YoY), net profit RMB 87.26 million (-23.90% YoY); computing chip sales grew while storage chip sales declined due to weak industrial/medical demand.2024年一季报：营业收入10.07亿元（同比-5.80%），净利润8725.99万元（同比-23.90%）；计算芯片销售收入同比增长，存储芯片因工业/医疗需求疲软同比下降。
2024-06-25Ingenic Semiconductor reported Q1 2024 revenue of 1.007 billion yuan, down 5.80% YoY; net profit attributable to shareholders was 87.2599 million yuan, down 23.90% YoY.北京君正2024年第一季度营业收入10.07亿元，同比下降5.80%；归属净利润8725.99万元，同比下降23.90%。
2024-07-19Ingenic Semiconductor reported Q1 2024 revenue of 1.007 billion yuan, down 5.80% YoY; net profit attributable to parent of 87.26 million yuan, down 23.90% YoY.北京君正2024年第一季度实现营业收入10.07亿元，同比减少5.80%；归属净利润8725.99万元，同比减少23.90%。
2024-08-282024 H1 revenue RMB 2.107 billion, down 5.15% YoY; net profit RMB 197 million, down 11.1% YoY; operating cash flow RMB 89.2 million, down 62.29% YoY.2024年上半年营业收入21.07亿元，同比下降5.15%；净利润1.97亿元，同比下降11.1%；经营活动现金流8920万元，同比下降62.29%。
2024-10-27Q3 2024 results: revenue 3.201 billion yuan (-6.39% YoY), net profit 304 million yuan (-17.37% YoY); Q3 alone: revenue 1.094 billion yuan (-8.70% YoY), net profit 107 million yuan (-26.89% YoY).2024年第三季度业绩：前三季度营收32.01亿元（同比-6.39%），净利润3.04亿元（同比-17.37%）；第三季度营收10.94亿元（同比-8.70%），净利润1.07亿元（同比-26.89%）。
2024-11-08Q3 2024 gross margin: computing chips ~35%+, storage chips ~33%+, analog & interconnect chips >50%.2024年第三季度毛利率：计算芯片约35%以上，存储芯片约33%以上，模拟与互联芯片保持在50%以上。
2025-02-14Ingenic Semiconductor disclosed that its computing chips are over 80% used in security surveillance, with gross margin above 30% in the first three quarters; storage chip gross margin ~34%; analog & interconnect chip gross margin above 50%.北京君正披露，计算芯片80%以上用于安防监控，前三季度毛利率30%以上；存储芯片毛利率约34%；模拟与互联芯片毛利率50%以上。
2025-03-24Ingenic Semiconductor announced it will release its first-quarter report on April 25, 2025.北京君正宣布将于2025年4月25日披露第一季度报告。
2025-04-18Ingenic Semiconductor released 2024 annual report: revenue 4.213 billion yuan, down 7.03% YoY; net profit 366 million yuan, down 31.84% YoY; plans to distribute 1 yuan per 10 shares (tax included).北京君正发布2024年年报：营业收入42.13亿元，同比下降7.03%；净利润3.66亿元，同比下降31.84%；拟每10股派发现金红利1元（含税）。
2025-04-24Ingenic Semiconductor released Q1 2025 results: revenue 1.06 billion yuan, up 5.28% YoY; net profit 73.905 million yuan, down 15.3% YoY; net profit fell due to new equity incentive expenses of 11.892 million yuan and gross margin fluctuation.北京君正发布2025年一季报：营业收入10.6亿元，同比增长5.28%；净利润7390.5万元，同比下降15.3%；净利润下降因新增股权激励费用1189.20万元及毛利率波动。
2025-05-04Ingenic Semiconductor reported Q1 2025 revenue of 1.060 billion yuan, up 5.28% YoY, but net profit attributable to parent fell 15.30% YoY to 73.905 million yuan, marking the tenth consecutive quarter of decline; non-recurring net profit was 66.3479 million yuan, down 18.83% YoY; gross margin was 36.4%, down 1.05 ppts.北京君正公布2025年一季度营收10.60亿元，同比增长5.28%，但归母净利润同比下降15.30%至7390.5万元，连续第十个季度下滑；扣非净利润6634.79万元，同比下降18.83%；毛利率36.4%，同比下降1.05个百分点。
2025-08-25Ingenic Semiconductor reported H1 2025 revenue of CNY 2.249 billion, +6.75% YoY; net profit CNY 203 million, +2.85% YoY; no dividend.北京君正2025年上半年营收22.49亿元，同比增长6.75%；净利润2.03亿元，同比增长2.85%；不派息。
2025-10-27Q3 2025 revenue 1.187 billion yuan, +8.50% YoY; net profit 41.19 million yuan, -61.48% YoY. 9M revenue 3.437 billion yuan, +7.35% YoY; net profit 244 million yuan, -19.75% YoY. Net profit decline due to NTD exchange rate impact on storage chip cost and gross margin.2025年第三季度营收11.87亿元，同比增长8.50%；净利润4118.94万元，同比下降61.48%。前三季度营收34.37亿元，同比增长7.35%；净利润2.44亿元，同比下降19.75%。净利润下降因台币汇率波动影响存储芯片成本及毛利率。
2025-11-24Ingenic reports Q1-Q3 2025 revenue of 3.437 billion yuan, up 7.35% YoY; net profit attributable to shareholders of 255.74 million yuan, down 15.99% YoY.北京君正报告2025年前三季度营业收入34.37亿元，同比增长7.35%；归母净利润2.5574亿元，同比下降15.99%。
2026-01-29Ingenic issued 2025 annual performance forecast: revenue ~47.4 billion yuan (+12.52% YoY); net profit 370-403 million yuan (+1.05%-10.05% YoY), driven by recovery in automotive/industrial/medical markets and the upturn in niche DRAM demand.北京君正发布2025年度业绩预告：营业收入约47.4亿元（同比增长12.52%）；净利润3.70亿元-4.03亿元（同比增长1.05%-10.05%），受益于汽车/工业/医疗市场复苏及利基型DRAM需求上行周期。
2026-03-272025 annual results: revenue 4.741 billion yuan (+12.54% YoY), net profit 376 million yuan (+2.74% YoY); proposed dividend of 1.50 yuan per 10 shares.2025年年报：营业收入47.41亿元（同比+12.54%），归母净利润3.76亿元（同比+2.74%）；拟每10股派发现金红利1.50元。
2026-04-28Ingenic reported Q1 2026 revenue of 1.56 billion yuan, up 47.12% YoY; net profit of 319 million yuan, up 331.61% YoY; gross margin 43.49%, up 7.09 ppt YoY; net margin 20.54%, up 13.59 ppt YoY.北京君正发布2026年一季报：营业收入15.6亿元，同比增长47.12%；净利润3.19亿元，同比增长331.61%；毛利率43.49%，同比上升7.09个百分点；净利率20.54%，同比上升13.59个百分点。
2026-05-11Ingenic Semiconductor reported Q1 2026 revenue of RMB 1.56 billion, up 47.12% YoY; net profit of RMB 319 million, up 331.61% YoY. Storage chip revenue growth mainly driven by price increases.北京君正公布2026年第一季度营收15.6亿元，同比增长47.12%；归母净利润3.19亿元，同比增长331.61%。存储芯片收入增长主要来自价格提升。
