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AI PC & AI phone storageAI PC与AI手机存储
6 · 2024-01-10 → 2025-05-12
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Longsys positions its storage products for AI PCs and AI phones, including LPDDR5, SSDs, and UFS.江波龙将其存储产品定位用于AI PC和AI手机，包括LPDDR5、SSD和UFS。
2024-01-10Longsys showcased its latest storage technologies at CES 2024, including embedded storage, SSDs, memory modules, and memory cards, and introduced a DDR5 RDIMM + PCIe SSD combo solution for AI servers; plans to launch LPDDR5 in 2024 for mobile phone demand.江波龙在CES 2024上展示了最新的存储技术和产品，包括嵌入式存储、固态硬盘、内存条和存储卡，并推出了DDR5 RDIMM与PCIe SSD的组合方案以匹配AI服务器需求；预计2024年推出LPDDR5产品以满足手机厂商需求。
2024-01-10Longsys stated its products can be used for AI PCs, and it is one of the few domestic companies that can simultaneously supply RDIMM server memory and eSSD server SSDs; DDR4, DDR5, and SSD products are widely used in PC scenarios.江波龙表示其产品可用于AIPC，是国内少数能同时供应RDIMM服务器内存和eSSD服务器固态硬盘的综合型半导体品牌企业；DDR4、DDR5、SSD产品广泛应用于PC等多种场景。
2024-06-26At MWC Shanghai 2024, showcased AI phone storage (UFS, QLC eMMC, LPDDR5), network communication storage (NAND-based MCP), wearable storage (ePOP4x), AI PC storage (LPCAMM2+XP series SSD), AI server storage (CXL 2.0 module + ORCA/UNCIA eSSD).在2024 MWC上海展会上，展示了AI手机存储（UFS、QLC eMMC、LPDDR5）、网络通讯存储（NAND-based MCP）、智能穿戴存储（ePOP4x）、AI PC存储（LPCAMM2+XP系列SSD）、AI服务器存储（CXL 2.0模块+ORCA/UNCIA系列eSSD）。
2024-08-19Longsys stated its storage products (SSD, memory modules, embedded products) are widely used in AI servers, AI PCs, and AI phones, and it collaborates closely with major customers on AI trends.江波龙表示其存储产品（固态硬盘、内存条、嵌入式产品）广泛应用于AI服务器、AI PC、AI手机，并与大客户在AI趋势上紧密合作。
2024-11-25Longsys disclosed that LPDDR5 products have entered mass production and are being delivered; LPDDR5X R&D preparations underway.江波龙披露LPDDR5产品已量产并批量交付；LPDDR5X已进行研发准备。
2025-05-12Longsys showcases storage products at an event themed 'Storage Meets AI', including AI PC SSDs, enterprise SSDs, and memory for AI servers, highlighting self-developed controller chips and PTM foundry services.江波龙以‘存储遇见AI’为主题展示存储新品，包括AI PC固态硬盘、企业级SSD及AI服务器内存，突出自研主控芯片和PTM存储Foundry服务。
Automotive-grade storage (eMMC, UFS, LPDDR)车规级存储（eMMC、UFS、LPDDR）
20 · 2024-01-12 → 2026-04-20
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Longsys develops automotive-grade eMMC, UFS, and LPDDR products, passing AEC-Q100 certification and entering major automakers' supply chains.江波龙开发车规级eMMC、UFS、LPDDR产品，通过AEC-Q100认证，进入主流车企供应链。
2024-01-12Longsys Technology Co., Ltd. (parent of Lexar) passed the TÜV Rheinland IATF 16949 automotive quality management system certification, covering both IATF 16949:2016 and ISO 9001:2015, audited in September 2023 and certified on December 17, 2023.江波龙科技有限公司（雷克沙母公司）通过了TÜV莱茵IATF 16949汽车行业质量管理体系认证，涵盖IATF 16949:2016和ISO 9001:2015双体系，于2023年9月审核、12月17日获证。
2024-01-29Longsys' automotive-grade UFS 2.1 product has completed verification at multiple automotive customers and is expected to start mass production and shipment in the first half of 2024.江波龙车规级UFS 2.1产品已在多个汽车客户端完成产品验证，预计将在2024年上半年开始量产出货。
2024-03-29Longsys confirmed it supplies FORESEE brand automotive DVR high-speed flash drives to Xiaomi Auto, but has not yet cooperated on automotive-grade storage chips.江波龙确认向小米汽车供应FORESEE品牌车载DVR高速闪存盘，但暂未开展车规级存储芯片合作。
2024-04-07Longsys disclosed that it supplies FORESEE brand automotive DVR high-speed flash drives to Xiaomi Auto, and maintains ongoing cooperation with Xiaomi on memory for multiple consumer smart terminals.江波龙披露向小米汽车供应FORESEE品牌车载DVR高速闪存盘，并与小米在多款消费类智能终端存储器业务上保持合作。
2024-04-07Longsys stated that its automotive-grade storage products, through Tier1 partnerships, have entered supply chains of mainstream auto brands including BYD, Xiaopeng, SAIC, and GAC.江波龙表示，通过与Tier1深度合作，车规级存储产品已进入比亚迪、小鹏、上汽、广汽等主流汽车品牌供应链。
2024-05-17Longsys showcased automotive-grade eMMC (AEC-Q100, -40°C to 105°C, 4GB-128GB) and UFS products, with UFS passing Qualcomm Snapdragon 8155 compatibility certification.江波龙展示车规级eMMC（AEC-Q100，-40°C至105°C，4GB-128GB）和UFS产品，UFS通过高通骁龙8155兼容性认证。
2024-05-31Longsys FORESEE automotive-grade UFS passed Qualcomm Snapdragon 8155 compatibility certification; working on 8295 compatibility.江波龙FORESEE车规级UFS通过高通骁龙8155兼容性认证；正在验证8295兼容性。
2024-06-12Automotive-grade eMMC and UFS have passed AEC-Q100 certification, operating from -40°C to +105°C; products are used in BYD, Xiaopeng, SAIC, GAC and other major auto brands.车规级eMMC、UFS已通过AEC-Q100认证，可实现-40°C至+105°C宽温域作业；产品已应用于比亚迪、小鹏、上汽、广汽等主流汽车品牌。
2024-07-12Longsys automotive-grade storage products have entered supply chains of multiple automakers including BYD, Xiaopeng, SAIC, and GAC.江波龙车规级存储产品已进入比亚迪、小鹏、上汽、广汽等多家车企供应链。
2024-09-19Automotive-grade storage products serve over 20 top domestic and foreign automotive brands, covering 10+ in-vehicle applications including DVR, ADAS, cockpit, IVI, instrument cluster, and T-box, with over 8 years of mass production experience.车规级存储产品已服务超过20家中外头部汽车品牌客户，覆盖DVR、ADAS、座舱、IVI、仪表和T-box等10余种车载应用，拥有超过8年量产服务经验。
2024-11-12Longsys confirmed its automotive-grade storage products are used in BYD, Xiaopeng, SAIC, GAC and other mainstream auto brands.江波龙确认其车规级存储产品已用于比亚迪、小鹏、上汽、广汽等主流汽车品牌。
2024-11-25Longsys stated it serves over 20 leading automotive brand customers globally, covering 10+ in-vehicle applications (DVR, ADAS, cockpit, IVI, T-box); over 8 years of mass production experience in automotive-grade storage.江波龙表示已服务超20家中外头部汽车品牌客户，覆盖10余种车载应用（DVR、ADAS、座舱、IVI、T-box）；车规级存储量产经验超8年。
2024-12-11Longsys confirmed that its automotive-grade storage products (e.g., eMMC) have entered the supply chains of multiple automakers and are widely used in mainstream car brands.江波龙确认其车规级存储产品（如eMMC）已进入多个车企的供应链系统，广泛应用于众多主流汽车品牌。
2025-01-15Longsys' FORESEE automotive-grade UFS won the 'Smart Cockpit Technology Innovation Award' in the 2024 Information and Communication Industry High-Quality Development 'Hardcore' Power List, marking the first domestically produced automotive-grade UFS in China.江波龙FORESEE车规级UFS荣获“2024年度信息通信业高质量发展‘硬核’力量榜”之“智能座舱技术创新奖”，系中国大陆首款车规级UFS。
2025-02-14Longsys confirmed its automotive-grade storage products have entered supply chains of multiple automakers, including XPeng and SAIC, and are widely used in mainstream car brands.江波龙确认其车规级存储产品已进入小鹏、上汽等多家主流汽车品牌的供应链系统。
2025-04-23At the 2025 Shanghai Auto Show, Longsys unveiled multiple new automotive-grade storage products: eMMC full-custom version (with WM6000 controller, up to 128GB, AEC-Q100 Grade2/3), automotive-grade UFS, LPDDR4x (2GB-8GB, 4266Mbps), and SPI NAND Flash (1Gb-4Gb), all meeting AEC-Q100 standards.在2025上海车展上，江波龙发布多款车规级存储新品：车规级eMMC全芯定制版（搭载WM6000主控，最高128GB，AEC-Q100 Grade2/3）、车规级UFS、LPDDR4x（2GB-8GB，4266Mbps）及SPI NAND Flash（1Gb-4Gb），均符合AEC-Q100标准。
2025-06-30Showcased four automotive-grade products (eMMC, UFS, LPDDR4x, SPI NAND Flash) and Lexar car-use storage at Shenzhen Automotive Electronics Industry Summit; automotive-grade LPDDR4x won the 'Excellent Innovative Product Award' from Shenzhen Automotive Electronics Association.在深圳汽车电子产业峰会展出eMMC、UFS、LPDDR4x、SPI NAND Flash四大车规级产品及Lexar雷克沙车用存储产品；车规级LPDDR4x获得深圳汽车电子协会颁发的卓越创新产品奖。
2026-01-05Launched automotive-grade eMMC with WM6000 controller (up to 128GB, AEC-Q100 Grade2/3) and automotive-grade LPDDR4x (2-8GB, 4266Mbps, Grade2).推出搭载WM6000主控的车规级eMMC（最高128GB，AEC-Q100 Grade2/3）和车规级LPDDR4x（2-8GB，4266Mbps，Grade2）。
2026-03-26Longsys confirmed it has entered the supply chain of numerous globally renowned automotive OEMs with its automotive-grade storage portfolio (UFS, eMMC, LPDDR, USB), and will deepen R&D and commercial projects with key clients.江波龙确认其车规级存储产品矩阵（UFS、eMMC、LPDDR、USB）已进入全球众多知名车企供应链，并将持续深化与知名客户的研发和商业化项目合作。
2026-04-20Disclosed automotive-grade storage products (UFS, eMMC, LPDDR, USB) have entered supply chain of North American smart car and autonomous driving tech giant.披露车规级存储产品（UFS、eMMC、LPDDR、USB）已进入北美智能汽车及自动驾驶科技巨头的供应链体系。
Zhongshan storage industrial park中山存储产业园
6 · 2024-01-17 → 2025-12-22
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Longsys builds Zhongshan storage industrial park for R&D, testing, and logistics, with phased completion and capacity expansion.江波龙建设中山存储产业园，用于研发、测试和物流，分阶段完工并扩产。
2024-01-17Longsys deputy general manager Yang Xiaobin revealed that the Zhongshan storage industrial park (total investment 1 billion yuan, 4.95 hectares) Phase II will include R&D building, embedded storage test center, data center storage dedicated line, and smart logistics warehouse, focusing on commercial, industrial, and automotive-grade memory test lines to expand high-end storage test capacity.江波龙副总经理杨晓斌透露，中山存储产业园（总投资10亿元，占地4.95公顷）二期项目包括研发大楼、嵌入式存储测试中心、数据中心存储专线、智能物流仓储，专注于商规级、工规级、车规级存储器测试生产线，扩大高端存储测试产能。
2024-04-21Longsys announced postponement of the 'Zhongshan Storage Industrial Park Phase II' project, with expected completion date moved from April 2024 to April 2025.江波龙宣布将募投项目“中山存储产业园二期建设项目”达到预定可使用状态时间由2024年4月延期至2025年4月。
2024-06-30Zhongshan Storage Industrial Park Phase II completed acceptance inspection and is expected to be officially operational by end of 2024; Shenzhen-Zhongshan bridge opened, enhancing connectivity between Shenzhen HQ and Zhongshan park.中山存储产业园二期已完成竣工验收，预计2024年底正式启用；深中通道通车，加强了深圳总部与中山产业园之间的联系。
2025-02-06Zhongshan Longsys achieved record output value of 2.65 billion yuan in 2024, with cumulative fixed asset investment exceeding 900 million yuan and R&D investment over 350 million yuan in the past three years.中山江波龙2024年实现产值26.5亿元，创历史新高，累计固定资产投入超9亿元，近三年研发总投入超3.5亿元。
2025-08-28Longsys subsidiary Hongxin Suhang's bonded warehouse was inaugurated at Zhongshan Storage Industrial Park, the first public bonded warehouse in Cuiheng New District.江波龙子公司鸿芯速航的保税仓库在中山存储产业园揭牌，为翠亨新区首家公用型保税仓。
2025-12-22Longsys cancelled some of its special accounts for raised funds after the 'Zhongshan Storage Industrial Park Phase II' and 'Enterprise and Industrial-Grade Memory R&D' projects reached their intended use state.江波龙注销部分募集资金专户，因“江波龙中山存储产业园二期建设项目”及“企业级及工规级存储器研发项目”已达到预定可使用状态。
Financial performance & forecasts财务业绩与预测
18 · 2024-01-26 → 2026-04-27
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Annual, quarterly, and forecasted financial results including revenue, net profit/loss, and key metrics.年度、季度及预测的财务业绩，包括收入、净利润/亏损及关键指标。
2024-01-26Longsys released 2023 annual performance forecast: expected net loss of 800 million to 860 million yuan (vs. profit of 72.8 million yuan in 2022), turning profit into loss; full-year revenue first exceeded 10 billion yuan (100-105 billion yuan); Q4 2023 revenue 3.5-4.0 billion yuan (QoQ +20%+, YoY +100%+), achieving quarterly net profit of 23-83 million yuan, turning profitable in Q4.江波龙发布2023年度业绩预告：预计净亏损8亿元至8.6亿元（上年同期盈利7279.70万元），同比转亏；全年营收首次突破百亿元（100-105亿元）；2023年第四季度营收35-40亿元（环比增长超20%，同比增长超100%），当季净利润0.23-0.83亿元，实现扭亏为盈。
2024-02-06Longsys forecasted a net loss of RMB 800-860 million for FY2023, compared to a profit of RMB 72.8 million in FY2022; Q4 2023 turned profitable with net profit of RMB 23-83 million and quarterly revenue of RMB 3.5-4.0 billion, achieving full-year revenue exceeding RMB 10 billion for the first time.江波龙预计2023年归母净亏损8亿至8.6亿元，上年同期盈利7279.7万元；2023年第四季度实现当季盈利，归母净利润0.23亿至0.83亿元，当季营收35亿至40亿元，全年营收首次突破100亿元。
2024-04-21Longsys released 2023 annual results: revenue CNY 10.125 billion (+21.55% YoY), net loss CNY 828 million (vs profit of CNY 72.8 million in 2022); R&D expenses CNY 594 million (+66.74% YoY).江波龙发布2023年年报：营业收入101.25亿元（同比+21.55%），净亏损8.28亿元（2022年净利润7279.7万元）；研发费用5.94亿元（同比+66.74%）。
2024-04-21Longsys released 2024 Q1 results: revenue CNY 4.453 billion (+200.54% YoY), net profit CNY 384 million (vs loss of CNY 280 million in Q1 2023), gross margin 24.39% (vs 1.27% in Q1 2023).江波龙发布2024年一季报：营业收入44.53亿元（同比+200.54%），净利润3.84亿元（上年同期亏损2.8亿元），毛利率24.39%（上年同期1.27%）。
2024-06-03Reported Q1 2024 revenue of 44.53 billion yuan, up 200.54% YoY; net profit of 384 million yuan, up 236.93% YoY.2024年第一季度实现营业收入44.53亿元，同比增长200.54%；归属净利润3.84亿元，同比增长236.93%。
2024-07-19Longsys releases 2024 H1 earnings forecast: net profit RMB 520-610 million, turning from loss of RMB 596 million YoY; revenue RMB 8.8-9.2 billion, up 137-148% YoY.江波龙发布2024年半年度业绩预告：净利润5.2亿-6.1亿元，同比扭亏（上年同期亏损5.96亿元）；营业收入88亿-92亿元，同比增长137%-148%。
2024-08-26Longsys reported H1 2024 revenue of RMB 9.039 billion, up 143.82% YoY; net profit attributable to shareholders was RMB 594 million, turning from a loss of RMB 596 million in H1 2023.江波龙2024年上半年营收90.39亿元，同比增长143.82%；归母净利润5.94亿元，去年同期为-5.96亿元，同比扭亏为盈。
2024-10-28Longsys reported Q3 2024 results: revenue RMB 42.29 billion (+47.28% YoY), net loss attributable to parent of RMB 36.84 million (narrowed 87.16% YoY); 9M 2024 revenue RMB 132.68 billion (+101.68% YoY), net profit RMB 557 million (+163.09% YoY).江波龙发布2024年三季报：第三季度营收42.29亿元（同比+47.28%），归母净利润-3683.8万元（同比收窄87.16%）；前三季度营收132.68亿元（同比+101.68%），归母净利润5.57亿元（同比+163.09%）。
2024-11-03Longsys reported Q1-Q3 2024 revenue of 13.268 billion yuan, up 101.68% YoY; net profit of 557 million yuan, turning profitable YoY.江波龙2024年前三季度营收132.68亿元，同比增长101.68%；净利润5.57亿元，同比扭亏。
2025-01-24Longsys released 2024 annual results forecast: net profit attributable to shareholders of 438-500 million yuan, turning from loss to profit; revenue 16.5-18.0 billion yuan, up 62.96%-77.78% YoY; enterprise storage sales ~900 million yuan, Brazil subsidiary Zilia revenue ~2.3 billion yuan (up ~120% YoY), Lexar brand global revenue ~3.5 billion yuan.江波龙发布2024年度业绩预告：归母净利润4.38亿-5亿元，同比扭亏为盈；营收165亿-180亿元，同比增长62.96%-77.78%；企业级存储销售约9亿元，巴西子公司Zilia收入约23亿元（同比增长约120%），Lexar品牌全球收入约35亿元。
2025-03-20Longsys released its 2024 annual report: revenue RMB 17.464 billion, up 72.48% YoY; net profit attributable to shareholders RMB 499 million, turning from a loss of RMB 828 million in 2023; enterprise storage business revenue reached RMB 922 million, up 666.3% YoY.江波龙发布2024年年报：营业收入174.64亿元，同比增长72.48%；归母净利润4.99亿元，同比扭亏（2023年亏损8.28亿元）；企业级存储业务收入9.22亿元，同比增长666.3%。
2025-04-03Longsys released 2024 annual report: revenue reached RMB 17.464 billion, up 72.48% YoY; net profit attributable to parent was RMB 499 million, up 160.24% YoY; Brazilian subsidiary Zilia contributed revenue of RMB 2.312 billion, up 120% YoY; Lexar brand global revenue reached RMB 3.53 billion in 2024.江波龙发布2024年年报：营收174.64亿元，同比增长72.48%；归母净利润4.99亿元，同比增长160.24%；巴西子公司Zilia收入23.12亿元，同比增长120%；Lexar品牌全球营收2024年达35.3亿元。
2025-04-27Longsys released 2025 Q1 report: revenue RMB 4.256 billion, net loss attributable to parent RMB 152 million; enterprise storage (eSSD and RDIMM) revenue reached RMB 319 million, up over 200% YoY; self-developed UFS 4.1 controller chip entered mass production.江波龙发布2025年一季报：营收42.56亿元，归母净利润-1.52亿元；企业级存储（eSSD和RDIMM）收入3.19亿元，同比增长超200%；自研UFS 4.1主控芯片实现量产。
2025-08-22Longsys reported H1 2025 revenue of RMB 10.196 billion (+12.80% YoY) and net profit of RMB 14.77 million (-97.51% YoY); Q2 revenue hit a record RMB 5.939 billion (+39.53% QoQ).江波龙2025年上半年营收101.96亿元（同比+12.80%），净利润1476.63万元（同比-97.51%）；第二季度营收59.39亿元（环比+39.53%），创单季新高。
2025-10-29Q3 2025 revenue 6.539 billion yuan, +54.60% YoY; net profit 698 million yuan, +1994.42% YoY. First three quarters revenue 16.734 billion yuan, +26.12%; net profit 713 million yuan, +27.95%.2025年第三季度营业收入65.39亿元，同比增长54.60%；净利润6.98亿元，同比增长1994.42%。前三季度营业收入167.34亿元，同比增长26.12%；净利润7.13亿元，同比增长27.95%。
2026-01-29FY2025 guidance: net profit RMB 1.25-1.55 billion (YoY +150.66% to +210.82%); Q4 non-GAAP net profit ~RMB 650-870 million; revenue RMB 22.5-23.0 billion.2025年度业绩预告：归母净利润12.5-15.5亿元（同比+150.66%至+210.82%）；第四季度扣非净利润约6.5-8.7亿元；营业收入225-230亿元。
2026-04-272025 annual report: revenue 22.766 billion yuan (+30.36% YoY), net profit 1.423 billion yuan (+185.41% YoY), proposed dividend 0.35 yuan per 10 shares.2025年年报：营业收入227.66亿元（同比+30.36%），净利润14.23亿元（同比+185.41%），拟每10股派发现金红利3.5元。
2026-04-272026 Q1 report: revenue 9.909 billion yuan (+132.79% YoY), net profit 3.862 billion yuan (vs loss of 152 million in prior year), turning profitable.2026年一季报：营业收入99.09亿元（同比+132.79%），净利润38.62亿元（上年同期亏损1.52亿元），同比扭亏为盈。
Self-developed NAND Flash & controller chips自研NAND闪存与主控芯片
37 · 2024-01-31 → 2026-06-05
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Longsys develops its own NAND Flash (SLC/MLC) and controller chips (WM5000/WM6000/WM7400/WM8500), achieving volume shipments and technology milestones.江波龙自主研发SLC/MLC NAND闪存及WM系列主控芯片，实现大规模出货与技术突破。
2024-01-31Longsys announced its first self-developed 32Gb 2D MLC NAND Flash chip, using BGA132 package, supporting Toggle DDR mode with data access bandwidth up to 400 MB/s, to be used in eMMC and SSD products.江波龙宣布首颗自研32Gb 2D MLC NAND Flash芯片问世，采用BGA132封装，支持Toggle DDR模式，数据访问带宽可达400MB/s，将应用于eMMC、SSD等产品。
2024-02-01Longsys announced its first self-developed 32Gb 2D MLC NAND Flash chip, using BGA132 package, supporting Toggle DDR mode with 400MB/s bandwidth, targeting eMMC and SSD applications.江波龙宣布推出首颗自研32Gb 2D MLC NAND Flash芯片，采用BGA132封装，支持Toggle DDR模式，带宽达400MB/s，将用于eMMC和SSD等产品。
2024-02-04Longsys confirmed its LS500 and LS600 series controller chips have completed tape-out and entered production at a well-known foundry, with nearly 10 million units already applied in eMMC and SD cards.江波龙确认其LS500、LS600系列主控芯片已在知名晶圆厂完成流片验证并投入生产，已在eMMC和SD卡领域完成近千万颗产品替换。
2024-02-06Longsys stated that its MLC NAND Flash sample is under testing and not yet in mass production; no significant sales revenue has been generated.江波龙表示其MLC NAND Flash样品处于测试过程中，尚未量产，未产生规模化销售收入。
2024-03-11Longsys confirmed that its self-developed main controller chips (for eMMC and SD cards) entered mass production at the end of 2023 and were quickly integrated into products.江波龙确认自研主控芯片（应用于eMMC和SD卡）已于2023年末投入量产，并快速导入相关产品。
2024-03-18Longsys brand FORESEE launched its first self-developed 32Gb 2D MLC NAND Flash chip, using BGA132 package, supporting Toggle DDR mode with data bandwidth up to 400MB/s.江波龙旗下品牌FORESEE推出首颗自研32Gb 2D MLC NAND Flash芯片，采用BGA132封装，支持Toggle DDR模式，数据带宽达400MB/s。
2024-03-26Longsys confirmed that its self-developed main controller chips WM5000 and WM6000 have entered mass production and shipment, powering eMMC and SD card product lines.江波龙确认自研主控芯片WM5000和WM6000已量产出货，赋能eMMC和SD卡产品线。
2024-04-02Longsys announced its first self-developed 32Gb 2D MLC NAND Flash chip, using BGA132 package, supporting Toggle DDR mode with 400MB/s bandwidth, targeting eMMC and SSD products.江波龙宣布推出首颗自研32Gb 2D MLC NAND Flash芯片，采用BGA132封装，支持Toggle DDR模式，带宽达400MB/s，将用于eMMC和SSD产品。
2024-05-27Longsys reported that two self-developed controller chips (WM6000, WM5000) have shipped in volume, with tens of millions of units integrated into products.江波龙报告两款自研主控芯片（WM6000、WM5000）已批量出货，实现数千万颗规模化产品导入。
2024-06-09Self-developed SLC NAND Flash cumulative shipments exceeded 50 million units; first self-developed 32Gb 2D MLC NAND Flash taped out and verified in Q1; two self-developed controller chips (WM6000, WM5000) shipped in volume with tens of millions of units introduced into products.自研SLC NAND Flash累计出货量超过5000万颗；首颗自研32Gb 2D MLC NAND Flash于一季度完成流片验证；两款自研主控芯片（WM6000、WM5000）已批量出货，实现数千万颗规模化产品导入。
2024-07-26Longsys reports that its SLC NAND Flash chip cumulative shipments exceed 50 million units; achieves breakthrough with international wearable brand flagship product and 0-to-1 in industrial automation and automotive applications.江波龙SLC NAND Flash存储芯片累计出货量超过5000万颗；在国际穿戴品牌旗舰产品中取得突破，并在工业自动化和车载应用中实现从0到1的突破。
2024-08-14Longsys' first self-developed 32Gbit 2D MLC NAND Flash completed tape-out verification, marking progress in small-capacity storage chips.江波龙首颗自研32Gbit 2D MLC NAND Flash完成流片验证，标志着在小容量存储芯片领域的技术进步。
2024-08-26Longsys announced that its small-capacity storage chip cumulative shipments exceeded 50 million units, with a customer matrix dominated by automotive electronics and supplemented by networking/industrial clients.江波龙小容量存储芯片累计出货量已超5000万颗，构建了以汽车电子为主、网通工业客户为辅的客户矩阵。
2024-08-27Longsys stated that its self-developed controller chip shipments have exceeded 10 million units.江波龙表示自研主控芯片出货量已超千万颗。
2024-08-28Longsys showcased its first 2xnm SLC NAND Flash self-developed chip at ELEXCON 2024 Shenzhen International Electronics Exhibition.江波龙在ELEXCON 2024深圳国际电子展上首次展示首款2xnm SLC NAND Flash自研芯片。
2024-09-10Disclosed that self-developed eMMC and SD card controller chips have shipped over 10 million units; self-developed SLC NAND Flash chips cumulative shipments exceeded 50 million units.披露自研eMMC和SD卡主控芯片已实现超千万颗出货；自研SLC NAND Flash芯片累计出货量已远超5000万颗。
2024-11-04Longsys announced it has launched eMMC and SD card controller chips, with over 10 million units applied; self-developed SLC NAND Flash cumulative shipments exceeded 50 million units; plans to expand MLC NAND Flash design capability.江波龙宣布推出eMMC和SD卡主控芯片，应用超千万颗；自研SLC NAND Flash累计出货超5000万颗；计划拓展MLC NAND Flash设计能力。
2024-11-04Longsys disclosed that its first 32Gbit 2D MLC NAND Flash has completed tape-out and verification; sample release planned later.江波龙披露首颗32Gbit 2D MLC NAND Flash已完成流片验证，未来将发布样品。
2024-11-08Longsys showcased FORESEE brand wearable storage products (SPI NAND Flash, Subsize eMMC, ePOP3, ePOP4x) at a salon; self-developed controller chips WM6000 and WM5000 entered mass production.江波龙在沙龙展示FORESEE品牌穿戴存储产品（SPI NAND Flash、Subsize eMMC、ePOP3、ePOP4x）；自研主控芯片WM6000和WM5000进入规模量产。
2024-11-15Longsys announced cumulative shipments of self-developed SLC NAND Flash exceeded 100 million units; 5 capacity options (512Mb to 8Gb) on 4xnm/2xnm nodes all in mass production.江波龙宣布自研SLC NAND Flash累计出货突破1亿颗；5种容量（512Mb至8Gb）采用4xnm/2xnm工艺均已量产。
2025-02-26Longsys disclosed that its three self-developed controller chips (for SD card, eMMC, and automotive-grade USB) have achieved over 10 million units in product application.江波龙披露自研的三款主控芯片（应用于SD卡、eMMC和车规级USB）已实现超千万颗的产品应用。
2025-03-11Longsys stated in an investor relations record that its three self-developed controller chips (for SD card, eMMC, and automotive-grade USB) have been applied in over 10 million units, and the company will focus on mid-to-high-end controller chips.江波龙在投资者关系记录中表示，其三款自研主控芯片（应用于SD卡、eMMC和车规级USB）已实现超千万颗应用，公司将聚焦于中高端主控芯片领域。
2025-03-25Longsys announced that its self-developed UFS 4.1 main controller chip has entered the high-end smart terminal market, and cumulative shipments of its three self-developed controller chips exceeded 30 million units.江波龙宣布，自研UFS 4.1主控芯片已进入高端智能终端市场，三款自研主控芯片累计出货量突破3000万颗。
2025-05-15Longsys highlights its self-developed UFS 4.1 controller chip WM7400 and automotive-grade storage products (UFS, eMMC, LPDDR4x, SPI NAND Flash) for smart vehicles.江波龙强调其自研UFS 4.1主控芯片WM7400及车规级存储产品（UFS、eMMC、LPDDR4x、SPI NAND Flash），用于智能汽车。
2025-09-04Longsys disclosed its self-developed UFS 4.1 main control chip WM7400, manufactured with advanced foundry process, supporting both TLC and QLC NAND Flash.江波龙披露自研UFS 4.1主控芯片WM7400，采用先进代工工艺制造，同时支持TLC和QLC NAND Flash。
2025-10-28Company disclosed that as of end-July 2025, cumulative deployment of self-developed controller chips exceeded 80 million units.公司披露截至2025年7月底，自研主控芯片全系列产品累计部署量超过8000万颗。
2025-10-29Self-developed controller chip cumulative deployment exceeded 100 million units by end of Q3; first batch of self-designed UFS controller chips successfully taped out; strategic cooperation with SanDisk on UFS4.1 self-developed controller.截至三季度末自研主控芯片累计部署量突破1亿颗；首批自研UFS主控芯片成功流片；与闪迪基于UFS4.1自研主控达成战略合作。
2025-11-03Longsys' self-developed controller chip cumulative deployment exceeded 100 million units by Q3 2025, with rapid growth continuing.截至2025年三季度末，江波龙自研主控芯片累计部署量突破1亿颗，并保持快速增长。
2026-01-29Completed first tape-out of UFS4.1 controller chip; multiple self-developed controller chips achieved volume production; customized on-device AI storage products began volume shipments to top customers.完成UFS4.1主控芯片首次流片；多款自研主控芯片实现批量应用；定制化端侧AI存储产品开始向头部客户批量出货。
2026-02-27Longsys disclosed that as of Q3 2025, its self-developed multiple main control chips have cumulatively shipped over 100 million units. Based on leading main control chip capabilities, it has built deep cooperation with multiple wafer foundries and top smart terminal equipment manufacturers, and its UFS4.1 products equipped with self-developed main control chips are on the verge of mass shipment.江波龙披露，截至2025年三季度末，公司自研的多款主控芯片累计部署量已突破1亿颗。基于领先的主控芯片能力，公司已与多家晶圆原厂及头部智能终端设备厂商构建了深度合作关系，搭载公司自研主控芯片的UFS4.1产品正在批量出货前夕。
2026-03-17Longsys stated in an investor call that it is among the few companies globally capable of developing UFS4.1 at the chip level; its self-developed controller-based UFS4.1 products are on the verge of mass shipment, with superior process, speed, and stability.江波龙在投资者交流中表示，全球仅有包括公司在内的少数企业具备芯片层面开发UFS4.1能力，搭载自研主控的UFS4.1产品处于批量出货前夕，制程、读写速度和稳定性优于可比产品。
2026-03-30Longsys unveiled the WM8500 SPU (Storage Processing Unit) at CFMS | MemoryS 2026, a 5nm chip enabling DRAM-less 128TB capacity, supporting HLC cache and lossless in-memory compression with a 2:1 average ratio.江波龙在CFMS | MemoryS 2026上发布WM8500存储处理单元（SPU），采用5nm制程，实现无DRAM 128TB容量，支持HLC缓存和存内无损压缩，平均压缩比2:1。
2026-04-27Disclosed that self-developed 5nm UFS 4.1 controller chip has entered supply chain of multiple top smartphone makers, with mass production scaling in 2026.披露自研5nm制程UFS 4.1主控芯片已导入多家头部智能手机厂商供应链，2026年全面进入规模化放量阶段。
2026-04-27Disclosed that self-developed main controller chips cumulative shipments exceeded 140 million units across all series in 2025.披露2025年自研主控芯片全系列产品累计出货量超过1.4亿颗。
2026-05-12Longsys disclosed that its WM8500 controller chip supports PCIe 5.0 edge SSD, optimized for AI scenarios (reduced DRAM dependency, warm/cold data exchange, high-performance heat dissipation). The company's strategy is to fully embrace edge AI while also conducting R&D for data center controller chips.江波龙披露WM8500主控芯片支持PCIe 5.0端侧SSD，针对AI场景优化（降低DRAM依赖、温冷数据交换、高性能散热），公司战略为全面拥抱端侧AI，同时开展数据中心主控芯片研发。
2026-05-19Longsys launched the SPU (Storage Processing Unit), a dedicated chip based on a 5nm process, integrating in-storage lossless compression and HLC (High Level Cache) technology. It completed adaptation and debugging with UNISOC for mobile edge AI.江波龙推出专用智能硬件SPU（存储处理单元），基于5nm先进制程，集成存内无损压缩与HLC高级缓存技术，并与紫光展锐完成适配调试。
2026-06-05At the Qualcomm Automotive Technology and Cooperation Summit, Longsys launched automotive-grade UFS 4.1 with self-developed 5nm WM7400 controller, sequential read 4200MB/s, write 4000MB/s, 128GB-512GB.在高通汽车技术与合作峰会上，江波龙发布车规级UFS 4.1，搭载自研5nm WM7400主控，顺序读取4200MB/s、写入4000MB/s，容量128GB-512GB。
Enterprise storage (eSSD & RDIMM)企业级存储（eSSD与RDIMM）
30 · 2024-02-01 → 2026-06-04
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Longsys builds enterprise SSD and RDIMM product lines, achieving rapid revenue growth and adoption by cloud, telecom, and finance customers.江波龙构建企业级SSD和RDIMM产品线，收入快速增长，获云计算、电信、金融客户采用。
2024-02-01Longsys launched the FORESEE AQUILA series 32GB 2Rx4 DDR4 RDIMM enterprise memory module, now in mass production for servers and data centers.江波龙推出FORESEE AQUILA系列32GB 2R×4规格DDR4 RDIMM企业级内存条，已全面量产，用于服务器和数据中心。
2024-02-05Longsys' FORESEE ORCA 4836 NVMe SSD and UNCIA 3836 SATA SSD completed compatibility certification with domestic CPU platforms (Kunpeng, Hygon, Loongson, Phytium, Zhaoxin, Shenwei) and passed Tencent Cloud TencentOS Server and OpenCloudOS tests.江波龙FORESEE ORCA 4836 NVMe SSD和UNCIA 3836 SATA SSD完成与鲲鹏、海光、龙芯、飞腾、兆芯、申威等国产CPU平台的兼容性适配，并通过腾讯云TencentOS Server和OpenCloudOS测试。
2024-02-06Longsys expects enterprise storage business to see volume growth in 2024, driven by IT application innovation (Xinchuang) demand from telecom operators and government sectors.江波龙预计2024年企业级存储业务将放量增长，受益于电信运营商和党政信创需求。
2024-03-11Longsys launched enterprise-grade FORESEE ORCA 4836 NVMe SSD and FORESEE UNCIA 3836 SATA 3.2 SSD, which completed compatibility adaptation with domestic CPU platforms (Kunpeng, Haiguang, Loongson, Phytium, Zhaoxin, Shenwei) and achieved mass production and shipment.江波龙推出企业级FORESEE ORCA 4836 NVMe SSD和FORESEE UNCIA 3836 SATA 3.2 SSD，完成与鲲鹏、海光、龙芯、飞腾、兆芯、申威等国产CPU平台兼容性适配，并实现批量量产出货。