2026-07-13Ingenic Semiconductor forecasts H1 2026 net profit of RMB 1.079-1.282 billion, up 431%-531% YoY; revenue ~RMB 3.989 billion, up ~77% YoY, driven by DRAM price hikes, Flash volume growth from AI servers/optical modules, and compute chip price increases due to KGD shortage.北京君正预计2026年上半年归母净利润10.79亿-12.82亿元，同比增长431%-531%；营收约39.89亿元，同比增长约77%，主要受DRAM涨价、AI服务器/光模块带动Flash销量增长及KGD缺货导致计算芯片涨价推动。
2026-08-01H1 2026 net profit forecast 1.079-1.282 billion yuan, up 431%-531% YoY; non-GAAP net profit 1.049-1.253 billion yuan, up 552%-679%.2026年上半年净利润预告10.79亿至12.82亿元，同比增长431%-531%；扣非净利润10.49亿至12.53亿元，同比增长552%-679%。
2026-08-10Voluntary disclosure of H1 2026 financials: total current assets 9.727 billion yuan (end-June) vs 8.693 billion at year-end; current liabilities 1.284 billion vs 1.0 billion.自愿披露2026年上半年财务数据：截至6月30日流动资产合计97.27亿元，上年末86.93亿元；流动负债12.84亿元，上年末10亿元。
2026-08-102025 revenue 4.741 billion yuan, net profit 375 million; Q1 2026 revenue 1.56 billion (+47.12% YoY), net profit 320 million, gross margin 42.58%.2025年收入47.41亿元，净利润3.75亿元；2026年一季度收入15.60亿元（同比+47.12%），净利润3.20亿元，毛利率42.58%。
Subsidiary operations & integration子公司运营与整合
5 · 2024-01-30 → 2026-03-16
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Operational status and integration progress of subsidiaries like ISSI, Hefei Ingenic, and the Israel unit.ISSI、合肥君正、以色列子公司等子公司的运营状况和整合进展。
2024-01-30Ingenic reported that its subsidiary Shanghai Yingzhanike Microelectronics (英瞻尼克) currently has no specific business operations.北京君正表示子公司上海英瞻尼克微电子目前暂无具体业务。
2024-08-12Responded that post-acquisition synergy with ISSI in technology, products, market, and sales is progressing continuously.回应称收购ISSI后在技术、产品、市场和销售等方面的协同发展持续推进。
2025-01-06Ingenic Semiconductor confirmed its Israeli subsidiary is operating normally, refuting rumors of dissolution.北京君正确认其以色列子公司正常经营，辟谣解散传闻。
2025-07-21Ingenic stated that its computing chip R&D is mainly handled by the parent company, while Hefei Ingenic is responsible for the R&D of the smart video product line.北京君正表示，公司计算芯片的研发主要由母公司负责，合肥君正负责智能视频产品线的研发工作。
2026-03-16Nor Flash business will continue to operate under ISSI as the main entity, unifying the brand; joint venture Shanghai Xinkai's operations are being consolidated.Nor Flash后续以ISSI为主体运营，统一品牌；合资公司上海芯楷运营被整合。
Robotics & smart hardware applications机器人与智能硬件应用
7 · 2024-02-23 → 2026-01-27
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Adoption of Ingenic chips in robot vacuums, pet robots, 3D printers, and other smart hardware.君正芯片在扫地机器人、宠物机器人、3D打印机及其他智能硬件中的应用。
2024-02-23Ingenic Semiconductor confirmed it has cooperative customers in intelligent robots, with products under development.北京君正确认有智能机器人方面的合作客户，产品正在开发中。
2025-03-24Ingenic Semiconductor stated that its storage products are mainly used in industrial robots, and it will actively follow up on the robot market to develop new customers.北京君正表示其存储产品在机器人领域的应用目前主要为工业机器人，公司将积极跟进机器人市场，不断开拓新客户。
2025-04-28Ingenic Semiconductor stated that its storage and analog chips are used in robotics, currently mainly industrial robots.北京君正表示，其存储和模拟芯片均有产品用于机器人领域，目前主要为工业机器人。
2025-06-04Ingenic Semiconductor stated that its products are not currently used in humanoid robots.北京君正表示，公司产品目前未应用于人形机器人领域。
2025-10-29Storage chips and analog chips are used in industrial robots and hotel robots; computing chips are used in扫地机器人 (sweeping robots) and斗宠机器人 (pet-fighting robots).存储芯片和模拟芯片已应用于工业机器人、酒店机器人等领域；计算芯片应用于扫地机器人、斗宠机器人等领域。
2025-12-30Ingenic stated that its storage and analog chips are used in industrial robots and hotel robots; computing chips are used in扫地机器人 (sweeping robots) and斗宠机器人 (pet-fighting robots).北京君正表示公司存储芯片和模拟芯片应用于工业机器人、酒店机器人等领域，计算芯片应用于扫地机器人、斗宠机器人等领域。
2026-01-27Ingenic's storage chips are used in industrial robots and hotel robots.北京君正存储芯片已应用于工业机器人、酒店机器人等领域。
AI technology & NPU deploymentAI技术与NPU部署
7 · 2024-02-29 → 2026-03-05
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Ingenic's self-developed NPU and AI algorithms, focusing on edge AI for smart cameras and other computing chips, and clarifications on AI chip positioning.君正自研NPU和AI算法，专注于智能摄像头等计算芯片的边缘AI，并澄清AI芯片定位。
2024-02-29Ingenic Semiconductor disclosed that it provides necessary security hardware at chip level, while network security is handled by software companies.北京君正披露芯片层面提供必要的安全硬件，网络安全由软件公司主导。
2024-12-09Ingenic Semiconductor clarified it does not produce AI chips, but has AI technologies such as algorithms and NPU applied in some computing chip products.北京君正澄清没有AI芯片，但有算法、NPU等AI技术，应用在部分计算芯片产品中。
2024-12-30Ingenic Semiconductor confirmed it is conducting R&D on edge-side algorithms and related technologies.北京君正确认正在进行端侧算法及相关技术的研发。
2025-01-14Ingenic stated it has invested in AI technology for years, with independently controllable NPU and AI algorithms applied in some computing chips; clarified it does not have a dedicated 'AI chip'.北京君正表示在AI技术方面持续投入多年，拥有自主可控的NPU和AI算法，应用于部分计算芯片；澄清没有专门的AI芯片。
2025-02-12Ingenic Semiconductor disclosed that its AI computing power engine balances computing efficiency and flexibility, with low-bit quantization enhancing low-power and low-bandwidth AI computing capabilities.北京君正披露，其AI算力引擎兼顾计算效能与灵活性，低比特量化技术强化了低功耗与低带宽AI计算能力。