2024-03-11Longsys launched enterprise-grade FORESEE AQUILA series DDR4 RDIMM and DDR5 RDIMM memory modules, completing its enterprise storage product line.江波龙推出企业级FORESEE AQUILA系列DDR4 RDIMM和DDR5 RDIMM内存条，完成企业级存储产品线布局。
2024-03-25Longsys enterprise-grade SSD and RDIMM products began large-scale delivery in Q4 2023 to operators, financial, and internet clients.江波龙企业级SSD和RDIMM产品从2023年Q4开始在运营商、金融和互联网客户端规模交付。
2024-04-09Longsys won the CITE 2024 Innovation Award for its FORESEE ORCA 4836 series enterprise NVMe SSD, and showcased enterprise storage products including eSSD, RDIMM, and CXL 2.0 memory expansion module at the expo.江波龙凭借FORESEE ORCA 4836系列企业级NVMe SSD荣获第十二届电子信息博览会创新奖，并展示了eSSD、RDIMM及CXL 2.0内存扩展模块等企业级产品。
2024-05-28Longsys stated enterprise eSSD has passed certification and mass production at multiple core customers; RDIMM product line covers 16GB to 96GB mainstream capacities.江波龙表示企业级eSSD已在多个核心客户处完成认证并量产；RDIMM产品线覆盖16GB至96GB主流容量。
2024-09-03Enterprise storage revenue in H1 2024 reached 291 million yuan, up over 2000% YoY; products completed compatibility adaptation with Kunpeng, Haiguang, Loongson, Feiteng, Zhaoxin, and Shenwei domestic CPU platforms.2024年上半年企业级存储业务收入达到2.91亿元，同比增长超2000%；产品已完成与鲲鹏、海光、龙芯、飞腾、兆芯、申威等多个国产CPU平台服务器的兼容性适配。
2024-10-30Longsys disclosed in an investor relations activity that its enterprise storage business achieved RMB 291 million in H1 2024, with Q3 revenue still higher than Q2; its PCIe and SATA SSDs have completed compatibility adaptation with multiple domestic CPU platforms (Kunpeng, Haiguang, Loongson, etc.).江波龙在投资者关系活动中披露，上半年企业级存储业务收入2.91亿元，第三季度收入仍高于第二季度；其PCIe SSD与SATA SSD已完成与鲲鹏、海光、龙芯等多个国产CPU平台的兼容性适配。
2024-11-04Longsys disclosed that enterprise storage revenue was 291 million yuan in H1 2024, with Q3 continuing growth; multiple large cloud service provider customers secured.江波龙披露2024上半年企业级存储收入2.91亿元，三季度持续增长；开拓多个大型云服务商客户。
2024-12-02Longsys showcased customized storage solutions for China Telecom at the 2024 China Telecom Digital Technology Ecology Conference, including enterprise-grade SSDs (ORCA 4836 PCIe), DDR5 RDIMM, CXL 2.0 memory expansion modules, and QLC eMMC based on self-developed WM6000 controller.江波龙在2024中国电信数字科技生态大会上展示为中国电信定制的存储解决方案，包括企业级SSD（ORCA 4836 PCIe）、DDR5 RDIMM、CXL 2.0内存拓展模块，以及基于自研WM6000主控的QLC eMMC。
2024-12-06Longsys enterprise-grade SATA SSD and DDR4 RDIMM products passed China Telecom's tests and were included in the 'Flagship Domestic Server Equipment Supply Chain List'.江波龙企业级SATA SSD与DDR4 RDIMM产品通过中国电信测试，被纳入中国电信“旗舰级国产化服务器设备供应链清单”。
2025-02-14Longsys stated its enterprise storage business achieved volume growth in 2024, with estimated sales scale of about 900 million yuan, and its products have passed certification in internet, telecom, and finance sectors.江波龙表示其企业级存储业务2024年实现放量增长，预计销售规模约9亿元，产品已通过互联网、运营商、金融等领域客户认证。
2025-03-04Longsys disclosed that its enterprise storage business (eSSD+RDIMM) is expected to achieve sales of approximately RMB 9 billion in 2024, and its three self-developed controller chips have been applied in over 10 million units. Lexar brand global sales in 2024 were approximately RMB 35 billion, and Zilia sales were approximately RMB 23 billion, up about 120% YoY.江波龙披露，2024年企业级存储业务（eSSD+RDIMM）预计销售规模约9亿元，自研三款主控芯片已实现超千万颗应用。Lexar品牌2024年全球销售收入约35亿元，Zilia销售收入约23亿元，同比增长约120%。
2025-04-08Longsys launched the enterprise-grade UNCIA 3856 series SATA SSD, based on 128-layer 3D eTLC NAND Flash, capacity 480GB to 7.68TB, 1~3 DWPD, and has been adopted by China Mobile's server equipment with volume shipments.江波龙推出企业级UNCIA 3856系列SATA SSD，基于128层3D eTLC NAND Flash，容量480GB至7.68TB，耐写等级1~3 DWPD，已导入中国移动服务器设备并实现规模出货。
2025-04-08Longsys disclosed that its enterprise storage business revenue in 2024 reached RMB 922 million, up 666.3% YoY; the company's self-developed main controller chips have been applied in over 30 million units cumulatively.江波龙披露2024年企业级存储业务收入达9.22亿元，同比增长666.3%；自研主控芯片累计应用量超过3000万颗。
2025-06-25Enterprise storage products (eSSD and RDIMM) completed verification and volume shipments at multiple well-known customers in internet and telecom sectors; Q1 2025 enterprise storage revenue reached RMB 319 million, up over 200% YoY.企业级存储产品（eSSD和RDIMM）已在互联网、运营商等领域多个知名客户处完成验证和批量出货；2025年一季度企业级存储收入达3.19亿元，同比增长超200%。
2025-07-16Longsys disclosed in an investor survey that its enterprise-level storage product portfolio (eSSD and RDIMM) achieved revenue of 319 million yuan in Q1 2025, up over 200% YoY. It partnered with SanDisk to launch customized high-quality UFS products for mobile and IoT markets, with self-developed controller UFS4.1 achieving sequential read/write of 4350/4200 MB/s.江波龙在投资者调研中披露，2025年第一季度企业级存储产品组合（eSSD和RDIMM）实现收入3.19亿元，同比增长超200%；与闪迪合作面向移动及IoT市场推出定制化高品质UFS产品，自研主控UFS4.1顺序读写达4350/4200 MB/s。
2025-07-24Longsys announced that its BG series enterprise DDR5 RDIMM memory modules (32-128GB, 6400Mbps) passed AMD's rigorous compatibility test for the Ryzen Threadripper PRO 9000 WX series and were designated as official workstation memory configuration.江波龙宣布其BG系列企业级DDR5 RDIMM内存条（32-128GB，6400Mbps）通过AMD锐龙Threadripper PRO 9000 WX系列严苛兼容性测试，被指定为官方工作站内存配置。
2025-08-27Longsys stated its eSSD and RDIMM products have passed compatibility verification on domestic CPU platforms including Kunpeng and Haiguang.江波龙表示其eSSD和RDIMM产品已通过鲲鹏、海光等国产CPU平台的兼容性验证。
2025-09-08Longsys stated it has launched multiple enterprise-grade storage products including SATA eSSD, PCIe SSD, and RDIMM, and continues to invest in cutting-edge products.江波龙表示已推出SATA eSSD、PCIe SSD、RDIMM等多款企业级存储产品，并在前沿产品领域持续投入。
2025-11-03Longsys' PCIe SSD and RDIMM products began volume adoption by leading domestic enterprises.江波龙的PCIe SSD与RDIMM产品已开始批量导入国内头部企业。
2025-11-07Longsys ranked third in China's enterprise SSD capacity and first among domestic brands in H1 2025; RDIMM began volume shipments; SOCAMM2 launched.2025年上半年，江波龙中国企业级SSD容量排名第三、国产品牌第一；RDIMM已批量出货；SOCAMM2已发布。
2026-03-21Longsys disclosed that its customized edge-AI storage products have achieved volume shipments to a leading customer, and its enterprise SSDs have been mass-imported by Alibaba Cloud and Tencent Cloud.江波龙披露其定制化端侧AI存储产品已在头部客户实现批量出货，企业级SSD已批量导入阿里云、腾讯云等头部云厂商。
2026-03-27Longsys stated it has no direct cooperation with NVIDIA; its enterprise storage products (SATA SSD, PCIe SSD, RDIMM, MRDIMM, CXL2.0, SOCAMM2) serve operators, internet firms, and server manufacturers.江波龙表示未与英伟达直接合作，其企业级存储产品（SATA SSD、PCIe SSD、RDIMM、MRDIMM、CXL2.0、SOCAMM2）客户涵盖运营商、互联网企业和服务器厂商。
2026-04-20Disclosed that enterprise storage products (SATA SSD, PCIe SSD, RDIMM) have been adopted by top-tier internet companies, covering operators, internet firms, and server OEMs.披露企业级存储产品（SATA SSD、PCIe SSD、RDIMM）已导入头部互联网企业供应链，客户涵盖运营商、互联网企业、服务器厂商。
2026-05-12Longsys' enterprise-grade SATA SSD, PCIe SSD, and RDIMM completed compatibility adaptation with multiple domestic CPU platforms (Kunpeng, Haiguang, Phytium) and have been introduced into the supply chains of internet companies, telecom operators, and server manufacturers.江波龙企业级SATA SSD、PCIe SSD、RDIMM已完成与鲲鹏、海光、飞腾等多个国产CPU平台服务器的兼容性适配，并已导入互联网企业、运营商、服务器厂商等供应链体系中。
2026-05-15Longsys disclosed that its enterprise storage business revenue reached 1.783 billion yuan in 2025, up 93.30% YoY, with products successfully introduced into the supply chains of leading internet companies and server manufacturers.江波龙披露企业级存储业务2025年收入达17.83亿元，同比增长93.30%，产品已成功导入部分头部互联网企业及服务器厂商的供应链。
2026-06-04Longsys disclosed that its enterprise storage revenue (eSSD and RDIMM) reached RMB 1.783 billion in 2025, up 93.30% YoY, and it continues to deepen AI server and data center storage deployment.江波龙披露其企业级存储产品（eSSD与RDIMM）2025年收入达17.83亿元，同比增长93.30%，并继续深化AI服务器和数据中心存储布局。
TCM (Technology Contract Manufacturing) business modelTCM（技术合约制造）业务模式
8 · 2024-02-06 → 2025-10-21
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Longsys promotes TCM model with upstream wafer suppliers and downstream customers for stable pricing and supply.江波龙与上下游推广TCM模式，实现稳定定价与供应。
2024-02-06Longsys disclosed that it is promoting the TCM (Technology Contract Manufacture) model with major customers to stabilize NAND wafer pricing and secure supply.江波龙披露正在与部分大客户推广TCM（技术-合约-制造）模式，以平抑存储晶圆价格波动并保障供应。
2024-03-28Longsys announced a shift to TCM (Technology Contract Manufacturing) cooperation model with upstream memory wafer manufacturers, moving from traditional product sales.江波龙宣布与上游存储原厂转向TCM（技术合约制造）合作模式，取代传统产品销售模式。
2024-05-20Longsys disclosed TCM (Turnkey Customized Manufacturing) business model, integrating self-developed storage chips, controller chips, firmware, and packaging testing.江波龙披露TCM（交钥匙定制制造）业务模式，整合自研存储芯片、主控芯片、固件及封测能力。
2024-06-21At Flash Memory Summit, proposed TCM (Technology Contract Manufacturing) cooperation model, providing one-stop storage controller, firmware customization, high-end packaging & testing, after-sales, brand and IP services for upstream wafer foundries.在闪存峰会上首次提出TCM（技术合约制造）合作模式，为上游存储晶圆厂一站式提供存储主控、固件定制开发、高端封测制造、售后服务、品牌及知识产权等服务。
2024-12-03Longsys highlighted its PTM (Product Foundry Model) business model at the China Telecom conference, offering full-stack customization from NAND Flash, DRAM, controller, firmware to hardware for telecom server storage.江波龙在中国电信大会上强调其PTM（存储产品代工模式）商业模式，为电信服务器存储提供从NAND Flash、DRAM、主控、固件到硬件的全栈定制。
2025-07-18Longsys announced TCM (Technology Contract Manufacturing) partnerships with Transsion, ZTE, and other Tier-1 customers, in addition to SanDisk, to enhance supply chain visibility and reduce price volatility impact.江波龙宣布除闪迪外，已与传音、ZTE等Tier1客户达成TCM（技术合约制造）模式合作，以增加产业供需双向能见度并降低价格波动影响。
2025-09-10Longsys announced a partnership with SanDisk under its TCM (Turnkey Contract Manufacturing) model, which uses differentiated pricing, procurement, and settlement mechanisms, forming a positive demonstration effect.江波龙宣布与闪迪达成TCM（全流程定制制造）模式合作，采用差异化定价、采购与结算机制，已形成良好示范效应。
2025-10-21Company confirmed partnership with SanDisk via TCM model; self-developed UFS4.1 controller products use SanDisk's QLC NAND, gaining recognition from multiple Tier1 customers.公司确认与闪迪通过TCM模式合作，自研UFS4.1主控产品锁定闪迪的QLC NAND供应，获得多家Tier1大客户认可。
Market & industry commentary市场与行业评论
9 · 2024-02-06 → 2025-12-17
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Comments on storage market trends, pricing, demand, and supply dynamics.关于存储市场趋势、定价、需求和供应动态的评论。
2024-02-06Longsys noted that module pricing trends are consistent with market data; contract prices for large clients are more stable than spot markets, with an overall upward trend after months of negotiation.江波龙指出模组端涨价情况与市场数据一致，大客户合约价较现货市场更稳定，整体价格上涨趋势明显。
2024-02-06Longsys stated that its inventory level and comprehensive cost price are competitive; inventory will be gradually released in 2024, and structural shortages may occur due to original manufacturer production cuts.江波龙表示其库存水位及综合成本价格具有竞争力，库存将在2024年逐步释放，原厂减产可能导致结构性缺货。
2024-03-29Longsys COO Wang Jingyang stated that the storage industry is recovering in Q1 2024 with rising product prices and strong demand, especially in mobile phones, and that the company is optimistic about 2024.江波龙资深副总裁、COO王景阳表示2024年一季度存储行业复苏，产品价格上涨，手机市场供不应求，对2024年持谨慎乐观态度。
2024-08-13Longsys commented that storage foundries maintain upward pricing, with structural divergence: AI-related enterprise server storage shows stronger demand and pricing momentum.江波龙表示，存储原厂报价保持向上态势，价格呈结构性分化，AI相关的企业级服务器存储需求及价格动能更强。
2024-10-31Longsys stated in a conference call that Q3 storage market saw structural divergence and weak consumer electronics demand, but overseas business and enterprise/automotive storage grew; inventory was significantly consumed, and Q4 demand is expected to recover with the peak season.江波龙在电话会议上表示，三季度存储市场出现结构性分化，消费电子需求不振，但海外业务和企业级/车规级存储增长；库存大量消耗，四季度需求有望随旺季回暖。
2025-06-30In investor relations activity record, noted that semiconductor storage market began recovering from late March 2025; eSSD prices expected to rise 5%-10% in Q3 due to server OEM restocking and wafer price strategies.在投资者关系活动记录中表示，半导体存储市场自2025年3月底开始回暖；受服务器OEM备库存及晶圆原厂价格策略影响，预计eSSD在Q3将上涨5%-10%。
2025-10-24Company disclosed that server customer orders exceed original supply expectations; Q4 eSSD price expected to rise 10%, DDR5 RDIMM 10-15%, Mobile NAND ASP 5-10%, LPDDR4X/5X ASP 10-15%.公司披露服务器客户订单超过原厂供应预期，四季度eSSD价格涨幅预计10%，DDR5 RDIMM涨幅约10%~15%，Mobile NAND ASP上涨5%~10%，LPDDR4X/5X ASP涨幅预计10%~15%。
2025-11-07Longsys stated that storage foundry capacity shift to server market tightened consumer supply, with DRAM and NAND price increases of at least 20%, some over 40%.江波龙表示，存储原厂产能转向服务器市场导致消费级供应收紧，DRAM与NAND价格涨幅最低20%，部分超40%。
2025-12-17Longsys forecasted that in Q1 2026, Mobile eMMC/UFS prices will rise 25%-30%, LPDDR4X/5X 30%-35%, and PC DDR5/LPDDR5X 30%-35%, citing tight wafer supply.江波龙预计2026年第一季度Mobile eMMC/UFS价格上涨25%-30%，LPDDR4X/5X涨幅30%-35%，PC端DDR5/LPDDR5X涨幅30%-35%。
Product & technology development产品与技术开发
18 · 2024-02-22 → 2026-06-25
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New product launches, technology milestones, and R&D achievements including controllers and storage modules.新产品发布、技术里程碑及研发成果，包括控制器和存储模块。
2024-02-22Longsys stated it is not currently involved in HBM technology design or R&D, but will monitor the technology and conduct early application-level R&D.江波龙表示目前暂未涉及HBM技术设计研发，但将保持关注并在产品应用层面提前开展研发布局。
2024-03-11Longsys stated that it cannot produce HBM (High Bandwidth Memory) because the technology is dominated by memory wafer manufacturers (SK hynix, Samsung), though it has mass production capability for high-stack packaging (part of HBM technology).江波龙表示无法生产HBM，因该技术由存储晶圆原厂主导，但公司具备晶圆高堆叠封装量产能力。