2025-02-17Ingenic Semiconductor stated that large models do not run directly on its chips, but some customer products as edge devices connect to different cloud large models.北京君正表示，大模型并未直接运行在其芯片上，但有些客户的产品作为端侧接入不同的云端大模型。
2026-03-05AI technology is primarily focused on edge-side applications.AI技术主要面向端侧应用。
Product portfolio & market positioning clarifications产品组合与市场定位澄清
22 · 2024-03-11 → 2026-03-03
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Clarifications on product scope, target markets, and competitive positioning across various segments.对各细分领域的产品范围、目标市场和竞争定位的澄清。
2024-03-11Ingenic stated it has no GPU products.北京君正表示公司没有GPU产品。
2024-03-11Ingenic stated its products are not used in smartphones, PCs, or servers.北京君正表示其产品不用于手机、电脑和服务器。
2024-03-18Ingenic confirmed its chips can be used in optical communication modules.北京君正确认其芯片可应用于光通信模块。
2024-03-28Ingenic stated it does not have CXL (Compute Express Link) technology.北京君正表示公司没有CXL（Compute Express Link）技术。
2024-07-04Ingenic Semiconductor stated on investor platform that it does not have an independent GPU product; its main products are embedded MPU processors.北京君正在投资者互动平台表示，公司没有独立的图形处理器产品，主要产品为嵌入式MPU处理器产品。
2024-10-24Ingenic stated that its products can achieve domestic substitution (import replacement).北京君正表示，公司产品可实现国产替代。
2024-11-14Confirmed no cooperation with Moore Threads (Mole Thread).确认与摩尔线程没有合作。
2024-11-18Disclosed no plan to acquire or invest in 3D NAND.披露目前未考虑收购或参股3D NAND。
2024-11-18Disclosed no 7nm products and no GPU chip development plan.披露没有7nm产品，且没有研发GPU芯片规划。
2024-11-21Disclosed no 3D sensing technology or products currently.披露目前暂未有3D感知相关技术和产品。
2024-12-24Ingenic Semiconductor confirmed it has not yet started R&D on in-memory computing products.北京君正确认尚未进行存内计算相关产品的研发。
2024-12-24Ingenic Semiconductor clarified it does not produce custom chips.北京君正澄清没有定制芯片。
2025-02-11Ingenic Semiconductor stated it has no LPU-related products or technologies.北京君正表示，没有LPU方面的产品和技术。
2025-02-28Ingenic Semiconductor stated that it has no cooperation with Yangtze Memory Technologies (长江存储).北京君正表示，与长江存储暂无合作。
2025-04-10Ingenic Semiconductor stated it has no current plan to develop 3D NAND flash.北京君正表示，公司目前没有计划研发3D NAND闪存。
2025-04-23Ingenic Semiconductor confirmed it has a photoelectric conversion driver chip for GPON (gigabit optical modules).北京君正确认，公司有用于千兆光模块（GPON）的光电转换驱动芯片。
2025-06-26Ingenic Semiconductor confirmed it is not a member of the CXL (Compute Express Link) consortium.北京君正确认目前不是CXL联盟成员。
2025-07-09Ingenic stated that it currently has no products used in AI PCs.北京君正表示，公司暂无产品用于AIPC。
2025-07-11Ingenic stated that it currently has no products used in drones.北京君正表示，目前公司无产品用于无人机。
2025-07-14Ingenic stated that it has no plans to develop Micro-LED technology.北京君正表示，目前没有开发Micro-LED技术的计划。
2025-09-01Ingenic Semiconductor confirmed it has no cooperation with DJI Technology or Insta360 (影石创新科技).北京君正确认目前与大疆科技和影石创新科技没有合作。
2026-03-03RISC-V series products are not automotive-grade; no plan for automotive-grade RISC-V MCU.RISC-V系列产品非车规级；暂无车规级RISC-V MCU的规划。
Automotive market penetration汽车市场渗透
7 · 2024-03-28 → 2025-10-13
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Growing adoption of Ingenic's storage, analog, and interconnect chips across global automotive brands and Tier 1 suppliers.君正的存储、模拟和互联芯片在全球汽车品牌和Tier 1供应商中的采用率不断提高。
2024-03-28Ingenic stated its automotive chips are used in most automotive brands in the market.北京君正表示其汽车芯片应用于市场上大部分汽车品牌。
2024-10-10Ingenic stated that its automotive-grade products are used in most automotive brands.北京君正表示，公司车规产品应用于大部分的汽车品牌中。
2024-11-22Disclosed that automotive market revenue accounts for >40% of both storage chip and analog & interconnect chip product lines.披露存储芯片和模拟互联芯片产品线来自车规市场的收入均占40%以上。
2024-12-30Ingenic Semiconductor stated that most domestic and foreign automakers use its chips, including those from the ISSI acquisition.北京君正表示国内外大部分车企都采用其芯片（包括收购ISSI后的产品）。
2025-02-11Ingenic Semiconductor stated that its products are used in most domestic and foreign automotive brands.北京君正表示，其产品在国内外大部分汽车品牌中都有应用。
2025-04-03Ingenic Semiconductor stated that most major global Tier1 suppliers are its customers, and most automotive brands use its chips; it has no current DRAM price increase plan.北京君正表示，全球大部分主要Tier1厂商均为其客户，对应大部分汽车品牌均采用其芯片；目前没有DRAM涨价计划。
2025-10-13Automotive-grade SRAM and DRAM products rank first among mainland China-headquartered companies per Frost & Sullivan survey.根据弗若斯特沙利文调研数据，公司车规SRAM、车规DRAM产品于总部位于中国大陆的公司中均排名第一。
Shareholder changes股东变动
1 · 2024-04-10
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Shanghai Jicen ceased to be a shareholder holding 5% or more of the company's shares.上海集岑不再持有公司5%以上股份。
2024-04-10Shanghai Jicen is no longer a shareholder holding 5% or more of the company's shares.上海集岑不再是公司持股5%以上股东。
Equity incentive plans股权激励计划
7 · 2024-04-12 → 2026-06-03
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The 2024 restricted stock incentive plan, its grants, vesting schedules, and adjustments.2024年限制性股票激励计划及其授予、归属安排和调整。