2024-06-17As of Dec 31, 2023, the company held 533 patents (215 invention, 109 overseas), 113 software copyrights, 6 IC layout designs; R&D team of nearly 1,000 people; launched self-developed controller, small-capacity storage chip, QLC eMMC, LPCAMM2, CXL 2.0 memory expansion module.截至2023年12月31日，公司拥有533项专利（发明专利215项，境外专利109项）、113项软件著作权、6项集成电路布图设计；研发团队近千人；已推出自研主控、小容量存储芯片、QLC eMMC、LPCAMM2、CXL 2.0内存拓展模块等产品。
2024-06-19Company does not have mature CoWoS technology; CoWoS is not yet commonly applied to NAND Flash products; will continue to monitor advanced packaging technologies.公司不具备成熟的CoWoS技术；CoWoS尚未普遍应用于NAND Flash产品；将持续关注先进封装技术。
2024-09-19Growth driver shifting from consumer storage to automotive-grade, industrial-grade, and enterprise-grade high-end memory; two self-developed controller chips WM6000 and WM5000 began volume shipments with over 10 million units deployed.增长动力从消费类存储切换至车规级、工规级与企业级高端存储器；两款自研主控芯片WM6000、WM5000已批量出货，实现超千万颗规模化导入。
2024-10-08Raspberry Pi launched its own-brand microSD cards (32/64/128GB), manufactured by Longsys, which passed 10,000 sudden power-off tests and are optimized for Raspberry Pi 5.树莓派推出自有品牌microSD存储卡（32/64/128GB），由江波龙生产，通过了1万次意外断电测试，并针对树莓派5进行了优化。
2025-01-08At CES 2025, Longsys launched the world's first NFC mobile solid-state drive (PSSD), supporting NFC unlocking of hidden storage space, with capacities from 128GB to 4TB, self-developed WM3000 main controller, and 10Gbps USB-C interface; upgradeable to iTAP protocol for Alipay tap-to-pay.在2025年CES上，江波龙推出全球首款NFC移动固态硬盘（PSSD），支持NFC解锁隐形存储空间，容量128GB至4TB，搭载自研WM3000主控和10Gbps USB-C接口；可升级支持iTAP协议实现支付宝碰一碰支付。
2025-03-05Longsys showcased at MWC 2025 its full range of embedded storage products (UFS, QLC eMMC with self-developed controller, LPDDR5) and server storage products (NVMe/SATA eSSD, CXL 2.0 memory expansion module, DDR5 RDIMM).江波龙在MWC 2025上展示了全系列嵌入式存储产品（UFS、搭载自研主控的QLC eMMC、LPDDR5）和服务器存储产品（NVMe/SATA eSSD、CXL 2.0内存拓展模块、DDR5 RDIMM）。
2025-03-13Longsys unveiled multiple new embedded flash products at MemoryS 2025, including UFS 4.1 (with self-developed WM7400 controller, up to 4350MB/s read, 2TB capacity) and eMMC Ultra (with self-developed WM6000 controller, 600MB/s theoretical speed, 50% bandwidth improvement over eMMC 5.1).江波龙在MemoryS 2025上发布多款嵌入式闪存新品，包括UFS 4.1（搭载自研WM7400主控，最高顺序读取4350MB/s，最大2TB容量）和eMMC Ultra（搭载自研WM6000主控，理论速度600MB/s，带宽较eMMC 5.1提升50%）。
2025-05-22Longsys introduces a custom SSD for 8K panoramic video recording using full-disk pSLC mode, with sequential read/write exceeding 5000 MB/s and TBW up to 42,000 TB.江波龙推出面向8K全景录像的定制SSD，采用全盘pSLC模式，顺序读写均超5000 MB/s，总写入量高达42000 TB。
2025-08-01Longsys resumed partial DDR4 testing and manufacturing capacity to meet customer demand amid DDR4 market changes.江波龙恢复部分DDR4测试和制造产能，以应对DDR4市场变化并满足客户需求。
2025-10-20Company stated it is not involved in HBM business, will continue focusing on automotive, industrial, and enterprise storage.公司表示暂不涉及HBM业务，将继续聚焦车规级、工规级和企业级存储器产品。
2025-12-26Longsys stated it does not conduct dedicated R&D on HBM (High Bandwidth Memory), as HBM technology is dominated by wafer foundries globally.江波龙表示并未从事HBM的专项研发，全球HBM产品技术应用以存储晶圆原厂为主导。
2026-01-27UFS4.1 product won '2025 Technology Breakthrough Award' on AI+ 'Hardcore' list; uses self-developed WM7400 controller with advanced foundry process and Prime 3rd-gen LDPC.UFS4.1产品入选AI+“硬核”榜单“2025年度技术突破榜单”；搭载自研慧忆微WM7400主控，采用先进工艺和第三代Prime LDPC纠错技术。
2026-03-30Longsys collaborated with AMD to deploy a 397B-parameter large model locally on the Ryzen AI Max+ 395 platform, reducing DRAM usage by nearly 40% in a 256K ultra-long context (122B) scenario.江波龙与AMD合作，在锐龙AI Max+ 395平台上实现397B参数大模型本地部署，在256K超长上下文（122B）场景下将DRAM占用降低近40%。
2026-04-09Confirmed SPU+iSA solution has completed joint tuning with AMD, with advantages in cost optimization and local AI deployment.确认SPU+iSA方案已与AMD完成联合调优，在成本优化及AI大模型本地化部署方面具备明显优势。
2026-05-20Longsys demonstrated at the 2026 AMD AI Developer Day: based on an AMD Ryzen AI Max+ 395 agent host, it achieved local deployment of a 397B-parameter AI model with 128GB memory, and stable deployment of a 122B model with 64GB memory.在2026 AMD AI开发者日上，江波龙基于AMD锐龙AI Max+ 395智能体主机，在128GB内存下实现397B参数AI模型本地部署，在64GB内存下稳定运行122B模型。
2026-06-25Longsys detailed its SPU (Storage Processing Unit) based on 5nm process and iSA intelligent scheduling engine, forming a hardware-software solution for edge-AI inference, achieving 2:1 lossless compression and reducing DRAM usage by ~40% via HLC.江波龙详细介绍了基于5nm工艺的SPU（存储处理单元）和iSA智能调度引擎，形成端侧AI推理软硬件协同方案，实现2:1无损压缩，通过HLC降低DRAM占用约40%。
Yuancheng Suzhou packaging & testing base元成苏州封测基地
11 · 2024-02-26 → 2025-07-25
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Longsys' subsidiary Yuancheng Suzhou provides advanced packaging and testing capabilities, including high-stack packaging.江波龙子公司元成苏州提供先进封测能力，包括高堆叠封装。
2024-02-26Longsys acquired packaging and testing factory Yuancheng Suzhou (formerly Powertech Suzhou) to strengthen its chip packaging and testing capabilities, with annual capacity exceeding 550 million units.江波龙通过收购封测厂元成苏州（原力成苏州）补齐芯片封测短板，年封测产能超过5.5亿颗。
2024-04-08Longsys disclosed that its subsidiary Yuancheng Suzhou has mass production capability for wafer high-stack packaging (part of HBM technology) but cannot produce HBM yet.江波龙披露子公司元成苏州具备晶圆高堆叠封装（HBM技术涉及的一部分）量产能力，但目前无法生产HBM。
2024-06-07Subsidiary Yuancheng Suzhou has mass production capability for high-stack wafer packaging (part of HBM technology) but cannot produce HBM; will continue R&D layout.子公司元成苏州具备晶圆高堆叠封装（HBM技术涉及的一部分）的量产能力，但目前无法生产HBM，将持续开展研发布局。
2024-07-01Longsys subsidiary Yuancheng Suzhou has mass production capability for wafer high-stack packaging (part of HBM technology) but cannot produce HBM; company will continue R&D on HBM applications.江波龙子公司元成苏州具备晶圆高堆叠封装（HBM技术涉及的一部分）的量产能力，但目前无法生产HBM；公司将持续关注并开展相关研发布局。
2024-08-14YuanCheng Suzhou (formerly a subsidiary of Powertech Technology, renamed after deep cooperation with Longsys in 2023) demonstrated capabilities in wafer-level, chip-level, and system-level packaging, including 16-layer die stacking and 8D eUFS mass production.元成苏州（前身为力成科技全资子公司，2023年与江波龙深度合作后更名）展示了晶圆级、芯片级、系统级封装能力，包括16层叠Die和8D eUFS量产能力。
2024-09-09Subsidiary Yuancheng Suzhou has mass production capability for wafer high-stack packaging (part of HBM technology) but cannot produce HBM; R&D layout in HBM applications is underway.子公司元成苏州具备晶圆高堆叠封装（HBM技术涉及的一部分）的量产能力，但目前无法生产HBM；公司已在产品应用层面开展HBM相关研发布局。
2024-10-31Longsys disclosed that its subsidiary Yuancheng Suzhou has mass production capability for wafer high-stack packaging (part of HBM technology) but cannot produce HBM; it will continue R&D layout in this area.江波龙披露，子公司元成苏州具备晶圆高堆叠封装（HBM技术涉及的一部分）的量产能力，但目前无法生产HBM，将持续关注并提前开展研发布局。
2024-11-11Longsys stated that subsidiary Yuancheng Suzhou has mass production capability for wafer high-stack packaging, a technology related to HBM, but cannot produce HBM currently.江波龙表示子公司元成苏州具备晶圆高堆叠封装量产能力，该技术为HBM相关技术，但目前无法生产HBM。
2025-01-23Longsys stated it does not engage in HBM R&D; its subsidiary Yuancheng Suzhou (元成苏州) has mass production capability for multi-layer packaging and hybrid bonding but cannot produce HBM.江波龙表示未从事HBM专项研发；子公司元成苏州具备多层封装和混合键合封装量产能力，但无法生产HBM。
2025-02-18Longsys stated its subsidiary Yuancheng Suzhou has mass production capabilities for multi-layer packaging and hybrid bonding packaging, but does not have mature 3D stacking technology.江波龙表示子公司元成苏州具备多层封装、混合键合封装的量产能力，但不具备3D堆叠的成熟技术。
2025-07-25Longsys held an investor site visit at its high-end packaging and testing base Yuancheng Technology (Suzhou) Co., Ltd. on July 23, 2025, attended by 28 institutions. It disclosed that enterprise storage revenue grew over 600% in 2024 and over 200% in Q1 2025.江波龙于2025年7月23日在旗下高端封测制造基地元成科技（苏州）有限公司举办投资者现场调研，28家机构参与；披露企业级存储业务2024年收入增长超600%，2025年一季度增长超200%。
CXL memory expansion moduleCXL内存扩展模块
8 · 2024-03-11 → 2025-02-14
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Longsys develops CXL 2.0 memory expansion modules for AI server memory pooling and sharing.江波龙开发CXL 2.0内存扩展模块，用于AI服务器内存池化与共享。
2024-03-11Longsys stated that the integration of its DDR5 products with self-developed CXL (Compute Express Link) technology is in the late R&D stage.江波龙表示其DDR5产品与自研CXL技术的融合正处于研发后期阶段。
2024-03-25Longsys launched a CXL 2.0 memory expansion module in Q1 2024.江波龙在2024年Q1推出CXL 2.0内存拓展模块。
2024-04-17Longsys showcased a CXL 2.0 AIC memory expansion card at CFMS 2024, featuring 8 DIMM slots, support for DDR4 RDIMM, capacity up to 512GB, PCIe 5.0 x16 interface with theoretical bandwidth of 128GB/s.江波龙在CFMS 2024展出CXL 2.0 AIC内存扩展卡，配备8个DIMM插槽，支持DDR4 RDIMM，容量可扩展至512GB，采用PCIe 5.0 x16接口，理论带宽128GB/s。
2024-06-24Launched FORESEE CXL 2.0 memory expansion module based on DDR5 DRAM, supporting memory pooling; launched FORESEE LPCAMM2 with 128-bit width, enabling new memory form factor for PC and mobile scenarios.推出基于DDR5 DRAM的FORESEE CXL 2.0内存拓展模块，支持内存池化共享；推出FORESEE LPCAMM2，128bit位宽设计，实现PC和手机存储应用场景新突破。
2024-07-01Longsys launches FORESEE CXL 2.0 memory expansion module based on DDR5 DRAM, supporting memory pooling and sharing for enterprise applications.江波龙推出基于DDR5 DRAM的FORESEE CXL 2.0内存拓展模块，支持内存池化共享，面向企业级应用。
2024-08-28Longsys exhibited AI server storage products including FORESEE CXL 2.0 memory expansion module based on DDR5 DRAM, supporting PCIe 5.0 x8 interface with up to 32GB/s bandwidth and capacities of 64GB/128GB/192GB.江波龙展出AI服务器存储产品，包括基于DDR5 DRAM的FORESEE CXL 2.0内存拓展模块，支持PCIe 5.0 x8接口，带宽高达32GB/s，提供64GB/128GB/192GB容量。
2025-01-13Longsys announced it has launched new memory modules including LPCAMM 2, CAMM 2, and CXL 2.0 to support AI-era high-capacity and high-computing applications.江波龙宣布推出LPCAMM 2、CAMM 2、CXL 2.0等新型内存拓展模块，为AI时代的大容量与高算力应用提供支持。
2025-02-14Longsys launched new products including LPCAMM2, CAMM2, and CXL2.0, widely used in AI servers, AI PCs, AI phones, and AI wearable devices.江波龙推出LPCAMM2、CAMM2、CXL2.0等新型产品，广泛应用于AI服务器、AI PC、AI手机及AI智能穿戴设备。
Partnership with Western Digital / SanDisk与西部数据/闪迪的合作
6 · 2024-03-20 → 2026-05-22
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Longsys partners with Western Digital and SanDisk on customized UFS products for mobile and IoT markets.江波龙与西部数据/闪迪合作，为移动和IoT市场开发定制UFS产品。
2024-03-20Longsys announced at CFMS2024 the strengthening of cooperation with Western Digital to jointly develop customized embedded storage solutions for the Greater China mobile phone market, leveraging Longsys' self-developed controller and packaging capabilities.江波龙在CFMS2024上宣布与西部数据加强合作，为大中华区手机市场联合开发定制化嵌入式存储解决方案，利用江波龙自研主控和封装能力。
2025-06-16Wholly-owned subsidiary Longsys Electronics (HK) signed a binding MOU with Sandisk Technologies to jointly develop customized high-quality UFS products for mobile and IoT markets, leveraging Longsys' controller chip, firmware, and packaging capabilities and Sandisk's NAND flash and system design expertise.全资子公司Longsys Electronics (HK)与闪迪（Sandisk Technologies）签署有约束力的合作备忘录，基于江波龙的主控芯片、固件和封测能力以及闪迪的NAND闪存和系统设计优势，面向移动和IoT市场联合开发定制化高品质UFS产品。
2025-08-21Longsys announced a partnership with SanDisk to develop customized high-quality UFS products and solutions for mobile and IoT markets.江波龙宣布与闪迪达成合作，面向移动及IoT市场推出定制化高品质UFS产品及解决方案。
2026-01-09Disclosed cooperation with SanDisk to develop customized high-quality UFS products for mobile and IoT markets.披露与闪迪合作，面向移动及物联网市场开发定制化高品质UFS产品。
2026-04-14Disclosed cooperation with Sandisk in wafer supply, flagship storage product development, and key customer expansion.披露与闪迪在晶圆供应、旗舰存储产品开发和大客户拓展方面有众多合作。
2026-05-22Longsys disclosed deep and multi-faceted cooperation with YMTC (Yangtze Memory Technologies) and CXMT (ChangXin Memory Technologies), including jointly launching customized high-quality UFS products for mobile and IoT markets.江波龙披露与长江存储、长鑫存储等全球主要晶圆原厂达成深层次、多角度合作，包括共同面向移动及IoT市场推出定制化UFS产品及解决方案。
Other developments其他动态
20 · 2024-03-20 → 2026-05-06
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Assorted developments not part of a running storyline.未归入某条故事线的零散动态。
2024-03-20Longsys chairman Cai Huabo stated at CFMS2024 that the company is transforming from a storage module factory to a semiconductor storage brand company, having acquired YuanCheng Suzhou and Zilia Brazil, and built a Zhongshan data center storage line to form an R&D and packaging-testing integration.江波龙董事长蔡华波在CFMS2024上表示，公司从存储模组厂向半导体品牌公司转型，已并购元成苏州和智忆巴西，并自建中山数据中心存储专线，形成研发封测一体化。
2024-07-19Longsys reports that its enterprise-grade storage business and self-developed controller chip business both grew significantly in H1 2024.江波龙报告2024年上半年企业级存储业务和自研主控芯片业务均显著增长。
2024-07-22Longsys moves its Shenzhen headquarters to Hongrongyuan Qianhai Financial Center, enhancing collaboration with Zhongshan storage industrial park via Shenzhen-Zhongshan Bridge.江波龙深圳总部迁至鸿荣源前海金融中心，通过深中通道加强与中山存储产业园的协作。
2024-08-26Longsys proposed a H1 2024 cash dividend of RMB 2.5 per 10 shares (pre-tax), totaling approximately RMB 104 million.江波龙拟向全体股东每10股派发现金红利2.5元（含税），合计约1.04亿元。
2024-08-27Longsys reported H1 2024 inventory of RMB 8.833 billion, with a provision for inventory impairment of RMB 206 million.江波龙2024年上半年存货88.33亿元，计提存货跌价损失2.06亿元。
2024-10-14Longsys completed the industrial and commercial registration change of registered capital, increasing from 412,864,254 yuan to 415,981,564 yuan.江波龙完成注册资本工商变更登记，注册资本由41286.4254万元变更为41598.1564万元。
2024-10-28Longsys announced it will record credit impairment losses and asset impairment losses for the first three quarters of 2024, primarily on accounts receivable and inventory.江波龙公告2024年1-9月计提信用减值损失及资产减值损失，主要涉及应收账款和存货。
2024-11-15Longsys stated it has no substantive new M&A projects underway, but will continue to evaluate targets based on industrial investment principles.江波龙表示目前没有实质开展新的并购重组项目，但将继续按产业投资原则评估标的。
2024-11-25Longsys disclosed that industrial-grade and automotive-grade business gross margins are higher than overall company level; expects further contribution improvement.江波龙披露工规级与车规级业务毛利率优于公司整体水平，预计未来贡献将进一步提高。
2025-02-21Longsys announced its 2025 daily related-party transaction with Shenzhen CECport Technologies is expected to be no more than 100 million yuan, down from 175 million yuan actual in 2024.江波龙公告预计2025年度与深圳中电港技术股份有限公司日常关联交易不超过1亿元，较2024年实际发生额1.75亿元大幅下降。
2025-03-11Longsys confirmed in an investor Q&A that it has no cooperation with Huawei.江波龙在投资者问答中确认，公司与华为没有合作。
2025-03-17Longsys stated in an investor Q&A that it does not engage in dedicated R&D for HBM (High Bandwidth Memory), as the technology is dominated by memory wafer foundries globally.江波龙在投资者问答中表示，公司并未从事HBM（高带宽存储器）的专项研发，该技术全球范围内以存储晶圆原厂为主导。
2025-03-21According to Longsys' HKEX prospectus, based on 2023 storage product revenue, it is the world's second-largest independent memory manufacturer and China's largest independent memory manufacturer. Its FORESEE brand ranked fifth globally among independent B2B brands, Lexar ranked second globally among independent consumer brands, and Zilia ranked first in Latin America and Brazil.据江波龙港交所招股书，以2023年存储产品收入计，公司是全球第二大独立存储器厂商及中国最大独立存储器厂商。FORESEE品牌在全球独立B2B品牌中排名第五，雷克沙品牌在全球独立消费品牌中排名第二，Zilia品牌在拉丁美洲和巴西排名第一。
2025-07-22Longsys confirmed that its FORESEE brand storage products are used in Unitree Go2 robot dog, as shown in a teardown video. The company noted that embodied AI and AI glasses businesses are still early-stage with low current revenue contribution.江波龙确认宇树Go2机器狗拆机视频中使用了其FORESEE品牌存储产品，但表示机器人具身智能和AI眼镜等业务仍处于发展早期，对业绩贡献率尚低。
2025-08-04Longsys disclosed TCM cooperation with memory wafer suppliers and enterprise storage advantages; Q1 2025 enterprise revenue grew over 200% YoY.江波龙披露与存储晶圆原厂的TCM模式合作及企业级存储优势；2025年一季度企业级业务收入同比增长超200%。
2025-09-01Guosen Securities initiated coverage on Longsys with an 'Outperform' rating, citing 2Q25 net profit up 209.7% QoQ, record quarterly revenue, enterprise storage up 138.66% YoY, and self-developed controller chips exceeding 80 million units cumulative shipments.国信证券给予江波龙‘优于大市’评级，指出2Q25归母净利润环比增长209.7%，单季营收创历史新高，企业级存储同比增长138.66%，自研主控芯片累计出货超8000万颗。
2025-12-17Longsys stated it has signed long-term supply agreements (LTA) or memorandums of understanding (MOU) with major global wafer suppliers to ensure stable supply amid reduced allocations to module makers.江波龙表示已与全球主要存储晶圆原厂签署长期供货协议或商业合作备忘录，以在模组厂供应削减情况下确保稳定供应。
2026-03-06Longsys disclosed it has signed long-term supply agreements (LTA) or commercial MOUs with major global memory wafer suppliers, ensuring a solid wafer supply base amid structural tightness.江波龙披露已与全球主要存储晶圆原厂签署长期供货协议或商业合作备忘录，在晶圆供应结构性偏紧环境下构建了差异化保障能力。
2026-04-20Disclosed long-term supply agreements (LTA/MOU) signed with major wafer suppliers including YMTC and CXMT to secure wafer supply.披露已与包括长江存储、长鑫存储在内的全球主要晶圆原厂签署长期供货协议（LTA）或商业合作备忘录（MOU）。
2026-05-06Longsys' wholly-owned subsidiary Xizang Yuanzhi Venture Capital Management Co., Ltd. jointly established Hainan Yuanxin Nongke Co., Ltd. with a registered capital of 26 million yuan, covering offshore trade and import/export agency.江波龙全资子公司西藏远识创业投资管理有限公司等共同成立海南元芯农科有限公司，注册资本2600万元，经营范围包含离岸贸易经营、进出口代理。
QLC eMMC & QLC SSDQLC eMMC与QLC SSD
4 · 2024-03-26 → 2025-11-02
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Longsys launches QLC eMMC products and pre-researches QLC SSD, targeting cost-sensitive high-capacity storage.江波龙推出QLC eMMC产品并预研QLC SSD，面向成本敏感的大容量存储。
2024-03-26Longsys showcased new self-developed products including QLC eMMC storage chip, LPCAMM2 memory, CXL memory expansion module, and NM/microSD/SD cards.江波龙展示多款全新自研存储产品，包括QLC eMMC存储芯片、LPCAMM2内存、CXL内存扩展模块、NM/microSD/SD存储卡等。
2024-04-21Longsys launched six new products at CFMS 2024: Lexar 1TB NM Card, Lexar 2TB microSD, FORESEE QLC eMMC, FORESEE CXL 2.0 memory module, and FORESEE LPCAMM2.江波龙在CFMS 2024推出六款新品：Lexar 1TB NM Card、Lexar 2TB microSD、FORESEE QLC eMMC、FORESEE CXL 2.0内存模块和FORESEE LPCAMM2。
2024-05-20Longsys announced QLC eMMC products launched, QLC SSD under pre-research; Q1 2024 gross margin reached 24.39%.江波龙宣布QLC eMMC产品已推出，QLC SSD在预研中；2024年第一季度毛利率达24.39%。
2025-11-02Longsys and Solidigm co-hosted a QLC embedded storage salon in Suzhou, discussing QLC technology breakthroughs and market opportunities.江波龙与Solidigm在苏州共同举办QLC嵌入式存储沙龙，探讨QLC技术突破与市场机遇。
Lexar brand & consumer storage雷克沙品牌与消费级存储
11 · 2024-04-02 → 2026-06-10
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Lexar brand expands globally with new SSDs, memory cards, and partnerships, achieving strong revenue growth.雷克沙品牌全球扩张，推出新SSD、存储卡并建立合作，收入强劲增长。
2024-04-02Longsys confirmed that its Lexar brand NM memory card is compatible with Huawei P70 smartphone.江波龙确认旗下Lexar品牌NM存储卡可与华为P70手机适配。
2024-05-27Longsys subsidiaries Yuanxin Electronics, Lexar, and Maisduto to exhibit at COMPUTEX 2024, showcasing 96GB DDR5 RDIMM, 8TB SSDs, LPCAMM2, and 4TB XP2300 PCIe Gen4 SSD.江波龙子公司元信电子、雷克沙、迈仕渡将参展COMPUTEX 2024，展示96GB DDR5 RDIMM、8TB SSD、LPCAMM2及4TB XP2300 PCIe Gen4 SSD。
2024-08-01Longsys launched several high-end consumer SSD products: FORESEE XP2300, Lexar NM980, and Lexar NM990.江波龙推出多款高端消费级SSD产品：FORESEE XP2300、Lexar NM980、Lexar NM990。
2024-09-06Showcased Lexar brand and PTM (Product Technology Manufacturing) model at IFA 2024 Berlin, releasing multiple new Lexar products.携旗下Lexar雷克沙品牌亮相2024柏林IFA展，发布多款新品，并展示PTM（存储产品技术制造）模式。
2024-09-20Lexar retail business now covers over 50 countries and regions; Zilia will leverage Longsys' technology and product design to serve overseas customers; Yuancheng Suzhou becomes the company's overall packaging and testing base.Lexar零售业务已覆盖全球50多个国家和地区；Zilia将借助江波龙技术与产品设计方案服务海外客户；元成苏州成为公司整体封装测试基地。
2024-11-04Longsys reported that Lexar global revenue grew from 864 million yuan in 2019 to 2.426 billion yuan in 2023; retail covers over 50 countries.江波龙表示Lexar全球营收从2019年8.64亿元增至2023年24.26亿元；零售覆盖超50个国家。
2025-02-18Longsys reported that its Lexar brand achieved global sales revenue of about 3.5 billion yuan in 2024, continuing growth momentum.江波龙披露Lexar（雷克沙）品牌2024年全球销售收入约35亿元，继续保持增长势头。
2025-05-22At COMPUTEX 2025, Longsys and its consumer brand Lexar launch the XP2350 QLC SSD for AI PCs, featuring PCIe Gen 4x4 DRAM-less architecture, Floating Gate NAND, up to 8TB capacity, 7200 MB/s sequential read, and 3000 P/E endurance.在COMPUTEX 2025上，江波龙及其消费品牌雷克沙推出面向AI PC的QLC固态硬盘XP2350，采用PCIe Gen 4x4无缓存架构、浮动栅极NAND，最高8TB容量，顺序读取7200 MB/s，3000 P/E擦写次数。
2026-01-06Lexar (subsidiary) announced global partnership with Argentina national football team at CES 2026; co-branded portable SSDs to be launched.雷克沙（子公司）在CES 2026上宣布与阿根廷国家足球队达成全球合作伙伴关系；将推出联名移动固态硬盘。
2026-01-06At CES 2026, Lexar launched AI Storage Core architecture and AI-Grade SSD, Storage Stick, and Card products; also launched world's first 2TB UHS-I microSD card (255MB/s).在CES 2026上，雷克沙推出AI Storage Core架构及AI-Grade SSD、存储棒和存储卡产品；同时推出全球首款2TB UHS-I microSD卡（255MB/s）。
2026-06-10Longsys confirmed that its Lexar brand has become an official global partner of the Argentina national football team, with collaboration spanning the 2026 World Cup.江波龙确认旗下Lexar品牌已成为阿根廷国家足球队官方全球合作伙伴，合作贯穿2026年世界杯。
Maisddo (Zhuhai) production center迈仕渡（珠海）生产中心
1 · 2024-04-03
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Longsys subsidiary Maisddo opens a new production center in Zhuhai for chip packaging, testing, and module manufacturing.江波龙子公司迈仕渡在珠海开设新生产中心，用于芯片封测和模组制造。
2024-04-03Longsys subsidiary Maisddo (Zhuhai) held an opening ceremony for its new production center in Zhuhai, with total investment of CNY 500 million, over 10,000 sqm, 300+ automated packaging machines, 800+ staff, and expected monthly capacity of tens of millions of units for chip packaging, testing, and storage module manufacturing.江波龙子公司迈仕渡（珠海）在珠海举行生产制造中心开业典礼，总投资5亿元，面积超1万平方米，引进300余台全自动封装设备，容纳超800人团队，预计月产能达千万颗，用于芯片封测和存储模组制造。
Corporate actions & regulatory公司行动与监管
18 · 2024-04-22 → 2026-05-19
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Shareholder meetings, dividend proposals, fundraising project changes, and regulatory compliance updates.股东大会、分红提案、募投项目变更及监管合规更新。
2024-04-22Longsys board approved a plan to conduct foreign exchange hedging transactions with a rolling limit of up to CNY 5 billion (or equivalent in foreign currency) to mitigate exchange rate and interest rate risks.江波龙董事会批准开展外汇套期保值业务，拟使用自有资金在折合人民币50亿元额度内滚动操作，以规避汇率和利率风险。
2024-04-25Longsys received official letter from US DOJ confirming full termination of all CFIUS compliance obligations arising from the 2017 acquisition of Lexar brand, releasing Lexar's US business from nearly seven years of restrictions.江波龙收到美国司法部正式函件，确认因2017年收购Lexar品牌引发的CFIUS全部合规义务已全面终止，Lexar美国业务近七年的限制得以解除。
2024-08-26Longsys announced it will hold an extraordinary general meeting on September 11, 2024, to consider proposals including changing registered capital, H1 profit distribution, and extending the validity of authorization for issuing convertible bonds.江波龙将于2024年9月11日召开临时股东大会，审议变更注册资本、半年度利润分配、延长可转债发行授权有效期等议案。
2024-10-17Longsys announced a 2024 interim dividend of RMB 2.5 per 10 shares (tax inclusive), with record date October 24, 2024, totaling approximately RMB 104 million.江波龙宣布2024年半年度权益分派，每10股派发现金股利2.5元（含税），股权登记日为2024年10月24日，合计派发现金红利约1.04亿元。
2024-12-18Longsys terminated its plan to issue convertible bonds (up to RMB 3 billion) to the unspecified public, citing changes in the external environment and strategic planning.江波龙终止向不特定对象发行可转换公司债券（原计划募集不超过30亿元），理由为外部环境变化和战略发展规划调整。
2025-03-20Longsys announced the postponement and internal investment structure adjustment of its 'Small-Capacity Flash Storage Chip Design and R&D Project' (a funded project), approved by the board and监事会 on March 19, 2025.江波龙公告，将募投项目“小容量Flash存储芯片设计研发项目”进行延期并调整内部投资结构，该事项已于2025年3月19日经董事会和监事会审议通过。
2025-04-27Longsys announced the closure of certain IPO fundraising projects and the permanent replenishment of working capital with the remaining proceeds; the IPO raised net proceeds of RMB 2.185 billion.江波龙公告部分募集资金投资项目结项，并将节余募集资金永久补充流动资金；IPO募集资金净额21.85亿元。
2025-05-30Longsys corrects errors in its 2024 annual report: weighted average ROE revised from 31.27% to 7.92%, and cash flow net increase sign reversed; no impact on financial statements.江波龙更正2024年年报错误：加权平均净资产收益率从31.27%修正为7.92%，现金流量净额符号反转；不影响财务报表。
2025-06-04Corrected 2024 annual report: weighted average ROE revised from 31.27% to 7.92%, YoY growth from 44.28% to 20.93%; net cash flow from investing activities changed from -33.67% to +33.67%; net increase in cash equivalents from -73.70% to +73.70%.更正2024年年报：加权平均净资产收益率从31.27%修正为7.92%，同比增长率从44.28%调整为20.93%；投资活动现金流量净额从同比减少33.67%变为增加33.67%；现金及现金等价物净增加额从减少73.70%调整为增加73.70%。
2025-06-11Announced 2nd extraordinary general meeting on 2025-06-27 to vote on closing certain raised-fund projects and using leftover funds to permanently supplement working capital, and on new 2025 related-party transaction estimates.宣布于2025年6月27日召开第二次临时股东大会，审议部分募集资金投资项目结项并将节余募集资金永久补充流动资金的议案，以及新增2025年度日常关联交易预计的议案。
2025-07-31Longsys announced it will hold its 3rd extraordinary general meeting on August 21, 2025, to consider proposals on changing registered capital, amending the company's articles of association, and revising internal management systems.江波龙公告将于2025年8月21日召开第3次临时股东大会，审议变更公司注册资本、修订公司章程及修订制定公司部分治理制度的议案。
2025-08-23Longsys board approved using up to RMB 1.4 billion of idle self-owned funds to purchase low-risk wealth management products over the next 12 months.江波龙董事会批准使用不超过14亿元闲置自有资金购买低风险理财产品，期限12个月。
2025-09-10Longsys completed industrial and commercial registration changes, increasing registered capital from RMB 415,981,564 to RMB 419,145,267 due to vesting of restricted stock incentive plan.江波龙完成工商变更登记，因限制性股票激励计划归属，注册资本由人民币415,981,564元变更为人民币419,145,267元。
2025-10-27Stock price abnormal fluctuation: cumulative closing price deviation exceeded 30% over two consecutive trading days; company confirmed no undisclosed material information.股票交易异常波动：连续两个交易日收盘价格涨幅偏离值累计超过30%，公司确认不存在未披露重大事项。
2025-10-30Stock price severe abnormal fluctuation: cumulative closing price deviation exceeded 200% over 30 trading days; static P/E ratio 229.31x, significantly above industry average.股票交易严重异常波动：连续30个交易日收盘价格涨幅偏离值累计超过200%；静态市盈率229.31倍，明显高于同行业水平。
2026-04-01Announced that 2025 annual report and 2026 Q1 report will be disclosed simultaneously on April 28.宣布2025年年报和2026年一季报将于4月28日同步披露。
2026-04-28Announced plan to conduct foreign exchange hedging business with up to 5 billion yuan in self-owned funds to mitigate currency/interest rate risks.公告拟使用自有资金在折合人民币50亿元额度内开展外汇套期保值业务，以规避汇率或利率风险。
2026-05-19Longsys' 2026 annual general meeting approved 15 proposals, including the 2026 guarantee limit plan and the 2026 restricted stock incentive plan (draft).江波龙2026年股东会审议通过了15项议案，包括2026年度担保额度预计议案和2026年限制性股票激励计划（草案）等。
LPCAMM2 / CAMM2 memory modulesLPCAMM2/CAMM2内存模组
3 · 2024-05-16 → 2025-10-28
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Longsys launches LPCAMM2 and CAMM2 memory modules for AI PCs and mobile devices, offering space and power savings.江波龙推出LPCAMM2和CAMM2内存模组，面向AI PC和移动设备，节省空间与功耗。
2024-05-16Longsys announced the FORESEE LPCAMM2 memory module, using LPDDR5/5x, supporting 7500MT/s, capacities 16/32/64GB, saving 60% space and 50% power vs SODIMM.江波龙发布FORESEE LPCAMM2内存模组，采用LPDDR5/5x颗粒，支持7500MT/s，容量16/32/64GB，比SODIMM节省60%空间和50%功耗。
2024-09-05Launched new memory expansion modules LPCAMM 2, CAMM 2, and CXL 2.0 to support AI-era high-capacity and high-compute applications.推出了LPCAMM 2、CAMM 2、CXL 2.0等新型内存拓展模块，为AI时代的大容量与高算力应用提供支持。
2025-10-28LPCAMM2 product completed adaptation with Phytium D3000M processor, supporting LPDDR5 interface, forming 'CPU+memory' solution.LPCAMM2产品已完成与飞腾D3000M处理器的适配，支持LPDDR5高速接口，形成“CPU+内存”解决方案。
Strategic partnerships & collaborations战略合作与协作
5 · 2024-05-24 → 2026-05-15
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Partnerships, joint labs, and collaborations with industry players and research institutes.与行业参与者和研究机构的合作伙伴关系、联合实验室及协作。
2024-05-24Longsys signed CLA to join the OpenAnolis community (Linux server OS open-source root community).江波龙签署CLA加入龙蜥社区（Linux服务器操作系统开源根社区）。