2024-04-12Ingenic announced a 2024 restricted stock incentive plan: up to 4.3235 million shares (0.90% of total) at RMB 31.09 per share, covering 351 initial grantees including directors, senior management, and core staff.北京君正公布2024年限制性股票激励计划：拟授予不超过432.35万股（占总股本0.90%），授予价31.09元/股，首次授予激励对象351人，包括董事、高管及核心骨干。
2024-05-14Ingenic Semiconductor's board approved the 2024 restricted stock incentive plan, granting 3.917 million shares at RMB 31.09 per share on May 14, 2024.北京君正董事会批准2024年限制性股票激励计划，首次授予391.7万股，授予价格31.09元/股，授予日为2024年5月14日。
2024-11-19Disclosed that an equity incentive plan has been implemented for core technical employees.披露已实施股权激励计划，以激励核心技术员工。
2025-01-06Ingenic disclosed it released an equity incentive plan in 2024.北京君正披露2024年度发布了股权激励计划。
2025-06-11Ingenic Semiconductor announced the first vesting of its 2024 restricted stock incentive plan: 970,000 shares (0.20% of total shares) became tradable on June 13, 2025, covering 311 participants.北京君正公告2024年限制性股票激励计划首次授予第一个归属期归属结果：97万股（占总股本0.20%）于2025年6月13日上市流通，涉及311名激励对象。
2026-05-22Ingenic's board approved adjusting the grant price of the 2024 restricted stock incentive plan.北京君正董事会审议通过调整2024年限制性股票激励计划授予价格的议案。
2026-06-03Ingenic Semiconductor completed the second vesting of the first grant and first vesting of the reserved grant under the 2024 restricted stock incentive plan, vesting 1,123,644 shares (0.23% of total shares) for 360 employees, effective June 8, 2026.北京君正完成2024年限制性股票激励计划首次授予第二个归属期及预留授予第一个归属期归属，归属112.36万股（占总股本0.23%），涉及360名员工，于2026年6月8日上市流通。
Related-party leasing & transactions关联租赁与交易
2 · 2024-04-12 → 2025-08-21
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Leasing idle office space to Beijing Huaru Technology and clarifying no other business dealings.向北京华如科技出租闲置办公场所，并澄清无其他业务往来。
2024-04-122024 related-party transaction estimate: leasing idle office space to Beijing Huaru Technology for up to RMB 8.5 million.2024年度日常关联交易预计：将闲置办公用房租赁给北京华如科技，金额不超过850万元。
2025-08-21Ingenic Semiconductor stated that it leases part of its building to Huaru Technology, with no other business dealings.北京君正表示将部分房屋租赁给华如科技，除此之外没有其他业务往来。
Global market & sales expansion全球市场与销售拓展
2 · 2024-04-15 → 2025-01-10
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Completed global sales network for video products, attended CES 2025, and promoted overseas markets.完成视频产品全球销售网络布局，参加CES 2025并拓展海外市场。
2024-04-15Ingenic stated that its computing chip business has completed a global sales network layout for video products and will promote overseas markets.北京君正表示，视频业务已完成全球销售网络布局，后续将在海外市场推广。
2025-01-10Ingenic's marketing staff attended CES 2025 in Las Vegas for product promotion.北京君正市场人员前往2025年拉斯维加斯CES进行产品推广。
Trade policy & tariff impact贸易政策与关税影响
3 · 2024-05-17 → 2025-04-21
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Assessments of the impact of US tariffs and trade wars on Ingenic's business.评估美国关税和贸易战对君正业务的影响。
2024-05-17Ingenic Semiconductor stated that its exports from China to the US account for a small portion of sales, and US tariff increases have little impact.北京君正表示，由中国大陆向美国出口的产品销售占比较小，美国加收关税影响不大。
2025-04-08Ingenic Semiconductor stated that its direct exports to the US and imports from the US are both small, and the trade war/tariffs have little impact on the company.北京君正表示，公司直接出口美国以及进口美国的业务占比均较小，贸易战/关税对公司影响不大。
2025-04-21Ingenic Semiconductor stated that tariffs affect both its DRAM and analog product lines; for DRAM, US-based production may be impacted; for analog, China's origin tariffs may boost domestic chip sales and price stability.北京君正表示，关税对其DRAM和模拟两条产品线均有影响；DRAM方面，美系厂商在美国的生产基地可能受影响；模拟方面，中国原产地关税可能促进国内芯片销售和价格稳定。
Capital allocation & corporate actions资本配置与公司行动
12 · 2024-05-21 → 2026-08-01
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Dividends, buybacks, wealth management, project changes, and other capital allocation decisions.分红、回购、理财、项目变更及其他资本配置决策。
2024-05-21Ingenic Semiconductor announced a 2023 annual cash dividend of RMB 2.00 per 10 shares (total ~RMB 96.31 million), with record date May 27 and ex-date May 28, 2024.北京君正公告2023年度每10股派发现金红利2元（合计约9631万元），股权登记日2024年5月27日，除权除息日2024年5月28日。
2024-11-25Disclosed no plan for share buyback; cash dividend plan to be disclosed in annual report.披露暂无回购计划；现金分红计划请关注后续年度报告。
2024-12-04Ingenic Semiconductor and its subsidiaries plan to use up to 2 billion yuan of idle自有资金 to purchase low-risk wealth management products, effective for one year from board approval.北京君正及其控股子公司拟使用不超过20亿元闲置自有资金购买低风险理财产品，有效期自董事会审议通过之日起一年内。
2024-12-24Ingenic Semiconductor stated it currently has no share buyback plan.北京君正表示目前暂无回购计划。
2025-04-19Ingenic Semiconductor announced partial changes and delays to its raised-fund investment projects, with the sponsor issuing verification opinions.北京君正公告部分募集资金投资项目变更及延期，保荐机构出具了核查意见。
2025-06-16Ingenic Semiconductor announced a cash dividend of 0.997988 yuan per 10 shares (total ~48.16 million yuan), with record date June 23 and ex-dividend date June 24, 2025.北京君正公告每10股派发现金红利0.997988元（含税），共分配约4816万元，股权登记日2025年6月23日，除权除息日2025年6月24日。
2025-12-12Ingenic's 6th Board of Directors 8th meeting on Dec 10 approved the proposal on using part of idle raised funds for cash management.北京君正第六届董事会第八次会议于12月10日审议通过了《关于使用部分闲置募集资金进行现金管理的议案》。
2026-03-27Board approved adjustments to two募投 projects: adding AI MCU chips to the embedded MPU project, extending implementation to Shenzhen Junzheng, and extending completion to 2029-09-01.董事会批准调整两个募投项目：嵌入式MPU项目增加AI MCU芯片，实施地点扩展至深圳君正，完成时间延长至2029年9月1日。
2026-05-12Ingenic announced 2025 annual cash dividend: RMB 1.5 per 10 shares (tax incl.), total RMB 72.38 million, with record date May 19 and ex-dividend date May 20, 2026.北京君正公告2025年度分红：每10股派发现金红利1.5元（含税），合计7238.11万元，股权登记日5月19日，除权除息日5月20日。
2026-05-22Ingenic closed the 'Hefei Ingenic R&D Center Project' and will permanently supplement working capital with remaining raised funds of RMB 14.9799 million.北京君正将‘合肥君正研发中心项目’结项，节余募集资金1497.99万元永久补充流动资金。
2026-07-31Controlling shareholder and chairman Liu Qiang proposed a share buyback of RMB 100-200 million via centralized bidding, for future equity incentives or employee stock ownership plans.控股股东、实控人暨董事长刘强提议公司以1亿-2亿元回购A股股份，用于未来股权激励或员工持股计划。
2026-08-01Chairman Liu Qiang proposed a share buyback of 100-200 million yuan for equity incentives/ESOP, with price cap at 150% of 30-day average.董事长刘强提议回购1亿至2亿元股份用于股权激励或员工持股计划，回购价格上限为前30个交易日均价的150%。
Investor relations & strategy disclosure投资者关系与战略披露
2 · 2024-06-21 → 2025-05-14
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Disclosed 'Compute + Storage + Analog' strategy, market focus, and AI computing engine progress at investor events.在投资者活动中披露“计算+存储+模拟”战略、市场重点及AI计算引擎进展。
2024-06-21Ingenic Semiconductor held an investor event, disclosing its 'Compute + Storage + Analog' product strategy, global market strategy, and focus on automotive electronics, industrial, medical, security surveillance, and AIoT. The company stated its self-developed AI computing engine is continuously improving, and it is developing higher-process-node products.北京君正举办投资者活动，披露‘计算+存储+模拟’产品战略、全球化市场战略，重点布局汽车电子、工业、医疗、安防监控、智能物联网等领域；自研AI算力引擎持续增强，并正在研发更高工艺节点产品。
2025-05-14Ingenic stated at the 2024 annual performance briefing that its R&D investment is focused on CPU cores and high-compute NPUs, and it plans to launch higher-compute chips for broader applications; recovery in automotive and industrial markets and AI development will drive growth.北京君正在2024年度业绩说明会上表示，研发投入聚焦CPU内核和高算力NPU，计划推出更高算力芯片以应用于更多领域；汽车、工业行业复苏及AI发展将推动增长。
Foundry & supply chain partnerships代工与供应链合作
6 · 2024-07-19 → 2026-04-20
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Relationships with foundries like TSMC, GlobalFoundries, Powerchip, and Wuhan Xinxin, including guarantees and capacity constraints.与台积电、格芯、力晶、武汉新芯等代工厂的合作关系，包括担保和产能限制。
2024-07-19Ingenic's wholly-owned subsidiary Beijing Xicheng Semiconductor provided a guarantee for its subsidiary Luomingxin Microelectronics International to purchase products from Vanguard International Semiconductor Corporation, effective July 18, 2024.北京君正全资子公司北京矽成半导体为全资子公司络明芯微电子国际向Vanguard International Semiconductor Corporation购买产品提供担保，生效日期为2024年7月18日。
2024-11-08Disclosed that NOR Flash is mainly manufactured at Wuhan Xinxin (XMC), computing chips at GlobalFoundries and TSMC.披露NOR Flash主要在武汉新芯代工，计算芯片在格罗方德和台积电代工。
2025-03-21Ingenic Semiconductor's wholly-owned subsidiary Beijing Sisheng Semiconductor provided guarantees for three subsidiaries' purchase orders with TSMC, effective from 2025-04-01 for two years.北京君正全资子公司北京矽成半导体为三家子公司向台积电的采购订单提供担保，自2025年4月1日起生效，担保期限两年。
2025-07-02Ingenic stated that it will consider foundry partners' technology, process, and capacity when developing next-generation DRAM products, in response to a question about cooperation with Powerchip on MOSAIC memory technology.北京君正表示，开发新一代DRAM产品时会综合考虑代工厂的技术、工艺和产能等因素，回应关于与力积电合作MOSAIC内存技术的问题。
2025-12-05Ingenic stated that it is mainly R&D and sales, products are outsourced, and it cooperates with multiple well-known foundries, planning production in advance based on demand.北京君正表示公司主要是研发和销售，产品为委外加工，与多个知名代工厂合作，会根据需求提前进行生产规划。
2026-04-20Ingenic's wholly-owned subsidiary ISSI provided a guarantee for its Taiwan branch (ISSI Cayman Taiwan Branch) to secure funding for payments to Powerchip Semiconductor Manufacturing Corporation (PSMC) for purchase orders, effective from Jun 1, 2026 to Sep 30, 2029.北京君正全资子公司ISSI为其台湾分公司（ISSI开曼台湾分公司）提供担保，以确保向力积电（PSMC）支付采购订单款项，担保生效日期为2026年6月1日至2029年9月30日。
Smart glasses & wearable applications智能眼镜与可穿戴应用
1 · 2024-08-19
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Use of Ingenic's T-series and M-series chips in AI glasses and other wearable devices.君正T系列和M系列芯片在AI眼镜及其他可穿戴设备中的应用。
2024-08-19Stated that the company's products currently have no application in AI smart glasses.表示公司产品目前没有在AI智能眼镜领域的应用。
Industry consortium & partnership status行业联盟与合作伙伴关系
2 · 2024-08-23 → 2024-10-16
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Clarifications on membership or cooperation with industry alliances and other companies.对行业联盟或其他公司成员资格或合作的澄清。
2024-08-23Confirmed that the company is not a member of the SparkLink Alliance (星闪联盟).确认公司不是星闪联盟成员。
2024-10-16Ingenic stated it has over 700 R&D personnel and has not developed Spark (NearLink) technology.北京君正表示，目前研发人员七百多人，未研发星闪技术。