2024-12-31Longsys held in-depth exchanges with the Fifth Electronics Research Institute of MIIT (China CEPREI Laboratory) on high-reliability storage and storage testing cooperation at its Zhongshan Storage Industrial Park.江波龙与工业和信息化部电子第五研究所（中国赛宝实验室）在中山存储产业园就高可靠存储和存储实验合作进行深度交流。
2025-12-05Longsys and Shenzhen Huaxianda Technology Co., Ltd. jointly established an innovation lab at Zhongshan Storage Industrial Park, focusing on AI storage product certification testing and smart home scenarios.江波龙与深圳市华曦达科技股份有限公司在中山存储产业园联合成立创新实验室，聚焦AI存储产品认证测试与智能家庭场景。
2026-03-22Longsys subsidiary Lexar announced an official global partnership with the Argentina national football team (World Cup defending champion) for 2026, marking Lexar's first global partner of the year.江波龙旗下雷克沙宣布与世界杯卫冕冠军阿根廷国家队达成2026年度官方全球合作伙伴关系，系该年度首个全球合作伙伴。
2026-05-15Longsys confirmed that Micron Technology is one of its NAND/DRAM wafer suppliers, as part of deep and multi-faceted cooperation with major global wafer foundries.江波龙确认美光科技是其存储晶圆供应商之一，公司已与全球主要晶圆原厂达成深层次、多角度的合作关系。
Executive & governance changes高管与治理变更
6 · 2024-05-29 → 2025-12-30
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Board elections, director appointments, resignations, and governance adjustments.董事会选举、董事任命、辞职及治理调整。
2024-05-29Longsys announced board and supervisory board elections: nominated independent directors Tang Zhongcheng, Chen Weiyue, Huang Zhiqiang; supervisory candidates Gao Wei and Zhang Jihong.江波龙公告董事会和监事会换届：提名独立董事唐忠诚、陈伟岳、黄志强；监事候选人高威、张继红。
2024-06-14Meng Meng elected as employee representative supervisor for the third board of supervisors at the first职工代表大会.孟萌在第一次职工代表大会上被选举为公司第三届监事会职工代表监事。
2024-12-18Longsys non-independent director Zhu Yu resigned due to work adjustment, remaining as deputy general manager and CFO.江波龙非独立董事朱宇因工作调整辞职，仍担任副总经理及财务负责人。
2024-12-18Longsys board nominated Deng Meishan as a candidate for independent director, pending shareholder approval.江波龙董事会提名邓美珊为独立董事候选人，待股东大会审议。
2025-02-17Longsys added Deng Meishan as a director, while Zhu Yu exited from the board, according to Tianyancha.天眼查显示，江波龙新增邓美珊为董事，朱宇从原职务退出。
2025-12-30Longsys' board of directors appointed a new chief financial officer (CFO) at the 15th meeting of the third board of directors.江波龙第三届董事会第十五次会议审议通过聘任公司财务负责人的议案。
Joint venture with Kingston与金士顿的合资企业
2 · 2024-06-09 → 2024-08-27
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Longsys establishes a joint venture with Kingston Technology, with further cooperation details under negotiation.江波龙与金士顿科技成立合资企业，合作细节正在洽谈中。
2024-06-09Established a joint venture with Kingston Technology; further negotiation on detailed cooperation arrangements is ongoing.与金士顿科技共同出资设立合资公司，目前正就合作的细化安排做进一步协商。
2024-08-27Longsys denied media reports of a 'broken cooperation' with Kingston, stating that cooperation discussions are still ongoing and appropriate forms and content require more preparation.江波龙否认与金士顿“合作破裂”的媒体报道，称合作事宜仍在探讨中，需要更多准备。
Share transactions & capital changes股份交易与资本变动
23 · 2024-06-24 → 2026-06-23
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Share reductions, restricted share unlocks, capital changes, and related party transactions.股份减持、限售股解禁、资本变动及关联交易。
2024-06-24311.73 thousand restricted shares (0.76% of total shares) unlocked on June 24, 2024, from equity incentive plan.2024年6月24日有311.73万股限售股份解禁，为股权激励一般股份，占公司总股本0.76%。
2025-05-23Longsys announces the vesting of 3.16 million restricted shares (0.76% of total shares) for 290 employees under the 2023 incentive plan, effective May 26, 2025.江波龙公告2023年限制性股票激励计划归属结果，向290名员工归属316万股（占总股本0.76%），归属日为2025年5月26日。
2025-05-29Longsys reports that due to share vesting, controlling shareholder Cai Huabo and his concert parties' combined stake was passively diluted by 1% integer multiple; no change in control.江波龙公告因股权激励行权，实际控制人蔡华波及其一致行动人合计持股比例被动稀释触及1%整数倍，控制权未变更。
2025-07-30Longsys announced that 300 million restricted shares (71.57% of total shares) will be unlocked and tradable on August 5, 2025. Controlling shareholder Cai Huabo, actual controller Cai Lijiang, and director Wang Jingyang voluntarily pledged not to actively reduce their direct holdings for 12 months from August 5, 2025 to August 4, 2026.江波龙公告3亿股限售股（占总股本71.57%）将于2025年8月5日解禁上市；控股股东蔡华波、实际控制人蔡丽江、董事王景阳自愿承诺自2025年8月5日至2026年8月4日12个月内不主动减持直接持有的股份。
2025-08-04155 million restricted shares (130.48% of pre-unlock float) were unlocked on Aug 5, but controlling shareholders and a director voluntarily pledged not to sell for 12 months.1.55亿股限售股（占解禁前流通市值130.48%）于8月5日解禁，但控股股东及一名董事自愿承诺12个月内不减持。
2025-08-11Director Li Zhixiong plans to sell up to 1.00% of shares, and VP Zhu Yu up to 0.1772%, from Sep 2 to Dec 1, 2025, for personal funding needs.董事李志雄计划减持不超过1.00%股份，副总经理朱宇计划减持不超过0.1772%股份，减持期间为2025年9月2日至12月1日，原因为个人资金需求。
2025-08-20Five pre-IPO employee stock platforms (Longxi No.1,2,3,5 and Longjian) plan to sell up to 5.48 million shares (1.31% of total) from Sep 11 to Dec 10, 2025.五个首发前员工持股平台（龙熹一号、二号、三号、五号及龙舰管理）计划于2025年9月11日至12月10日减持不超过548万股（占总股本1.31%）。
2025-09-04Longsys executives Zhu Yu and director Li Zhixiong collectively reduced their holdings by 167,500 shares (0.04% of total share capital) on September 2, 2025.江波龙高管朱宇与董事李志雄于2025年9月2日合计减持公司股份16.75万股，占公司总股本的0.04%。
2025-10-09Director Li Zhixiong reduced holdings by 200,000 shares, accounting for 0.0477% of total share capital.董事李志雄减持20.0万股，占公司总股本0.0477%。
2025-10-15CFO Zhu Yu allegedly engaged in short-swing trading by buying and selling company shares on the same day.财务负责人朱宇在同一天内买入、卖出公司股票，涉嫌短线交易。
2025-11-05Longsys director Li Zhixiong reduced his shareholding by 100,000 shares on November 4, 2025.2025年11月4日，江波龙董事李志雄减持公司股份10万股。
2025-11-12Longsys director Li Zhixiong completed his share reduction plan, cumulatively selling 4.1915 million shares (1% of total equity) from Sep 2 to Nov 11, 2025.江波龙董事李志雄减持计划实施完毕，2025年9月2日至11月11日累计减持419.15万股，占总股本1%。
2025-11-18Longsys' controlling shareholder Cai Huabo terminated acting-in-concert relationships with several employee stock ownership platforms, reducing his concert party stake from 57.4007% to 42.1744%; control unchanged.江波龙控股股东蔡华波解除与多个员工持股平台的一致行动关系，一致行动人持股比例从57.4007%降至42.1744%；控制权未变。
2025-11-26Longsys vice president Gao Xichun plans to reduce up to 30,648 shares (0.0073% of total equity) via block or centralized trading from Dec 18, 2025 to Mar 17, 2026, for personal funding needs.江波龙副总经理高喜春计划于2025年12月18日至2026年3月17日期间减持不超过3.06万股（占总股本0.0073%），原因为个人资金需求。
2025-12-02Vice General Manager Zhu Yu completed his share reduction plan, selling 580,000 shares at an average price of RMB 108.76 per share, reducing his stake to 0.5710%.副总经理朱宇减持计划期限届满，通过集中竞价减持58万股，减持均价108.76元/股，持股降至0.5710%。
2026-01-16Five pre-IPO shareholders (Longxi No.1-5) plan to transfer 12.5744 million shares (3% of total) via block trade for their own funding needs.五家首发前股东（龙熹一号至五号）拟通过询价转让合计1257.44万股（占总股本3%），原因为自身资金需求。
2026-01-19Block trade priced at RMB 212.09/share; fully subscribed by 54 institutional investors for total 12,574,358 shares (RMB 2.667 billion).询价转让定价212.09元/股，获54名机构投资者全额认购，合计1257.44万股（26.67亿元）。
2026-03-19Longsys director Li Zhixiong (holding 4.5112%) plans to sell up to 2.4 million shares (0.5726%) and VP Gao Xichun (holding 0.0219%) plans to sell up to 22,986 shares (0.0055%) via block or centralized竞价 from April 13 to July 12, 2026.江波龙董事李志雄（持股4.5112%）计划在2026年4月13日至7月12日期间减持不超过240万股（0.5726%），副总经理高喜春（持股0.0219%）计划减持不超过22986股（0.0055%）。
2026-05-13Longsys' employee representative director Li Zhixiong reduced his holdings by 200,000 shares (0.05% of total shares) via block trading on May 12, cashing out approximately 112 million yuan. Cumulative reductions since Sep 2025 total 4.3912 million shares, cashing out about 751 million yuan.江波龙职工代表董事李志雄于5月12日通过竞价交易减持20万股（占总股本0.05%），套现约1.12亿元。自2025年9月起累计减持439.12万股，累计套现约7.51亿元。
2026-05-19Longsys' actual controller Cai Huabo and his concert party Cai Lijiang's combined shareholding was passively diluted from 42.17% to 41.78% due to the vesting of restricted stock incentive plans, triggering a 1% threshold disclosure.因限制性股票激励计划归属实施，江波龙实际控制人蔡华波及其一致行动人蔡丽江合计持股比例由42.17%被动稀释至41.78%，触及1%整数倍。
2026-05-27Longsys' employee representative director Li Zhixiong reduced his holdings by 100,000 shares (0.02% of total shares) on May 26, cashing out approximately 53.41 million yuan. Cumulative reductions since Sep 2025 total 4.9823 million shares, cashing out about 1.1 billion yuan.江波龙职工代表董事李志雄于5月26日减持10万股（占总股本0.02%），套现约5341.1万元。自2025年9月起累计减持498.23万股，累计套现约11亿元。
2026-06-05Longsys announced that VP Zhu Yu plans to reduce holdings by up to 598,375 shares (0.1414% of total) from June 30 to September 29, 2026, for personal funding needs.江波龙公告副总经理朱宇计划在2026年6月30日至9月29日期间减持不超过59.8375万股（占总股本0.1414%），原因为个人资金需求。
2026-06-23Longsys board member Li Zhixiong reduced holdings by 41,200 shares on June 23, cumulatively reducing 6.364 million shares for about RMB 1.874 billion since September 2025.江波龙职工代表董事李志雄于6月23日减持4.12万股，自2025年9月以来累计减持636.4万股，套现约18.74亿元。
Zilia Brazil subsidiaryZilia巴西子公司
11 · 2024-07-02 → 2026-06-16
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Longsys' Brazilian subsidiary Zilia expands packaging production and revenue, benefiting from Brazil's semiconductor policy.江波龙巴西子公司Zilia扩大封测产能和收入，受益于巴西半导体政策。
2024-07-02Longsys Brazil subsidiary Zilia (Zhiyi Brazil) starts packaging production of Longsys storage lines; announces BRL 650 million (approx. RMB 859 million) investment plan for R&D and capacity expansion.江波龙巴西子公司Zilia（智忆巴西）开始封装生产江波龙存储产线；公布6.5亿雷亚尔（约8.59亿元人民币）投资计划，用于研发创新及产能扩张。
2024-08-08Longsys stated that its subsidiary Zilia (formerly SMART Brazil), a leading storage chip packaging/testing and memory manufacturer in Brazil, will serve as a base to expand overseas market share and support domestic NAND wafer capacity in global competition.江波龙表示，其子公司Zilia（原SMART Brazil）作为巴西领先的存储芯片封测与存储器制造商，将作为扩大海外市场份额的基础，并为国产存储晶圆产能参与国际竞争提供支撑。
2024-09-05Controlling subsidiary Zilia Eletrônicos proposed to provide a guarantee of up to USD 15 million for subsidiary Zilia Semicondutores.控股子公司Zilia Eletrônicos拟为子公司Zilia Semicondutores提供最高额不超过1500万美元的担保。
2024-09-14Brazil's President Lula signed the Brazil Semiconductor Plan (PL 13/2020); Zilia CEO Rogério Nunes (a Longsys subsidiary) attended the ceremony, expecting 24.8 billion reais investment by 2035.巴西总统卢拉签署巴西半导体计划（PL 13/2020）；江波龙子公司Zilia CEO出席仪式，预计到2035年该行业将吸引约248亿雷亚尔投资。
2024-10-09Longsys' subsidiary Zilia Semicondutores signed a standby letter of credit guarantee of USD 9 million with Santander Bank Brazil; Longsys provided a guarantee of up to USD 15 million.江波龙控股子公司Zilia Semicondutores与桑坦德银行-巴西公司签署了900万美元备用信用证担保，江波龙提供不超过1500万美元的担保。
2024-11-04Longsys reported that Brazilian subsidiary Zilia generated 991 million yuan revenue in H1 2024, contributing positive profit; Q3 2024 revenue and profit maintained upward trend.江波龙表示巴西子公司Zilia 2024上半年收入9.91亿元，贡献正利润；三季度收入利润保持增长。
2025-02-14Longsys stated its acquisition of Brazil's Zilia (formerly SMART Modular) provides a local manufacturing base in the Americas and a platform for domestic NAND wafer capacity to compete globally.江波龙表示收购巴西Zilia（原SMART Modular）后，获得了在美洲本土生产制造存储产品的能力，并为国产存储晶圆产能参与国际竞争提供支撑平台。
2025-02-18Longsys reported that its Brazilian subsidiary Zilia achieved sales revenue of about 2.3 billion yuan in 2024, a year-on-year increase of about 120%.江波龙披露巴西子公司Zilia 2024年实现销售收入约23亿元，同比增长约120%。
2025-12-30Longsys plans to acquire the remaining 19% equity of subsidiary Zilia Eletrônicos for USD 46.08 million via its wholly-owned subsidiary Lexar Europe B.V., making Zilia a wholly-owned subsidiary to deepen its Brazil market presence.江波龙拟通过全资子公司Lexar Europe B.V.以4608万美元收购控股子公司Zilia Eletrônicos剩余19%股权，交易后Zilia成为全资子公司，深耕巴西市场。
2026-04-01Completed acquisition of Zilia Eletrônicos, paying $40 million after tax, making it a wholly-owned subsidiary.完成对Zilia Eletrônicos的收购，税后实际支付4000万美元，使其成为全资子公司。
2026-06-16Longsys disclosed that Zilia became its 100% wholly-owned subsidiary on March 31, 2026, after receiving revised documents and paying taxes.江波龙披露，在收到相关修订文件和缴纳税款后，Zilia于2026年3月31日正式成为其100%全资子公司。
Shanghai R&D center & headquarters上海研发中心与总部
2 · 2024-07-10 → 2025-08-26
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Longsys establishes a new R&D center in Shanghai and moves headquarters to Lingang, focusing on enterprise and automotive storage.江波龙在上海设立新研发中心并将总部迁至临港，聚焦企业级和车规级存储。
2024-07-10Longsys establishes a new R&D center in Shanghai, focusing on enterprise-grade and automotive-grade memory products.江波龙在上海建立研发中心，专注于企业级和车规级存储器产品研发。
2025-08-26Longsys' Shanghai headquarters was inaugurated in Lingang New Area, housing 500+ R&D staff, focusing on enterprise and automotive-grade storage and self-developed controller chips.江波龙上海总部在临港新片区落成，入驻500多名研发人员，聚焦企业级和车规级存储及自研主控芯片。
IP & patents知识产权与专利
4 · 2024-07-15 → 2026-03-22
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Software copyrights, patents, and intellectual property registrations.软件著作权、专利及知识产权注册。
2024-07-15Longsys registers new software copyright 'Video Integrity Verification Software V1.0.0'; total software copyrights in 2024 up 100% YoY.江波龙新注册《视频完整性校验软件V1.0.0》软件著作权；2024年新注册软件著作权较去年同期增加100%。
2024-07-27Longsys registers new software copyright 'Lexar Partner WeChat Mini Program V1.0.24'; total software copyrights in 2024 up 200% YoY.江波龙新注册《Lexar合伙人微信小程序V1.0.24》软件著作权；2024年新注册软件著作权较去年同期增加200%。
2025-05-25Longsys registers two new software copyrights: 'Tree Structure and Table Combination Software V1.5' and 'Input Box with History Function Software V1.0'.江波龙新注册2项软件著作权：《一种树形结构和表格相结合的软件V1.5》和《一种带历史记录功能的输入框软件V1.0》。
2026-03-22Longsys registered a new software copyright for 'Print Management System V1.0.0', bringing its total software copyrights to 113; R&D spending in H1 2025 was RMB 446 million, down 6.25% YoY.江波龙新注册《打印管理系统V1.0.0》软件著作权，累计软件著作权达113项；2025上半年研发投入4.46亿元，同比减少6.25%。
FORESEE brand & B2B storageFORESEE品牌与B2B存储
4 · 2024-07-31 → 2026-03-06
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FORESEE brand launches enterprise, industrial, and automotive storage products, winning awards and certifications.FORESEE品牌推出企业级、工业级和车规级存储产品，获得奖项与认证。
2024-07-31Longsys launches FORESEE XP2300 series PCIe 4.0 M.2 2280 SSD with 236-layer 3D TLC NAND, sequential read/write up to 7400/6700 MB/s, capacities 256GB-4TB, targeting AI PC and thin laptops.江波龙推出FORESEE XP2300系列PCIe 4.0 M.2 2280 SSD，搭载236层3D TLC NAND闪存，顺序读写最高7400/6700 MB/s，容量256GB-4TB，面向AI PC和超薄笔记本。
2024-10-17Longsys showcased its FORESEE power-utility dedicated eMMC at the 49th International Symposium on Electromagnetic Measurement Technology, offering 8GB-32GB capacity and wide temperature range (-40°C to 105°C).江波龙在第49届电磁测量技术国际研讨会上展示FORESEE电力专用eMMC，提供8GB至32GB容量，支持-40℃~105℃宽温范围。
2024-10-22Longsys launched FORESEE microSD Express Card (PCIe interface, SSD-like performance), FORESEE XP2300 PCIe SSD (256GB-4TB), and FORESEE UNCIA 3836 series enterprise SATA SSD.江波龙推出FORESEE microSD Express Card（融合PCIe接口，性能接近SSD）、FORESEE XP2300 PCIe SSD（256GB~4TB）和FORESEE UNCIA 3836系列企业级SATA SSD。
2026-03-06Longsys showcased automotive-grade storage (UFS 2.1/3.1, AEC-Q100, IATF 16949 certified), AI Robot storage (mSSD, AI Storage Core, AI-Grade series), and data-center products (SOCAMM2, MRDIMM, SATA eSSD) at an embedded world event.江波龙在嵌入式展上展示车规级存储（UFS 2.1/3.1，通过AEC-Q100和IATF 16949认证）、AI机器人存储（mSSD、AI Storage Core、AI-Grade系列）及数据中心产品（SOCAMM2、MRDIMM、SATA eSSD）。
Guarantees & financing担保与融资
11 · 2024-08-19 → 2026-03-12
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Provision of guarantees for subsidiaries, credit facilities, and financing arrangements.为子公司提供担保、信贷额度及融资安排。
2024-08-19Longsys' board meeting approved a proposal to adjust guarantee quotas among subsidiaries.江波龙董事会会议审议通过了《关于在子公司之间调剂担保额度的议案》。
2024-10-28Longsys' wholly-owned subsidiaries Hong Kong Longsys and Shanghai Longsys Microelectronics agreed to provide guarantees for Longsys' loan of up to RMB 1.5 billion from China Development Bank Shenzhen Branch.江波龙全资子公司香港江波龙和上海江波龙微电子同意为公司向国家开发银行深圳市分行申请不超过15亿元贷款提供担保。
2024-12-20Longsys subsidiary Shanghai Longsys Storage provided a guarantee of up to RMB 145 million for its affiliate Shanghai Longsys Digital Technology's supplier purchases.江波龙全资子公司上海江波龙存储为关联公司上海江波龙数字技术向供应商采购提供不超过1.45亿元的连带责任保证担保。
2025-01-21Longsys provided a joint liability guarantee for subsidiary Maisiduo Electronics (迈仕渡电子) for a 100 million yuan financing facility with SPD Bank; total external guarantee balance reached 4.6 billion yuan, within the approved 9 billion yuan limit.江波龙为子公司迈仕渡电子向浦发银行申请的1亿元融资额度提供连带责任保证担保；对外担保余额46亿元，未超90亿元额度上限。
2025-03-20Longsys announced a total external guarantee limit of RMB 11 billion for 2025, covering subsidiaries within the consolidated statements, accounting for 170.08% of the latest audited net assets.江波龙公告2025年度对外担保总额度为110亿元，全部为对合并报表范围内子公司的担保，占最近一期经审计净资产的比例为170.08%。
2025-08-13Longsys provided a guarantee of up to RMB 770 million for subsidiary Hong Kong Longsys and Shenzhen Lexar, within the total approved guarantee limit of RMB 11 billion.江波龙为子公司香港江波龙和深圳雷克沙提供最高7.7亿元担保，在已批准的总额度110亿元范围内。
2025-11-21Longsys provided guarantee of up to RMB 200 million for subsidiary Huiyi Microelectronics (Shanghai) for a comprehensive credit facility with Shanghai Pudong Development Bank, and adjusted/rolled over Hong Kong Longsys' credit line to a principal balance of up to RMB 300 million.江波龙为子公司慧忆微电子（上海）向浦发银行申请综合授信提供最高2亿元保证担保，并调整展期香港江波龙授信业务，主债权本金余额提高至不超过3亿元。
2026-01-16Provided RMB 200 million guarantee to wholly-owned subsidiary Longsys Electronics (Hong Kong) for a loan from China Construction Bank Shenzhen branch.为全资子公司江波龙电子（香港）提供2亿元人民币担保，用于建设银行深圳市分行贷款。
2026-03-03Longsys announced it will add up to RMB 4.055 billion in guarantee quotas for subsidiaries (including Longsys Electronics HK, Shanghai Huiyi Semiconductor, Shenzhen Damai Technology), effective from the 2026 first EGM to the 2025 AGM.江波龙公告拟新增对子公司（含江波龙电子香港、上海慧忆半导体、深圳市大迈科技）不超过40.55亿元人民币的担保额度，期限自2026年第一次临时股东会至2025年年度股东会。
2026-03-04Longsys provided a RMB 200 million guarantee for its wholly-owned subsidiary Lexar Electronics (Shenzhen) as acceptor for electronic commercial acceptance bills, bringing the guarantee balance for Lexar Shenzhen to RMB 300 million.江波龙为全资子公司雷克沙电子（深圳）提供2亿元人民币担保作为电子商业承兑汇票承兑保证人，对深圳雷克沙担保余额增至3亿元。
2026-03-12Longsys provided a RMB 200 million guarantee for its wholly-owned subsidiary Zhongshan Longsys Electronics to China Everbright Bank Shenzhen Branch for comprehensive credit, bringing the guarantee balance for Zhongshan Longsys to RMB 400 million.江波龙为全资子公司中山市江波龙电子向中国光大银行深圳分行申请综合授信提供最高2亿元保证担保，中山江波龙担保余额增至4亿元。
PTM (Product Technology Manufacturing) business modelPTM（产品技术制造）业务模式
3 · 2024-09-23 → 2025-05-20
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Longsys introduces PTM model offering full-stack customization from NAND/DRAM to firmware and hardware.江波龙推出PTM模式，提供从NAND/DRAM到固件和硬件的全栈定制。
2024-09-23At ELEXCON 2024 Shenzhen, Longsys debuted its PTM (Product Technology Manufacturing) business model, showcasing self-developed high-performance eMMC 5.1 controller chip, SD 6.1 controller chip, and industry-leading 2xnm SLC NAND Flash chip.在ELEXCON 2024深圳国际电子展上，江波龙首次提出PTM商业模式，展示了自研高性能eMMC 5.1控制器芯片、SD 6.1控制器芯片及业界领先的2xnm SLC NAND Flash芯片。
2024-11-14Longsys debuted at Munich Electronica exhibition, launching PTM (Product Technology Manufacturing) business model and new industrial/automotive storage products including xSPI NOR Flash and Grade2 LPDDR4x.江波龙在慕尼黑电子展首次推出PTM商业模式及工规/车规新品，包括xSPI NOR Flash和Grade2 LPDDR4x。
2025-05-20Longsys details its PTM (Product Technology Manufacturing) foundry model and ESAT dedicated-line service for customized automotive storage solutions, targeting smart cockpits and ADAS.江波龙详解其PTM（存储产品技术制造）Foundry模式及ESAT专品专线服务，提供定制化汽车存储方案，面向智能座舱和辅助驾驶。
National Integrated Circuit Fund stake changes国家集成电路基金持股变动
6 · 2024-09-23 → 2025-08-22
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The National Integrated Circuit Industry Fund reduces its stake in Longsys through multiple sales, falling below 5%.国家集成电路产业基金多次减持江波龙股份，持股比例降至5%以下。
2024-09-23Second-largest shareholder National Integrated Circuit Fund (国家集成电路基金) plans to reduce its stake by up to 0.36% (1,497,533 shares) from Oct 22, 2024 to Jan 20, 2025.第二大股东国家集成电路产业投资基金计划在2024年10月22日至2025年1月20日期间减持不超过0.36%股份（149.75万股）。
2024-11-07National Integrated Circuit Industry Fund completed its share reduction plan, selling 1.4975 million shares (0.36% of total) at average price 86.82 yuan per share; holding reduced to 5.82%.国家集成电路产业基金完成减持计划，减持149.75万股（占总股本0.36%），均价86.82元/股；持股降至5.82%。
2025-04-30Shareholder National Integrated Circuit Industry Fund (Big Fund) plans to reduce its stake by up to 1% (4,159,815 shares) via centralized竞价 trading from May 27 to August 26, 2025, for own operational needs.股东国家集成电路产业投资基金计划于2025年5月27日至8月26日通过集中竞价交易减持不超过415.98万股（占总股本1%），原因为自身经营管理需要。
2025-07-09National Integrated Circuit Industry Investment Fund reduced its stake in Longsys via centralized bidding from June 19 to July 9, 2025, cumulatively selling 3.2596 million shares (0.77769% of total shares), lowering its holding to 4.99998%, no longer a 5%+ shareholder.国家集成电路产业投资基金于2025年6月19日至7月9日通过集中竞价累计减持江波龙325.96万股（占总股本0.77769%），持股比例降至4.99998%，不再是持股5%以上股东。
2025-07-23National Integrated Circuit Industry Investment Fund completed its reduction plan, cumulatively selling 4.1598 million shares (0.99245% of total shares) from June 19 to July 23, 2025, holding 4.78521% post-reduction, no longer a 5%+ shareholder.国家集成电路产业投资基金于2025年6月19日至7月23日完成减持计划，累计减持415.98万股（占总股本0.99245%），减持后持股4.78521%，不再是持股5%以上股东。
2025-08-22National Integrated Circuit Industry Fund (Big Fund) reduced its stake in Longsys to below 5%, ceasing to be a 5%+ shareholder.国家集成电路产业基金（大基金）对江波龙的持股比例降至5%以下，不再是持股5%以上股东。
Joint venture with VeriSilicon (Shanghai XinZhan)与芯原股份的合资企业（上海芯展）
1 · 2024-10-15
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Longsys co-founds Shanghai XinZhan Technology with VeriSilicon for IC design and related services.江波龙与芯原股份共同成立上海芯展科技，从事IC设计及相关服务。
2024-10-15Longsys, through its wholly-owned subsidiary Xizang Yuanshi Venture Capital Management, co-founded Shanghai XinZhan Technology Co., Ltd. with VeriSilicon (688521), with registered capital of RMB 10 million.江波龙通过全资子公司西藏远识创业投资管理有限公司与芯原股份（688521）共同成立上海芯展科技有限公司，注册资本1000万元。
Awards & certifications奖项与认证
2 · 2024-11-12 → 2026-05-29
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Industry awards, recognitions, and certifications received by the company.公司获得的行业奖项、认可及认证。
2024-11-12Longsys won the 2023 Guangdong Provincial Science and Technology Award First Prize for 'High-performance Large-capacity Solid-state Storage Controller Key Technology R&D and Application' project.江波龙“高性能大容量固态存储控制器关键技术研发及应用”项目获2023年度广东省科学技术奖科技进步奖一等奖。
2026-05-29Longsys was included in the CSI 300 Index, with the adjustment effective after market close on June 12, 2026.江波龙被调入沪深300指数样本，调整于2026年6月12日收市后生效。
H-share Hong Kong listingH股香港上市
9 · 2024-12-18 → 2026-05-29
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Longsys plans and files for H-share listing on the Hong Kong Stock Exchange to advance globalization.江波龙计划并提交H股香港联交所上市申请，推进全球化战略。
2024-12-18Longsys announced plans to issue H-shares and apply for a main board listing on the Hong Kong Stock Exchange to advance its globalization strategy.江波龙公告拟发行H股股票并申请在香港联交所主板挂牌上市，以推进全球化战略。
2025-03-21Longsys submitted a listing application to the Hong Kong Stock Exchange for the issuance of H-shares and listing on the Main Board, with Citigroup and CITIC Securities as joint sponsors.江波龙向香港联交所递交了发行境外上市外资股（H股）并在主板挂牌上市的申请，联席保荐人为花旗和中信证券。
2025-04-02Longsys officially submitted a listing application to the Hong Kong Stock Exchange, planning to list on the Main Board with Citigroup and CITIC Securities as joint sponsors, aiming for an A+H dual listing.江波龙正式向香港联交所提交上市申请，计划登陆港交所主板，联席保荐人为花旗集团和中信证券，旨在实现A+H两地上市。
2025-04-14Longsys' H-share listing filing materials were received by the China Securities Regulatory Commission (CSRC), advancing the A+H dual-listing process.江波龙发行H股上市的备案申请材料获中国证监会接收，推进A+H两地上市进程。
2025-05-09Longsys files for Hong Kong Stock Exchange main board IPO, with Citigroup and CITIC Securities as joint sponsors, pursuing an A+H dual listing.江波龙递表港交所主板，联席保荐人为花旗集团和中信证券，推进A+H两地上市。
2025-10-15Company is planning A+H dual listing; H-share issuance received CSRC filing approval on September 15.公司正在筹划A+H两地上市，H股发行于9月15日获得中国证监会备案。
2026-02-27Longsys confirmed that its A-share private placement and H-share listing are still pending regulatory approvals, and the company will disclose information in accordance with regulations.江波龙确认，其A股定增与港股发行上市事项尚需取得监管机关批准，公司将按规定进行信息披露。
2026-05-29Longsys re-filed its H-share listing application with the Hong Kong Stock Exchange, aiming for an A+H dual listing. Joint sponsors are CITIC Securities and Citigroup. Financials: 2025 revenue 22.766 billion yuan, adjusted profit 1.398 billion yuan.江波龙重新向港交所递交H股上市申请，拟实现A+H两地上市，联席保荐人为中信证券、花旗。2025年收入227.66亿元，经调整溢利13.98亿元。
2026-05-29Longsys re-filed a listing application on the Main Board of HKEX, with CICC and Citigroup as joint sponsors, aiming for an A+H dual listing structure.江波龙重新向港交所主板提交上市申请，中信证券、花旗担任联席保荐人，目标形成A+H双上市架构。
Subsidiaries & equity incentives子公司与股权激励
5 · 2024-12-18 → 2026-05-20
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Subsidiary operations, equity incentive plans, capital increases, and related transactions.子公司运营、股权激励计划、增资及相关交易。
2024-12-18Longsys subsidiary Huiyi Microelectronics (Shanghai) implemented an equity incentive for core employees via a capital increase of RMB 43 million, with VP Gao Xichun contributing RMB 4.29 million.江波龙子公司慧忆微电子（上海）通过增资4300万元对核心骨干员工实施股权激励，副总经理高喜春出资429万元。
2025-05-07Longsys indirectly wholly owns a new subsidiary, Zhongshan Hongxin Suhang Supply Chain Co., Ltd., with registered capital of 5 million yuan, covering IC chip design and supply chain services.江波龙间接全资持股新子公司中山市鸿芯速航供应链有限公司，注册资本500万元，业务涵盖集成电路芯片设计及供应链管理服务。
2026-03-03Longsys subsidiary Huiyi Microelectronics allocated reserved incentive shares worth RMB 4.285 million to VP Gao Xichun, who now holds 6% of Huiyi Microelectronics via the plan at RMB 1/registered capital.江波龙子公司慧忆微电子将428.5万元预留激励份额归属副总经理高喜春，其穿透后持有慧忆微电子6%股权，激励价格1元/注册资本。
2026-04-07Subsidiary Shanghai Yuanmingxin Microelectronics completed capital increase of 86 million yuan for equity incentives, registered capital changed from 200 million to 286 million yuan.子公司上海元铭芯微电子完成8600万元股权激励增资，注册资本由2亿元变更为2.86亿元。
2026-05-20Longsys granted 4.62 million second-class restricted shares (1.104% of total shares) at a grant price of 192.92 yuan per share to 637 incentive recipients on May 19.江波龙于5月19日首次授予462万股第二类限制性股票（占总股本1.104%），授予价格192.92元/股，激励对象637人。
Joint venture with Memory Technologies (MTR Storage)与Memory Technologies的合资企业（MTR Storage）
1 · 2024-12-25
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Longsys co-founds MTR Storage Technology with Memory Technologies LLC for IC sales and cloud computing.江波龙与Memory Technologies LLC共同成立MTR Storage Technology，从事IC销售和云计算。
2024-12-25Longsys, through its subsidiary Shenzhen Anjiecun Electronics, co-founded MTR Storage Technology (Shenzhen) with Memory Technologies LLC, with registered capital of USD 100,000, covering IC sales and cloud computing services.江波龙通过旗下深圳市安捷存电子有限公司与Memory Technologies LLC共同成立埃姆梯尔存储技术（深圳）有限公司，注册资本10万美元，业务含集成电路销售和云计算装备技术服务。
AI wearable & edge AI storage (ePOP, mSSD, SPU)AI可穿戴与边缘AI存储（ePOP、mSSD、SPU）
24 · 2025-01-24 → 2026-06-09
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Longsys develops ultra-small eMMC, ePOP, mSSD, and SPU for AI wearables, smart glasses, and edge AI devices.江波龙开发超小eMMC、ePOP、mSSD和SPU，用于AI可穿戴、智能眼镜和边缘AI设备。