Corporate governance & board changes公司治理与董事会变动
6 · 2024-09-10 → 2026-03-26
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Board elections, director appointments and resignations, and related governance matters.董事会选举、董事任命与辞职及相关治理事项。
2024-09-10Ingenic Semiconductor announced a change in the sponsor representative for its major asset restructuring (acquisition of Beijing Xicheng Semiconductor and Shanghai Chengyu), with Guan Renhao replacing Zhang Jianlei.北京君正公告重大资产重组（收购北京矽成半导体和上海承裕）的独立财务顾问主办人变更，管仁昊接替张建磊。
2024-12-04Ingenic Semiconductor announced the convening of its first extraordinary general meeting of 2024 on December 20, to elect the sixth board of directors and approve independent director allowances.北京君正公告于2024年12月20日召开2024年第一次临时股东大会，审议第六届董事会选举及独立董事津贴等议案。
2024-12-04Ingenic Semiconductor held a职工代表大会 on December 3, electing Zhou Yue as the employee representative supervisor for the sixth board of supervisors.北京君正于2024年12月3日召开职工代表大会，选举周悦为第六届监事会职工代表监事。
2024-12-20Ingenic Semiconductor held its sixth board's first meeting, appointing a new board secretary and completing board elections.北京君正召开第六届董事会第一次会议，聘任董事会秘书并完成董事会换届。
2025-08-25Ingenic Semiconductor announced independent director Liu Yue resigned; Xiang Zuo nominated as replacement, pending SZSE approval.北京君正公告独立董事刘越辞职，提名向左为继任者，待深交所审核。
2026-03-26Director Yu Renrong resigned due to personal work reasons, effective immediately; he will no longer hold any position in the company.董事虞仁荣因个人工作原因辞职，辞职后不再担任公司任何职务。
Memory market & pricing dynamics存储市场与定价动态
5 · 2024-10-29 → 2026-06-26
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Observations on DRAM/NOR Flash market cycles, price trends, and competitive landscape.对DRAM/NOR Flash市场周期、价格趋势和竞争格局的观察。
2024-10-29Ingenic stated that the security surveillance market is the most competitive among its three product lines; it expects the automotive market to improve next year; DRAM declined slightly QoQ in Q3 while Flash grew.北京君正表示，安防监控是三个产品线中竞争最激烈的；预计明年汽车市场好转；第三季度DRAM环比小幅下降，Flash环比增长。
2026-03-13Product prices are adjusted quarterly with some upward adjustments.产品价格逐季有一定上调。
2026-04-08Ingenic stated that prices for computing chips have also been raised; specific growth will be disclosed in the Q1 report.北京君正表示计算芯片销售价格也已上调，具体增长情况关注一季报。
2026-04-08Ingenic said that for domestic customers, Q1 price increases are typically reflected in Q2 results; for overseas customers, the lag may be longer (Q2 or Q3).北京君正表示国内客户一季度涨价通常在二季度体现；海外客户情况复杂，可能在二季度或三季度体现。
2026-06-26Ingenic Semiconductor stated that it has been continuously adjusting prices since Q1 2026, responding to investor questions about long-term fixed-price contracts signed in 2025.北京君正表示自2026年第一季度已开始持续进行价格调整，回应关于2025年签署锁价长协订单的疑问。
M&A & investment strategy并购与投资策略
5 · 2024-11-13 → 2026-03-27
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Statements on M&A plans, investments in funds, and equity stakes in other companies.关于并购计划、基金投资和参股其他公司的声明。
2024-11-13Disclosed that currently there is no M&A plan.披露目前暂无并购计划。
2024-12-29Ingenic Semiconductor's wholly-owned subsidiary Shenzhen Ingenic Times invested as a limited partner in Hefei Fengyuan Renxin Equity Investment Partnership, focusing on semiconductor and new energy sectors.北京君正全资子公司深圳君正时代作为有限合伙人投资合肥冯源仁芯股权投资合伙企业，聚焦半导体及新能源领域。
2025-04-23Ingenic Semiconductor stated it currently has no M&A plans.北京君正表示，目前暂无并购计划。
2025-06-04Ingenic Semiconductor stated it has no current M&A plans.北京君正表示，公司目前没有并购计划。
2026-03-27Company plans to invest 200 million yuan in cash to subscribe for new capital of Rongxin Semiconductor (Ningbo) Co., Ltd., acquiring approximately 1.91% equity post-investment.公司拟以现金2亿元对荣芯半导体（宁波）有限公司增资，预计增资完成后持有其约1.91%股权。
Product mix & market segmentation产品结构与市场细分
3 · 2024-11-13 → 2025-02-14
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Clarified computing chip end-market split (over 80% surveillance) and domestic revenue shares by product line.说明计算芯片终端市场结构（监控超80%）及各产品线国内收入占比。
2024-11-13Disclosed that computing chips are primarily for consumer market, >80% for surveillance cameras.披露计算芯片主要面向消费类市场，80%以上面向安防监控类产品。
2025-01-13Ingenic said its computing chips are over 80% for security surveillance (civilian cameras), with the rest in fragmented markets like QR code devices, biometrics, education electronics, smart locks, printers.北京君正表示计算芯片80%以上用于安防监控（民用摄像头），其余用于二维码设备、生物识别、教育电子、智能门锁、打印机等碎片化市场。
2025-02-14Ingenic Semiconductor disclosed that most computing chip customers are domestic; storage chips have ~20% domestic revenue; analog chips have ~50% domestic revenue.北京君正披露，计算芯片大部分客户是国内客户；存储芯片约20%收入来自国内；模拟芯片约50%收入来自国内。
Software & IP development软件与IP开发
1 · 2024-11-29
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Registration of software copyrights and development of related software tools.软件著作权登记及相关软件工具的开发。
2024-11-29New software copyright registered: 'Ingenic GDBC Screening Tool Software V1.01'.新注册《君正GDBC筛片工具软件V1.01》软件著作权。
Process node advancement (21nm/20nm/16nm)工艺节点推进（21nm/20nm/16nm）
1 · 2024-12-03