2025-01-24Longsys launched a new ultra-small eMMC with dimensions 7.2mm x 7.2mm x 0.8mm, weight 0.1g, capacities 64GB and 128GB, self-developed firmware, low-power technology, packaged at its Suzhou facility using innovative grinding and cutting process.江波龙推出全新超小尺寸eMMC，尺寸7.2mm×7.2mm×0.8mm，重量0.1g，容量64GB和128GB，搭载自研固件和低功耗技术，由苏州封测基地采用创新研磨切割工艺完成封装。
2025-01-27Longsys disclosed in an investor call that its ePOP products are used in smart wearables by Xiaotiancai (小天才) and Garmin (佳明), and ePOP4X has passed certification from Qualcomm and Unisoc; it is actively engaging with leading AI wearable clients.江波龙在电话会议中披露，其ePOP产品已应用于小天才、佳明等智能穿戴设备，ePOP4X通过高通、展锐认证；正与头部AI穿戴客户深入交流。
2025-02-05Longsys launched an innovative 7.2mm x 7.2mm ultra-small eMMC storage solution for AI wearable devices, reducing area by about 65% and weight by nearly 67% compared to standard eMMC.江波龙推出创新性7.2mm×7.2mm超小尺寸eMMC存储解决方案，用于AI智能穿戴设备，面积较标准eMMC减少约65%，重量减轻近67%。
2025-02-20Longsys launched a new wearable storage product, the 0.6mm (max) ultra-thin ePOP4x, integrating eMMC and LPDDR4x, claimed to be one of the thinnest ePOP products on the market.江波龙发布穿戴存储新品0.6mm（max）超薄ePOP4x，集成eMMC和LPDDR4x，号称当前市场上最薄的ePOP产品之一。
2025-02-25Longsys confirmed its embedded storage is widely used in smart glasses and other wearable devices, citing a third-party teardown report of XREAL smart glasses showing its products inside.江波龙确认其嵌入式存储已广泛应用于智能眼镜等智能穿戴领域，第三方XREAL智能眼镜拆机报告展示了其产品应用。
2025-05-28Longsys confirms that its embedded storage is used in XREAL smart glasses and Unitree robot dogs, and has launched QLC eMMC, 0.6mm ultra-thin ePOP4x, and 7.2mm x 7.2mm ultra-small eMMC for smart devices.江波龙确认其嵌入式存储用于XREAL智能眼镜和宇树机器狗，并推出QLC eMMC、0.6mm超薄ePOP4x及7.2mm×7.2mm超小尺寸eMMC等产品。
2025-06-30Disclosed long-term cooperation with multiple smart glasses manufacturers, including XREAL; launched ultra-thin ePOP4x (0.6mm max) and ultra-small eMMC (7.2mm x 7.2mm) to support thin and light designs.披露与包括XREAL在内的多家智能眼镜厂商达成长期合作；推出超薄ePOP4x（最大0.6mm）和超小尺寸eMMC（7.2mm×7.2mm），支持轻薄化设计需求。
2025-10-20Launched industry-first integrated packaged mSSD (Micro SSD), using wafer-level SiP, size 20x30x2.0mm, weight 2.2g, supports PCIe Gen4x4, sequential read up to 7400MB/s, capacities 512GB-4TB, in mass production ramp-up.推出业内首款集成封装mSSD（Micro SSD），采用晶圆级系统级封装，尺寸20×30×2.0mm，重2.2g，支持PCIe Gen4×4，顺序读取最高7400MB/s，容量512GB~4TB，处于量产爬坡阶段。
2025-11-19Longsys showcased mSSD and NFC PSSD (with WM3000 controller) at a summit, featuring NFC-touch unlock and iTAP standard compatibility for AI and robotics applications.江波龙在峰会展出mSSD与NFC PSSD（搭载WM3000主控），支持NFC碰触解锁及iTAP标准，面向AI与机器人应用。
2025-11-27Longsys launched the industry's first AI Storage Core, based on mSSD integrated packaging, with up to 4TB capacity, PCIe bus, and hot-swap design, released under the Lexar brand.江波龙发布行业首款AI Storage Core，基于mSSD集成封装，容量高达4TB，支持PCIe总线与热插拔设计，以雷克沙品牌推出。
2026-01-06Introduced first integrated-package mSSD (20x30x2.0mm, 2.2g, PCIe Gen4x4) and industry-first AI Storage Core product, launched under Lexar brand.推出首款集成封装mSSD（20x30x2.0mm，2.2g，PCIe Gen4x4）和行业首款AI Storage Core产品，以雷克沙品牌发布。
2026-01-09Launched first AI wearable storage ePOP5x at CES 2026.在CES 2026上推出首款AI穿戴存储ePOP5x。
2026-03-03At MWC 2026 in Barcelona, Longsys launched self-developed HLC UFS (High Level Cache) and pTLC UFS technologies, and an ultra-thin ePOP5x package (0.52mm thick, LPDDR5x 8533Mbps), targeting AI wearables and mobile terminals.在巴塞罗那MWC 2026上，江波龙发布自研HLC UFS（高阶缓存）和pTLC UFS技术，以及超薄ePOP5x封装（厚度0.52mm，LPDDR5x 8533Mbps），面向AI可穿戴和移动终端。
2026-03-06Longsys stated in an investor relations event that its mSSD uses Wafer-level SiP for thinness and compactness, maintaining performance comparable to traditional SSDs while offering better physical characteristics and cost advantages.江波龙在投资者关系活动中表示，其mSSD通过Wafer级系统级封装实现轻薄化紧凑化，保持与传统SSD相当性能，具备更优物理特性和成本优势。
2026-03-27At CFMS | MemoryS 2026, Longsys demonstrated a PCIe 5.0 mSSD solution with a dedicated散热 expansion card, using a M.2 2030 mSSD that converts to M.2 2280, achieving 39°C under load.在CFMS | MemoryS 2026峰会上，江波龙展示PCIe 5.0 mSSD方案，采用M.2 2030规格mSSD配合专用散热拓展卡转换为M.2 2280，负载温度仅39°C。
2026-03-30Longsys extended its integrated-package mSSD product line to PCIe Gen5 at CFMS | MemoryS 2026, using the Maxio MAP1802 controller, DRAM-less, 20mm×30mm size, with sequential reads/writes exceeding 11/10 GB/s and up to 8TB capacity.江波龙在CFMS | MemoryS 2026上将集成封装mSSD产品线扩展至PCIe Gen5，采用联芸MAP1802主控，无DRAM设计，尺寸20mm×30mm，顺序读写超11/10 GB/s，最高8TB容量。
2026-04-07Launched SPU (Storage Processing Unit), iSA (Intelligent Storage Agent), HLC (High Level Cache), and PCIe Gen 5 mSSD at CFMS|MemoryS 2026.在CFMS|MemoryS 2026上推出SPU（存储处理单元）、iSA（存储智能体）、HLC（高级缓存）及PCIe Gen 5 mSSD等系列新品。
2026-04-27Disclosed that mSSD product has entered qualification testing with top PC OEMs, expected to achieve large-scale replacement of traditional SSDs in 2026.披露mSSD产品已进入头部PC厂商的导入测试阶段，预计2026年对传统SSD实现规模化替代。
2026-04-27Disclosed that ePOP4x product is already in volume production for smart wearables of a North American tech giant, and also used in Xiaomi, Alibaba Quark, XREAL, Rokid devices.披露ePOP4x产品已批量应用于北美智能穿戴科技巨头的设备中，并用于小米、阿里夸克、XREAL、Rokid等厂商的智能穿戴产品。
2026-05-08Longsys launched new storage products for edge AI: UFS4.1 (mass shipments), mSSD (entering top PC OEM qualification testing, expected to scale replace traditional SSD in 2026), ultra-thin ePOP5x, and ePOP4x (already mass-applied in a North American smart wearable tech giant's devices).江波龙推出多款适配端侧AI设备的新型存储产品：UFS4.1已规模化出货；mSSD已进入头部PC厂商导入测试阶段，预计2026年规模化替代传统SSD；ePOP4x已批量应用于北美智能穿戴科技巨头的智能穿戴设备中。
2026-05-25Longsys innovatively launched mSSD using integrated packaging technology, eliminating solder joints, optimizing volume and heat dissipation, targeting lightweight smart hardware such as drones, game consoles, and VR devices for edge AI.江波龙创新推出mSSD，采用集成封装工艺实现焊点归零，优化体积与散热，适配无人机、游戏掌机、VR设备等轻量化智能硬件的端侧AI应用。
2026-05-28Longsys announced it will release two new memory products specifically for edge AI inference at an upcoming exhibition, alongside showcasing its SPU, HLC, and iSA technologies for MoE large model optimization.江波龙宣布将在展会上发布两款专为端侧AI推理打造的内存新品，并展示SPU、HLC、iSA等针对MoE大模型优化的技术。
2026-06-02At COMPUTEX 2026, Longsys launched two dedicated edge-AI memory products: AIDIMM (up to 128GB, 256-bit, 9600MT/s LPDDR5X) and AILPBGA (24-64GB, BGA1764, 9600MT/s LPDDR5X).在COMPUTEX 2026上，江波龙推出两款专用端侧AI内存产品：AIDIMM（最高128GB、256位、9600MT/s LPDDR5X）和AILPBGA（24-64GB、BGA1764封装、9600MT/s LPDDR5X）。
2026-06-09Longsys stated on the investor platform that its edge-AI storage solution has completed joint tuning with AMD and is advancing commercialization.江波龙在投资者平台表示，其端侧AI存储解决方案已与AMD完成联合调优，并正在推进商业化。
Industrial-grade storage工业级存储
2 · 2025-03-07 → 2025-03-24
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Longsys launches industrial-grade SSDs, DDR5 DIMMs, and other products for industrial applications.江波龙推出工业级SSD、DDR5 DIMM等产品，面向工业应用。
2025-03-07Longsys announced it will launch new industrial-grade storage products (DDR5 DIMM, large-capacity SATA SSD, PCIe Gen4 SSD) and automotive-grade storage products (LPDDR4x, UFS, eMMC, SPI NAND Flash) at Embedded World 2025, including a new vehicle surveillance SSD supporting 24-channel 1080p video.江波龙宣布将在2025年德国嵌入式展上推出新一代工规级存储产品（DDR5 DIMM、大容量SATA SSD、PCIe Gen4 SSD）和车规级存储产品（LPDDR4x、UFS、eMMC、SPI NAND Flash），包括一款支持24路1080p视频的新一代车载监控SSD。
2025-03-24Longsys' 6688 series industrial-grade SSD won the 'Industrial Core' New Quality Award at the China Automation + Digitalization Industry Annual Conference.江波龙6688系列工规级SSD在中国自动化+数字化产业年会上斩获“工业芯”新质奖。
MRDIMM enterprise memoryMRDIMM企业级内存
1 · 2025-03-12
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Longsys launches MRDIMM (Multiplexed Rank DIMM) compatible with DDR5 slots for seamless performance upgrade.江波龙推出MRDIMM，兼容DDR5插槽，实现无缝性能升级。
2025-03-12At MemoryS 2025, Longsys launched a new enterprise-grade memory module MRDIMM (Multiplexed Rank DIMM), which is compatible with existing DDR5 slots and supports plug-and-play for seamless performance upgrade.在MemoryS 2025峰会上，江波龙推出新一代企业级内存MRDIMM（多路复用内存模块），兼容现有DDR5插槽，支持即插即用，实现性能快速升级。
Patent litigation against Biwin对佰维存储的专利诉讼
1 · 2025-06-25
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Longsys files patent infringement lawsuits against Biwin Storage, claiming damages for two invention patents.江波龙对佰维存储提起专利侵权诉讼，就两项发明专利索赔。
2025-06-25Wholly-owned subsidiary Yuan Yuzhi Technology (Shenzhen) filed two patent infringement lawsuits against Biwin Storage (佰维存储) in Nanjing Intermediate People's Court, claiming CNY 1,216,850 in total damages for infringement of two invention patents (ZL200680051271.3 and ZL201110159902.6).全资子公司元预知技术（深圳）有限公司在南京市中级人民法院对佰维存储提起两起专利侵权诉讼，索赔总额121.685万元，涉及两项发明专利（ZL200680051271.3和ZL201110159902.6）。
SOCAMM / SOCAMM2 enterprise memorySOCAMM/SOCAMM2企业级内存
8 · 2025-08-19 → 2026-06-11
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Longsys develops SOCAMM and SOCAMM2 high-performance memory modules for AI data centers, with superior bandwidth and power efficiency.江波龙开发SOCAMM/SOCAMM2高性能内存模组，面向AI数据中心，带宽和能效领先。
2025-08-19Longsys highlighted its SOCAMM enterprise memory module using LPDDR5X, achieving 128GB/s bandwidth and 20% lower latency than DDR5 RDIMM, targeting AI servers.江波龙重点介绍其采用LPDDR5X的SOCAMM企业级内存模组，带宽达128GB/s，延迟较DDR5 RDIMM降低20%，面向AI服务器。
2025-09-01Longsys successfully lit up SOCAMM, a high-performance memory module designed for AI data centers, offering several times the bandwidth of traditional RDIMM with smaller size and lower power consumption.江波龙成功点亮SOCAMM，这是一款专为AI数据中心设计的高性能内存模组，带宽可达传统RDIMM的数倍，尺寸更小、功耗更低。
2025-09-09Longsys officially launched SOCAMM2 at ODCC 2025, an enterprise memory module based on LPDDR5(x) DRAM Die, with 64-256GB per module and 8533MT/s speed, reducing area by ~70% and power by ~67.5% vs DDR5 RDIMM.江波龙在2025 ODCC大会上正式发布SOCAMM2，基于LPDDR5(x) DRAM Die的企业级内存模组，单条容量64-256GB，速率8533MT/s，面积较DDR5 RDIMM减少约70%，功耗降低约67.5%。
2025-11-03Longsys officially launched SOCAMM2 memory modules designed for AI data centers, aiming to overcome RDIMM performance and thermal bottlenecks.江波龙正式发布专为AI数据中心设计的SOCAMM2内存模块，旨在突破RDIMM的性能与散热瓶颈。
2025-12-04Longsys officially launched the SOCAMM2 product, a high-performance memory module, which has not yet generated revenue; commercialization will proceed based on customer validation and market demand.江波龙正式发布SOCAMM2产品，该高性能存储模组尚未形成收入，将根据客户验证情况和市场需求推进商业化。
2026-01-08Formally launched SOCAMM2 product (high-performance memory for AI data centers); no material revenue yet, commercialization in progress.正式发布SOCAMM2产品（面向AI数据中心的高性能内存）；尚未形成实质性收入，商业化推进中。
2026-04-24Disclosed SOCAMM2 product specs: power consumption 1/3 of standard DDR5 RDIMM, bandwidth 2.5x at same capacity, and product has been successfully powered on.披露SOCAMM2产品参数：功耗仅为标准DDR5 RDIMM的1/3，同容量下带宽提升至2.5倍，产品已成功点亮。
2026-06-11Longsys announced that its SOCAMM2 product has been successfully powered on, with internal test data showing bandwidth and power consumption significantly better than standard DDR5 RDIMM.江波龙宣布其SOCAMM2产品已成功点亮，内部测试数据显示带宽和功耗显著优于标准DDR5 RDIMM。
Customer & OEM deals (Xiaomi, BYD, telecom, cloud)客户与OEM合作（小米、比亚迪、电信、云）
2 · 2025-11-12 → 2026-01-12
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Longsys supplies storage to Xiaomi, BYD, China Telecom, Alibaba Cloud, Tencent Cloud, and other major customers.江波龙为小米、比亚迪、中国电信、阿里云、腾讯云等大客户提供存储产品。
2025-11-12Cloud service providers placed large-volume QLC SSD orders, causing demand to far exceed supply expectations; storage foundry prices remain upward.云服务商追加大容量QLC SSD订单，导致需求远超供应预期；存储原厂报价保持上涨态势。
2026-01-12UFS4.1 product with self-developed controller recognized by multiple Tier-1 customers; product qualification and adoption accelerating.搭载自研主控的UFS4.1产品获得多家Tier1大客户认可，导入工作加速推进。
A-share private placementA股定向增发
7 · 2025-12-02 → 2026-06-18
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Longsys plans a private placement of A-shares to raise up to RMB 3.7 billion for AI memory R&D and capacity expansion.江波龙计划A股定向增发，募资不超过37亿元，用于AI内存研发和产能扩张。
2025-12-02Longsys announced a private placement to raise up to RMB 3.7 billion for AI-oriented high-end memory R&D and industrialization, semiconductor storage controller chip series R&D, high-end packaging and testing construction, and working capital.江波龙公告拟定增募资不超过37亿元，用于面向AI领域的高端存储器研发及产业化、半导体存储主控芯片系列研发、半导体存储高端封测建设及补充流动资金。
2025-12-22Longsys' fourth extraordinary general meeting of shareholders in 2025 approved the resolution on the company's eligibility for a private placement of A-shares.江波龙2025年第四次临时股东会审议通过《关于公司符合向特定对象发行A股股票条件的议案》。
2026-01-09Received Shenzhen Stock Exchange acceptance notice for a private placement of up to 126 million shares, raising up to RMB 3.7 billion for AI memory R&D, controller chip R&D, advanced packaging & testing, and working capital.收到深交所受理通知，拟定向发行不超过1.26亿股，募资不超过37亿元，用于AI存储器研发、主控芯片研发、高端封测建设及补充流动资金。
2026-05-18Longsys updated its application documents for a 2025 private placement (targeted issuance of A-shares) in response to the Shenzhen Stock Exchange's review comments, covering financial data and other matters after the release of the 2025 annual report.江波龙根据深交所审核意见，对2025年度向特定对象发行股票的募集说明书等申请文件进行了补充、更新和修订。
2026-05-20Longsys' application for a private placement of A-shares (up to 126 million shares, raising up to 3.7 billion yuan) was approved by the Shenzhen Stock Exchange's listing review center. The funds are for AI-oriented high-end memory R&D, controller chip R&D, and high-end packaging/testing projects.江波龙向特定对象发行A股股票申请获深交所上市审核中心审核通过，拟发行不超过1.26亿股，募集资金不超过37亿元，用于AI高端存储器研发、主控芯片研发、高端封测建设等项目。
2026-06-12Longsys received CSRC approval (Zhengjian Xuke [2026] No. 1387) for its registered A-share private placement, valid for 12 months.江波龙收到中国证监会批复（证监许可〔2026〕1387号），同意其向特定对象发行A股股票的注册申请，有效期12个月。
2026-06-18Longsys board approved a resolution authorizing the 2025 A-share private placement issuance, moving closer to implementation.江波龙董事会审议通过关于2025年度向特定对象发行A股股票相关授权的议案，距离实施更进一步。