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Development and launch of products on advanced process nodes (21nm, 20nm, 16nm) for DRAM and computing chips.在先进工艺节点（21nm、20nm、16nm）上开发和推出DRAM及计算芯片产品。
2024-12-03Ingenic Semiconductor expects to release 21nm samples around the end of 2024, based on market demand and product planning.北京君正预计2024年年末前后推出21nm样品，基于市场需求和产品规划。
Technology roadmap & process nodes技术路线与制程节点
2 · 2024-12-17 → 2025-08-21
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Stated no current demand for 6nm, but developing higher-process-node products and cloud-edge collaboration.表示当前无6nm需求，但正在开发更高制程产品及云边协同。
2024-12-17Ingenic Semiconductor stated its market segments currently have no demand for 6nm process technology development.北京君正表示其涉及的市场领域暂未开发6nm工艺的需求。
2025-08-21Ingenic Semiconductor disclosed that it is conducting internal R&D on cloud-edge collaboration.北京君正披露内部正在进行云边协同的相关研发。
Customer & OEM deals客户与OEM合作
4 · 2025-01-22 → 2026-04-09
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Specific customer adoptions, partnerships, and design wins across various product lines.各产品线的具体客户采用、合作和设计中标。
2025-01-22Ingenic and ChipMotion (XinDong Technology) celebrated a decade-long partnership, with ChipMotion providing IP and chip customization from 55nm to 3nm, integrated with Ingenic's CPU, NPU, ISP.北京君正与芯动科技庆祝合作十周年，芯动科技提供从55nm到3nm的IP和芯片定制服务，与北京君正的CPU、NPU、ISP深度融合。
2026-01-06Ingenic's subsidiary ISSI set up a negotiation area outside the 2026 CES exhibition to showcase storage products and invite customers.北京君正子公司ISSI在2026年CES展期间在场外设有洽谈区，展示各类存储产品并邀请客户洽谈。
2026-03-03NOR Flash is used in brand customers' intelligent servers; no confirmation of NVIDIA supply chain entry.NOR Flash已用于品牌客户的智能服务器中；未确认进入英伟达供应链。
2026-04-09Ingenic announced a partnership with Shengdewei (晟德微) to launch a millimeter-wave radar solution for two-wheeled vehicles.北京君正宣布与晟德微合作推出两轮车专用毫米波雷达方案。
RISC-V CPU core developmentRISC-V CPU核开发
3 · 2025-02-28 → 2026-01-30
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Development of self-developed RISC-V CPU cores (Victory series) and the gradual transition from MIPS to RISC-V architecture.自研RISC-V CPU核（Victory系列）的开发以及从MIPS向RISC-V架构的逐步过渡。
2025-02-28Ingenic Semiconductor stated that it has no plan to spin off its CPU team into a subsidiary to promote RISC-V market development.北京君正表示，目前无计划将CPU团队独立出来成立子公司以促进RISC-V市场开发。
2025-09-01Ingenic Semiconductor stated it will gradually transition from MIPS architecture to RISC-V architecture.北京君正表示将逐渐从MIPS架构转向RISC-V架构。
2026-01-30Ingenic stated that its RISC-V CPU is self-developed and currently has no cooperation with other manufacturers (denying partnership with Alibaba T-Head).北京君正表示其RISC-V CPU为自主研发，目前暂未与其他厂商合作（否认与阿里平头哥合作）。
3D DRAM development3D DRAM研发
8 · 2025-05-19 → 2026-06-22
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R&D on 3D DRAM technology for edge AI applications, including tape-out delays and foundry partnerships.面向边缘AI应用的3D DRAM技术研发，包括流片延迟和代工合作。
2025-05-19Ingenic's board approved changing the 'Vehicle ISP Chip R&D and Industrialization Project' to '3D DRAM Chip R&D and Industrialization Project', with the project entity changed from Hefei Ingenic Technology to Xincheng Semiconductor (Shanghai); the remaining 235.6028 million yuan in raised funds plus interest will be injected into Xincheng Semiconductor via Beijing Xicheng Semiconductor.北京君正董事会批准将“车载ISP系列芯片的研发与产业化项目”变更为“3D DRAM芯片的研发与产业化项目”，项目承担主体由合肥君正科技变更为芯成半导体（上海）；结余募集资金及收益净额23,560.28万元通过北京矽成半导体增资至芯成半导体（上海）。
2025-08-12Ingenic Semiconductor confirmed that 3D DRAM is still under R&D.北京君正确认3D DRAM仍在研发中。
2025-10-313D DRAM product is still under R&D; original plan is tape-out by end of 2025, not release and sampling.3D DRAM产品仍在研发中；原计划是2025年底投片，而非发布并送样。
2025-12-01Ingenic disclosed that it is developing 3D DRAM chips to match AI storage needs, and plans to launch larger-compute SoC and AI MCU chips for edge AI and large-model applications.北京君正披露正研发3D DRAM芯片以匹配AI存储需求，计划推出更大算力SoC及AI MCU芯片，布局边缘AI与大模型应用。
2025-12-30Ingenic stated that 3D DRAM is under development.北京君正表示3D DRAM正在研发中。
2026-01-26Ingenic confirmed its 3D DRAM uses TSV + hybrid bonding technology and supports coordination with NPU.北京君正确认其3D DRAM采用TSV+混合键合技术，支持与NPU协调。
2026-01-30Ingenic is developing 3D DRAM for the AI storage segment; its niche DRAM, SRAM, and Flash mainly target automotive, industrial, and medical markets.北京君正面向AI存储领域的3D DRAM正在研发中；利基型DRAM、SRAM、Flash主要面向汽车、工业医疗等市场。
2026-06-22Ingenic Semiconductor stated that its 3D DRAM is under intensive R&D, targeting edge-side large AI models, with DRAM design and DDR controller design teams collaborating.北京君正表示3D DRAM在紧密研发中，面向边缘端大模型，存储和计算团队协作提供完整解决方案。
New product development & tape-outs新产品开发与流片
3 · 2025-06-26 → 2025-12-03
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Disclosed multiple new products to tape out in 2025, including optoelectronic driver chips and 3D NAND.披露2025年多款新产品流片，包括光电驱动芯片和3D NAND。
2025-06-26Ingenic Semiconductor reported that its 5G/1.25G asymmetric optoelectronic driver chips for gigabit optical modules have been shipping steadily.北京君正表示用于千兆光模块的5G/1.25G非对称光电转换驱动芯片一直在稳定出货。
2025-08-12Ingenic Semiconductor disclosed that multiple new products will be taped out in 2025.北京君正披露2025年预计陆续进行多款新产品投片。
2025-12-03Ingenic stated that 3D NAND products are already being sold, and some products are under development.北京君正表示3D NAND已有产品销售，目前部分产品在研发中。
Hong Kong H-share listing香港H股上市
14 · 2025-08-25 → 2026-08-17
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The process of applying for and progressing towards a Hong Kong Stock Exchange main board listing.申请并推进香港联交所主板上市的过程。
2025-08-25Ingenic Semiconductor announced plan to issue H-shares and list on the Hong Kong Stock Exchange main board.北京君正公告拟发行H股并在香港联交所主板上市。
2025-10-27Filed H-share listing application with HKEX; China Securities Regulatory Commission requested supplementary materials on business model and large-model involvement.已向港交所提交H股上市申请；中国证监会要求补充说明业务模式及涉及大模型等事项。
2025-11-03CSRC requires Ingenic Semiconductor to supplement explanations on business model and matters involving large models in its overseas listing and issuance filing.中国证监会要求北京君正补充说明业务模式及涉及大模型等事项的境外发行上市备案。
2026-03-16Hong Kong IPO prospectus submitted on 2025-09-15 expired on 2026-03-15; Guotai Junan International was sole sponsor.2025年9月15日递交的港股招股书于2026年3月15日失效，国泰君安国际为独家保荐人。
2026-04-08Ingenic confirmed that its Hong Kong listing plan is still progressing.北京君正确认赴港上市计划仍在推进中。
2026-05-26Ingenic resubmitted its H-share listing application to the Hong Kong Stock Exchange, with Guotai Haitong as sole sponsor.北京君正重新向港交所提交H股上市申请，国泰海通为独家保荐人。
2026-06-01Ingenic Semiconductor (Beijing Junzheng) re-filed a Hong Kong IPO application on May 26, 2026, with Guotai Junan International as sole sponsor, seeking A+H dual listing.北京君正于2026年5月26日再次向港交所递交主板上市申请，独家保荐人为国泰君安国际，寻求A+H股两地上市。
2026-06-12China Securities Regulatory Commission (CSRC) received the filing materials for Ingenic Semiconductor's Hong Kong IPO.中国证监会已接收北京君正香港IPO的备案材料。
2026-06-25Ingenic Semiconductor received CSRC filing notice for H-share issuance, allowing up to 61.658 million shares to be listed on HKEX main board, valid for 12 months.北京君正收到中国证监会H股发行备案通知书，拟发行不超过6165.8万股在香港联交所主板上市，有效期12个月。
2026-07-03CSRC issued filing acceptance notice for Ingenic's overseas listing; company plans to issue up to 61.658 million H-shares on the Hong Kong Stock Exchange main board.中国证监会出具北京君正境外发行上市备案通知书，公司拟发行不超过6165.8万股境外上市普通股并在港交所主板上市。
2026-08-03HKEX Listing Committee reviewed H-share listing application on July 30; hearing letter received July 31, not formal approval.港交所上市委员会于7月30日审议H股上市申请，7月31日收到聆讯信函，不构成正式批准。
2026-08-09Passed HKEX main board listing hearing; updated post-hearing information pack published; sole sponsor Guotai Junan International.通过港交所主板上市聆讯；更新聆讯后资料集；独家保荐人为国泰君安国际。
2026-08-10Board approved H-share global offering and listing, securities name change to 'Junzheng Co., Ltd.' effective Aug 13, and bank credit facility up to 2 billion yuan.董事会通过H股全球发售及上市议案，证券简称变更为“君正股份”自8月13日生效，并申请不超过20亿元银行综合授信。
2026-08-17Published H-share prospectus on HKEX website and commenced Hong Kong public offering; price cap and offering details disclosed.在香港联交所网站刊发H股招股说明书并启动香港公开发售；披露发行价格上限及发售详情。
Financial report corrections财报更正
1 · 2025-11-24
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Corrected Q3 2025 report: reduced management expenses, increased net profit, reclassified cash flow item related to HK listing fees.更正2025年三季报：减少管理费用、增加净利润，并重新分类与港股上市费用相关的现金流项目。
2025-11-24Ingenic corrects its Q3 2025 report: reduces management expenses by 11.4378 million yuan, increases net profit by the same amount, and reclassifies the cash flow item from operating to financing activities, related to Hong Kong listing advisory fees.北京君正更正2025年三季报：调减管理费用1143.78万元，调增净利润1143.78万元，并将相关现金流从经营活动重分类至筹资活动，涉及香港上市申报中介费用。
Supply chain & capacity constraints供应链与产能限制
1 · 2026-05-11
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Computing chip capacity tight due to KGD supply constraints.因KGD供应限制，计算芯片产能紧张。
2026-05-11Ingenic disclosed that its computing chip capacity is tight due to KGD (Known Good Die) supply constraints.北京君正披露计算芯片因KGD（良品晶粒）影响出现产能紧张。
ESG & sustainability assessmentESG与可持续评估
1 · 2026-07-22
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Received B rating in CSI ESG assessment, ranking 21st among 22 digital chip design firms.获得中证ESG评级B级，在22家数字芯片设计公司中排名第21位。
2026-07-22Ingenic received B rating in CSI ESG assessment, ranking 21st among 22 companies in the digital chip design industry.北京君正中证ESG评级为B级，在数字芯片设计行业22家公司中排名第21位。
Market share & competitive position市场份额与竞争地位
1 · 2026-08-10
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Global 2025 market positions: SRAM #2, niche DRAM #7, NOR Flash #7, IP-Cam SoC #2, automotive SRAM #1.2025年全球市场地位：SRAM第2、利基DRAM第7、NOR Flash第7、IP-Cam SoC第2、车规SRAM第1。
2026-08-10Global market positions 2025: SRAM #2 with 23.9% share, niche DRAM #7 with 2.1%, NOR Flash #7 with 5.0%, IP-Cam SoC #2 with 17.6%; automotive SRAM #1 with ~60% share.2025年全球市场地位：SRAM第二（份额23.9%），利基DRAM第七（2.1%），NOR Flash第七（5.0%），IP-Cam SoC第二（17.6%）；车规SRAM第一（约60%份额）。
